Part: LM-GD53-22NAZ

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Offer Index 61

xicor,
mitsumi,
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Previous Parts:LM385BXMX-1.2,LM3914N,LM3Z3V3T1G,LM431,LM4780TA,LM6035IBPX,LM628N-8,LM6361N,LM64P762,LM741H/883,LM7815,LM79L05ACM,LMC2001AIM,LMC6464AIM,LMC662,LMC7660IM

The followings are offers provided by our member in Electronic Components Offer site about the following parts: LM-GD53-22NAZ":

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 25 07:31:00 UTC 2006LM-GD53-22NAZ (from hkin.com)125HongKong Truly Electronics Tech Co.,Ltd
Mon Sep 25 07:31:00 UTC 2006LM-GD53-22NAZ (from standard server 2)125HongKong Truly Electronics Tech Co.,Ltd
Mon Sep 25 07:31:00 UTC 2006LM-GD53-22NAZ (from parts server 2)125HongKong Truly Electronics Tech Co.,Ltd
Mon Sep 25 07:31:00 UTC 2006LM-GD53-22NAZ (from hkin.com 2)125HongKong Truly Electronics Tech Co.,Ltd
Mon Sep 25 07:31:00 UTC 2006LM-GD53-22NAZ (from hkin.com 2)125HongKong Truly Electronics Tech Co.,Ltd

Last record LMC7660IM:

Post DatePart NumberBrandD/CDescQtyCompany
Thu Sep 21 01:23:00 UTC 2006LMC7660IM (from hkin.com)1000Towering International Electronic Technogies(UK) Co.,Ltd
Wed Sep 27 07:34:00 UTC 2006LMC7660IM (from hkin.com)NS03+3000CHIU YANG ELECTRONICS TRADING LIMITED
Sun Oct 1 15:28:00 UTC 2006LMC7660IM (from hkin.com)NS05+SOP-810000ZHENGXINYUAN ELECTRONICS (HK) CO., LIMITED

Last record LMC662:

Post DatePart NumberBrandD/CDescQtyCompany
Sun Sep 10 16:06:00 UTC 2006LMC662 (from hkin.com)3500East Semiconductor International Co.,Ltd
Mon Sep 11 01:32:00 UTC 2006LMC662 (from hkin.com)3500TELTOP INT'L TRADING LTD
Fri Sep 29 13:14:00 UTC 2006LMC662AIM (from hkin.com)NSC00+721shantou star light electronics Co,Ltd
Fri Sep 22 14:43:00 UTC 2006LMC662AIM (from hkin.com)NS02+SMD860SOUROE (HK)ELECTRONICS LIMITED
Sun Oct 1 15:28:00 UTC 2006LMC662AIM (from hkin.com)NS05+SOP-810000ZHENGXINYUAN ELECTRONICS (HK) CO., LIMITED
Sun Oct 1 15:28:00 UTC 2006LMC662AIN (from hkin.com)NS05+SMD10000ZHENGXINYUAN ELECTRONICS (HK) CO., LIMITED
Fri Sep 1 06:56:00 UTC 2006LMC662CM (from hkin.com)NSO0SOP8-3.9990GOLD SHINE INTERNATIONAL ELECTRONICS LIMITED
Fri Sep 22 14:43:00 UTC 2006LMC662CM (from hkin.com)NS02+SMD860SOUROE (HK)ELECTRONICS LIMITED
Sun Oct 1 15:28:00 UTC 2006LMC662CM (from hkin.com)NS05+SMD10000ZHENGXINYUAN ELECTRONICS (HK) CO., LIMITED
Sun Oct 1 15:28:00 UTC 2006LMC662CN (from hkin.com)NS05+SMD10000ZHENGXINYUAN ELECTRONICS (HK) CO., LIMITED
Mon Sep 25 08:22:00 UTC 2006LMC662CN /AIN (from hkin.com)NS1780ACTION DYNAMIC TECH(HK) TRADING CO.

Last record LMC6464AIM:

Post DatePart NumberBrandD/CDescQtyCompany
Sun Oct 1 15:27:00 UTC 2006LMC6464AIM (from hkin.com)NS05+SOIC10000ZHENGXINYUAN ELECTRONICS (HK) CO., LIMITED

If you want to find more about LM-GD53-22NAZ, please visit us on HKin


vid:offerengine20111021

LM-GD53-22NAZ,LM-GD53-22NAZ,Comments from user about LM-GD53-22NAZ: A conventional solid-state diode will not allow significant current if it is reverse-biased below its reverse breakdown voltage. The pipelined architecture allows multiple instructions to overlap in execution, much like an assembly line. Thyristors are able to withstand very high reverse breakdown voltage and are also capable of carrying high current. This collection of simulation models is commonly called a testbench. The desire for High definition (HD) content has led the industry to develop a number of technologies, such as WirelessHD or ITU-T G. There is a gradual shift towards e-commerce web-storefronts. A different approach to improving a computer's performance is to add extra processors, as in symmetric multiprocessing designs, which have been popular in servers and workstations since the early 1990s. The other regions, and their associated terminals, are known as the emitter and the collector. Anything related to :LM-GD53-22NAZ, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: LM-GD53-22NAZ, search hkinventory: LM-GD53-22NAZ, The pipelined architecture allows multiple instructions to overlap in execution, much like an assembly line. The large number of discrete logic gates used more electrical powerXand therefore, produced more heatXthan a more integrated design with fewer ICs. The integration of a whole CPU onto a single chip or on a few chips greatly reduced the cost of processing power. Microprocessors make it possible to put a computer into thousands of items that were traditionally not computer-related. Datasheet Dir, DataSheet Archive
IEEE standard 1076. The desire for High definition (HD) content has led the industry to develop a number of technologies, such as WirelessHD or ITU-T G.0 to the IEEE for balloting for inclusion in IEEE 1076-2008. Key changes include incorporation of child standards (1164, 1076.2, 1076.3) into the main 1076 standard, an extended set of operators, more flexible syntax of case and generate statements, incorporation of VHPI (interface to C/C++ languages) and a subset of PSL (Property Specification Language). There is a gradual shift towards e-commerce web-storefronts. Current conduction in a semiconductor occurs via mobile or "free" electrons and holes, collectively known as charge carriers. Analog circuits use a continuous range of voltage as opposed to discrete levels as in digital circuits. An integrated circuit or monolithic integrated circuit (also referred to as IC, chip, and microchip) is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material.
any passive component and active component such as:Diode,Different temperature coefficients are specified for various applications, including nuclear, electrical and magnetic., followed soon after. Circuit designers will sometimes refer to this class of components as dissipative, or thermodynamically passive. The ALU performs operations such as addition, subtraction, and operations such as AND or OR. For example driver circuit
LM-GD53-22NAZ,LM-GD53-22NAZ,Comments from user about LM-GD53-22NAZ: Once a fault is detected, contacts within the circuit breaker must open to interrupt the circuit; some mechanically-stored energy (using something such as springs or compressed air) contained within the breaker is used to separate the contacts, although some of the energy required may be obtained from the fault current itself. One rarely finds modern circuits that are entirely analog. The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to precisely control the location and concentration of p- and n-type dopants. For each computer built, all of these had to be placed and soldered onto printed circuit boards, and often multiple boards would have to be interconnected in a chassis. There is a gradual shift towards e-commerce web-storefronts. Instead of processing all of a long word on one integrated circuit, multiple circuits in parallel processed subsets of each data word. IEEE standard 1076. Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage. Anything related to :LM-GD53-22NAZ, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: LM-GD53-22NAZSee also: