Part: ADC80

Index Files Offer Index 55 lambda, micronas, international rectifier, mos, nanya, mur, on semiconductor, thine, supertex

Google Search Part Numbers Previous Parts:AD7824LN,AD7892AR-3,AD7899AR-1,AD797AN,AD8061ART-REE7,AD824AR-16,AD8328ARQ,AD8591ART-REEL7,AD8801AR,AD9218BST-40,AD9240ARU,AD9288BSTZ-80,ADC0832LCN,ADC0833BCN,ADC0838CCV,ADC1175 The followings are offers provided by our member in Electronic Components Offer site about the following parts: ADC80": Post Date Part Number Brand D/C Desc Qty Company Tue Sep 19 01:50:00 UTC 2006 ADC80 (from hkin.com) AD DIP 128 Bom (HK) Internatinal Limited Tue Sep 19 01:50:00 UTC 2006 ADC80 (from standard server 2) AD DIP 128 Bom (HK) Internatinal Limited Tue Sep 19 01:50:00 UTC 2006 ADC80 (from parts server 2) AD DIP 128 Bom (HK) Internatinal Limited Tue Sep 19 01:50:00 UTC 2006 ADC80 (from hkin.com 2) AD DIP 128 Bom (HK) Internatinal Limited Tue Sep 19 01:50:00 UTC 2006 ADC80 (from hkin.com 2) AD DIP 128 Bom (HK) Internatinal Limited Thu Sep 28 09:45:00 UTC 2006 ADC80-12 (from hkin.com) BB 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Thu Sep 28 09:45:00 UTC 2006 ADC80-12 (from standard server 2) BB 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Thu Sep 28 09:45:00 UTC 2006 ADC80-12 (from parts server 2) BB 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Thu Sep 28 09:45:00 UTC 2006 ADC80-12 (from hkin.com 2) BB 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Thu Sep 28 09:45:00 UTC 2006 ADC80-12 (from hkin.com 2) BB 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Tue Sep 19 01:50:00 UTC 2006 ADC80-12 (from hkin.com) AD DIP 128 Bom (HK) Internatinal Limited Tue Sep 19 01:50:00 UTC 2006 ADC80-12 (from standard server 2) AD DIP 128 Bom (HK) Internatinal Limited Tue Sep 19 01:50:00 UTC 2006 ADC80-12 (from parts server 2) AD DIP 128 Bom (HK) Internatinal Limited Tue Sep 19 01:50:00 UTC 2006 ADC80-12 (from hkin.com 2) AD DIP 128 Bom (HK) Internatinal Limited Tue Sep 19 01:50:00 UTC 2006 ADC80-12 (from hkin.com 2) AD DIP 128 Bom (HK) Internatinal Limited Tue Sep 19 01:39:00 UTC 2006 ADC803BM (from hkin.com) BB DIP 1000 Bom (HK) Internatinal Limited Tue Sep 19 01:39:00 UTC 2006 ADC803BM (from standard server 2) BB DIP 1000 Bom (HK) Internatinal Limited Tue Sep 19 01:39:00 UTC 2006 ADC803BM (from parts server 2) BB DIP 1000 Bom (HK) Internatinal Limited Tue Sep 19 01:39:00 UTC 2006 ADC803BM (from hkin.com 2) BB DIP 1000 Bom (HK) Internatinal Limited Tue Sep 19 01:39:00 UTC 2006 ADC803BM (from hkin.com 2) BB DIP 1000 Bom (HK) Internatinal Limited Fri Sep 15 10:17:00 UTC 2006 ADC8043F (from hkin.com) AD 140 OASIS ELECTRONICS (HK) CO., LIMITED Fri Sep 15 10:17:00 UTC 2006 ADC8043F (from standard server 2) AD 140 OASIS ELECTRONICS (HK) CO., LIMITED Fri Sep 15 10:17:00 UTC 2006 ADC8043F (from parts server 2) AD 140 OASIS ELECTRONICS (HK) CO., LIMITED Fri Sep 15 10:17:00 UTC 2006 ADC8043F (from hkin.com 2) AD 140 OASIS ELECTRONICS (HK) CO., LIMITED Fri Sep 15 10:17:00 UTC 2006 ADC8043F (from hkin.com 2) AD 140 OASIS ELECTRONICS (HK) CO., LIMITED Tue Sep 19 15:35:00 UTC 2006 ADC804BH (from hkin.com) BB N/A DIP 5 SOUROE (HK)ELECTRONICS LIMITED Tue Sep 19 15:35:00 UTC 2006 ADC804BH (from standard server 2) BB N/A DIP 5 SOUROE (HK)ELECTRONICS LIMITED Tue Sep 19 15:35:00 UTC 2006 ADC804BH (from parts server 2) BB N/A DIP 5 SOUROE (HK)ELECTRONICS LIMITED Tue Sep 19 15:35:00 UTC 2006 ADC804BH (from hkin.com 2) BB N/A DIP 5 SOUROE (HK)ELECTRONICS LIMITED Tue Sep 19 15:35:00 UTC 2006 ADC804BH (from hkin.com 2) BB N/A DIP 5 SOUROE (HK)ELECTRONICS LIMITED Tue Sep 19 01:39:00 UTC 2006 ADC806BM (from hkin.com) BB DIP 1000 Bom (HK) Internatinal Limited Tue Sep 19 01:39:00 UTC 2006 ADC806BM (from standard server 2) BB DIP 1000 Bom (HK) Internatinal Limited Tue Sep 19 01:39:00 UTC 2006 ADC806BM (from parts server 2) BB DIP 1000 Bom (HK) Internatinal Limited Tue Sep 19 01:39:00 UTC 2006 ADC806BM (from hkin.com 2) BB DIP 1000 Bom (HK) Internatinal Limited Tue Sep 19 01:39:00 UTC 2006 ADC806BM (from hkin.com 2) BB DIP 1000 Bom (HK) Internatinal Limited Tue Sep 19 01:39:00 UTC 2006 ADC80AD-12 (from hkin.com) BB DIP 1000 Bom (HK) Internatinal Limited Tue Sep 19 01:39:00 UTC 2006 ADC80AD-12 (from standard server 2) BB DIP 1000 Bom (HK) Internatinal Limited Tue Sep 19 01:39:00 UTC 2006 ADC80AD-12 (from parts server 2) BB DIP 1000 Bom (HK) Internatinal Limited Tue Sep 19 01:39:00 UTC 2006 ADC80AD-12 (from hkin.com 2) BB DIP 1000 Bom (HK) Internatinal Limited Tue Sep 19 01:39:00 UTC 2006 ADC80AD-12 (from hkin.com 2) BB DIP 1000 Bom (HK) Internatinal Limited Fri Sep 15 10:17:00 UTC 2006 ADC80AG-12 (from hkin.com) 50 OASIS ELECTRONICS (HK) CO., LIMITED Fri Sep 15 10:17:00 UTC 2006 ADC80AG-12 (from standard server 2) 50 OASIS ELECTRONICS (HK) CO., LIMITED Fri Sep 15 10:17:00 UTC 2006 ADC80AG-12 (from parts server 2) 50 OASIS ELECTRONICS (HK) CO., LIMITED Fri Sep 15 10:17:00 UTC 2006 ADC80AG-12 (from hkin.com 2) 50 OASIS ELECTRONICS (HK) CO., LIMITED Fri Sep 15 10:17:00 UTC 2006 ADC80AG-12 (from hkin.com 2) 50 OASIS ELECTRONICS (HK) CO., LIMITED Thu Sep 28 09:45:00 UTC 2006 ADC80AG-12 (from hkin.com) BB 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Thu Sep 28 09:45:00 UTC 2006 ADC80AG-12 (from standard server 2) BB 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Thu Sep 28 09:45:00 UTC 2006 ADC80AG-12 (from parts server 2) BB 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Thu Sep 28 09:45:00 UTC 2006 ADC80AG-12 (from hkin.com 2) BB 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Thu Sep 28 09:45:00 UTC 2006 ADC80AG-12 (from hkin.com 2) BB 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Sat Sep 30 02:52:00 UTC 2006 ADC80AG-12 (from hkin.com) 209 ETEK (HK) ELECTRONICS INT'L CO. Sat Sep 30 02:52:00 UTC 2006 ADC80AG-12 (from standard server 2) 209 ETEK (HK) ELECTRONICS INT'L CO. Sat Sep 30 02:52:00 UTC 2006 ADC80AG-12 (from parts server 2) 209 ETEK (HK) ELECTRONICS INT'L CO. Sat Sep 30 02:52:00 UTC 2006 ADC80AG-12 (from hkin.com 2) 209 ETEK (HK) ELECTRONICS INT'L CO. Sat Sep 30 02:52:00 UTC 2006 ADC80AG-12 (from hkin.com 2) 209 ETEK (HK) ELECTRONICS INT'L CO. Mon Sep 18 05:55:00 UTC 2006 ADC80H-AH-12 (from hkin.com) BB 02+ DIP 10 Aosiwei Electronics Co.,Ltd. Mon Sep 18 05:55:00 UTC 2006 ADC80H-AH-12 (from standard server 2) BB 02+ DIP 10 Aosiwei Electronics Co.,Ltd. Mon Sep 18 05:55:00 UTC 2006 ADC80H-AH-12 (from parts server 2) BB 02+ DIP 10 Aosiwei Electronics Co.,Ltd. Mon Sep 18 05:55:00 UTC 2006 ADC80H-AH-12 (from hkin.com 2) BB 02+ DIP 10 Aosiwei Electronics Co.,Ltd. Mon Sep 18 05:55:00 UTC 2006 ADC80H-AH-12 (from hkin.com 2) BB 02+ DIP 10 Aosiwei Electronics Co.,Ltd. Thu Sep 28 09:45:00 UTC 2006 ADC80MAH-12 (from hkin.com) BB 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Thu Sep 28 09:45:00 UTC 2006 ADC80MAH-12 (from standard server 2) BB 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Thu Sep 28 09:45:00 UTC 2006 ADC80MAH-12 (from parts server 2) BB 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Thu Sep 28 09:45:00 UTC 2006 ADC80MAH-12 (from hkin.com 2) BB 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Thu Sep 28 09:45:00 UTC 2006 ADC80MAH-12 (from hkin.com 2) BB 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Fri Sep 15 10:17:00 UTC 2006 ADC80N-CB1-V/ (from hkin.com) AD 97+ DIP 925 OASIS ELECTRONICS (HK) CO., LIMITED Fri Sep 15 10:17:00 UTC 2006 ADC80N-CB1-V/ (from standard server 2) AD 97+ DIP 925 OASIS ELECTRONICS (HK) CO., LIMITED Fri Sep 15 10:17:00 UTC 2006 ADC80N-CB1-V/ (from parts server 2) AD 97+ DIP 925 OASIS ELECTRONICS (HK) CO., LIMITED Fri Sep 15 10:17:00 UTC 2006 ADC80N-CB1-V/ (from hkin.com 2) AD 97+ DIP 925 OASIS ELECTRONICS (HK) CO., LIMITED Fri Sep 15 10:17:00 UTC 2006 ADC80N-CB1-V/ (from hkin.com 2) AD 97+ DIP 925 OASIS ELECTRONICS (HK) CO., LIMITED Tue Sep 19 01:50:00 UTC 2006 ADC80Z-12 (from hkin.com) AD DIP 128 Bom (HK) Internatinal Limited Tue Sep 19 01:50:00 UTC 2006 ADC80Z-12 (from standard server 2) AD DIP 128 Bom (HK) Internatinal Limited Tue Sep 19 01:50:00 UTC 2006 ADC80Z-12 (from parts server 2) AD DIP 128 Bom (HK) Internatinal Limited Tue Sep 19 01:50:00 UTC 2006 ADC80Z-12 (from hkin.com 2) AD DIP 128 Bom (HK) Internatinal Limited Tue Sep 19 01:50:00 UTC 2006 ADC80Z-12 (from hkin.com 2) AD DIP 128 Bom (HK) Internatinal Limited Last record ADC1175: Post Date Part Number Brand D/C Desc Qty Company Fri Sep 8 07:53:00 UTC 2006 ADC1175 (from hkin.com) NS 03+ 49 HONGKONG BOTER ELECTRONICS COMPANY Thu Sep 7 04:52:00 UTC 2006 ADC1175 (from hkin.com) NS 03+ TSOP24 49 JINDONG ELECTRONIC TECHNOLOGY (HK) INTERNATIONAL TRADE CO Sun Oct 1 15:19:00 UTC 2006 ADC1175-50CIJM (from hkin.com) NS 05+ SOP 10000 ZHENGXINYUAN ELECTRONICS (HK) CO., LIMITED Fri Sep 8 07:53:00 UTC 2006 ADC1175-50CIMT (from hkin.com) NS 02+/03+ 295 HONGKONG BOTER ELECTRONICS COMPANY Thu Sep 7 04:52:00 UTC 2006 ADC1175-50CIMT (from hkin.com) NS 02+/03+ TSOP24 295 JINDONG ELECTRONIC TECHNOLOGY (HK) INTERNATIONAL TRADE CO Sun Oct 1 15:19:00 UTC 2006 ADC1175-50CIMT (from hkin.com) NS 05+ SOP 10000 ZHENGXINYUAN ELECTRONICS (HK) CO., LIMITED Fri Sep 29 09:26:00 UTC 2006 ADC1175-50CJMT (from hkin.com) NS 05+ NEW 1000 YING BO ELECTRONICS HONGKONG CO.,LIMITED Sun Oct 1 15:19:00 UTC 2006 ADC1175CIJM (from hkin.com) NS 05+ SOP 10000 ZHENGXINYUAN ELECTRONICS (HK) CO., LIMITED Last record ADC0838CCV: Post Date Part Number Brand D/C Desc Qty Company Tue Sep 19 15:35:00 UTC 2006 ADC0838CCV (from hkin.com) NS N/A PLCC 500 SOUROE (HK)ELECTRONICS LIMITED Sun Oct 1 15:19:00 UTC 2006 ADC0838CCV (from hkin.com) NS 05+ SMD 10000 ZHENGXINYUAN ELECTRONICS (HK) CO., LIMITED Last record ADC0833BCN: Post Date Part Number Brand D/C Desc Qty Company Fri Sep 29 01:40:00 UTC 2006 ADC0833BCN (from hkin.com) NS DIP 500 ARCBASE ELECTRONICS CO., LIMITED If you want to find more about ADC80, please visit us on HKin vid:offerengine20111021 ADC80,ADC80,Comments from user about ADC80: Produced at Fairchild Semiconductor, it was made of silicon, whereas Kilby's chip was made of germanium. Light-emitting diodes are used in applications as diverse as replacements for aviation lighting, automotive lighting (particularly brake lamps, turn signals and indicators) as well as in traffic signals. However, remember that the internal output impedance of operational amplifiers, if used, may rise markedly at high frequencies and reduce the attenuation from that expected. An electric field can increase the number of free electrons and holes in a semiconductor, thereby changing its conductivity. With the transition to the LGA1366 and LGA1156 socket and the Intel i7 and i5 chips, quad core is now considered mainstream, but with the release of the i7-980x, six core processors are now well within reach.Solid-state electronics are those circuits or devices built entirely from solid materials and in which the electrons, or other charge carriers, are confined entirely within the solid material.1 (known as VHDL-AMS) provided analog and mixed-signal circuit design extensions. Not all constructs in VHDL are suitable for synthesis. Anything related to :ADC80, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: ADC80, search hkinventory: ADC80, Semiconductor devices are manufactured both as single discrete devices and as integrated circuits (ICs), which consist of a numberfrom a few (as low as two) to billionsof devices manufactured and interconnected on a single semiconductor substrate. Because the cores are physically very close to each other, they can communicate with each other much faster than separate processors in a multiprocessor system, which improves overall system performance. The junctions which form where n-type and p-type semiconductors join together are called p-n junctions.0 of VHDL-2006. Datasheet Dir, DataSheet Archive 1 (known as VHDL-AMS) provided analog and mixed-signal circuit design extensions. Microprocessors make it possible to put a computer into thousands of items that were traditionally not computer-related. Compared to the MOSFET, the operating frequency of the IGBT is relatively low (few devices are rated over 50 kHz), mainly because of a so-called 'current-tail' problem during turn-off. Branch prediction is where the hardware makes educated guesses on whether a particular branch will be taken. With the vertical structure, the current rating of the device is proportional to its area, and the voltage blocking capability is achieved in the height of the die. The field may be applied by a reverse-biased p-n junction, forming a junction field effect transistor, or JFET; or by an electrode isolated from the bulk material by an oxide layer, forming a metal-oxide-semiconductor field effect transistor, or MOSFET. A microprocessor is a general purpose system. They are commonly used in speaker crossover design (due to the moderately large voltages and currents, and the lack of easy access to power), filters in power distribution networks (due to the large voltages and currents), power supply bypassing (due to low cost, and in some cases, power requirements), as well as a variety of discrete and home brew circuits (for low-cost and simplicity). any passive component and active component such as:Diode, The junctions which form where n-type and p-type semiconductors join together are called p-n junctions. Techniques such as branch prediction and speculative execution are used to lessen these branch penalties. However, its excellent performance in low voltage make it the device of choice (actually the only choice) for applications below 200 V. Unlike what happened when IA-32 was extended to x86-64, no new general purpose registers were added in 64-bit PowerPC, so any performance gained when using the 64-bit mode for applications making no use of the larger address space is minimal. For example driver circuit ADC80,ADC80,Comments from user about ADC80: The second region, at reverse biases more positive than the PIV, has only a very small reverse saturation current. Some other standards support wider use of VHDL, notably VITAL (VHDL Initiative Towards ASIC Libraries) and microwave circuit design extensions. Used without qualifier, the term passive is ambiguous. In addition to IEEE standard 1164, several child standards were introduced to extend functionality of the language.[3] Each microarchitectural element is in turn represented by a schematic describing the interconnections of logic gates used to implement it. By paralleling several devices, it is possible to increase the current rating of a switch. Semiconductor devices are electronic components that exploit the electronic properties of semiconductor materials, principally silicon, germanium, and gallium arsenide, as well as organic semiconductors. The bipolar junction transistor, or BJT, was the most commonly used transistor in the 1960s and 70s. Anything related to :ADC80, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: ADC80See also: Capacitor Transistor Diode