Part: SN74LS10N

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Previous Parts:SN74AHCIG32DCKR,SN74AHCT1G00DCKR,SN74AHCT1G14DBVR,SN74ALS32DBR,SN74ALVCH162827GR,SN74ALVT,SN74AS374DWR,SN74F259J,SN74F38J,SN74HC08,SN74HC175J,SN74HC196J,SN74HC33J,SN74HC471J,SN74HC92J,SN74LS07N

The followings are offers provided by our member in Electronic Components Offer site about the following parts: SN74LS10N":

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 5 08:17:00 UTC 2006SN74LS10N (from hkin.com)DIP25HongKong KeWeiDa Electronics Co.,Ltd
Tue Sep 5 08:17:00 UTC 2006SN74LS10N (from standard server 2)DIP25HongKong KeWeiDa Electronics Co.,Ltd
Tue Sep 5 08:17:00 UTC 2006SN74LS10N (from parts server 2)DIP25HongKong KeWeiDa Electronics Co.,Ltd
Tue Sep 5 08:17:00 UTC 2006SN74LS10N (from hkin.com 2)DIP25HongKong KeWeiDa Electronics Co.,Ltd
Tue Sep 5 08:17:00 UTC 2006SN74LS10N (from hkin.com 2)DIP25HongKong KeWeiDa Electronics Co.,Ltd
Fri Sep 22 06:52:00 UTC 2006SN74LS10N (from hkin.com)TI20041245Wing Shing Computer Components Co., (H.K.) Ltd
Fri Sep 22 06:52:00 UTC 2006SN74LS10N (from standard server 2)TI20041245Wing Shing Computer Components Co., (H.K.) Ltd
Fri Sep 22 06:52:00 UTC 2006SN74LS10N (from parts server 2)TI20041245Wing Shing Computer Components Co., (H.K.) Ltd
Fri Sep 22 06:52:00 UTC 2006SN74LS10N (from hkin.com 2)TI20041245Wing Shing Computer Components Co., (H.K.) Ltd
Fri Sep 22 06:52:00 UTC 2006SN74LS10N (from hkin.com 2)TI20041245Wing Shing Computer Components Co., (H.K.) Ltd

Last record SN74LS07N:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 18 08:49:00 UTC 2006SN74LS07N (from hkin.com)TEXAS99+/00+DIP2500KAM MING TIK (HK) ELECTRON CO.
Thu Sep 28 13:58:00 UTC 2006SN74LS07N (from hkin.com)TI30000SHENZHEN SOUNET ELECTRONIC TECHNOLOGIES CO.,LTD
Fri Sep 1 13:30:00 UTC 2006SN74LS07NSR (from hkin.com)00+1700SINCO(shenzhen)Electronics Co
Mon Sep 18 08:54:00 UTC 2006SN74LS07NSR (from hkin.com)TI03+SOP5.22500KAM MING TIK (HK) ELECTRON CO.

Last record SN74HC92J:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Sep 27 06:04:00 UTC 2006SN74HC92J (from hkin.com)TI02+DIP295Shenzhen HangtianLong Electronics Technology Co.,Ltd

Last record SN74HC471J:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Sep 6 05:19:00 UTC 2006SN74HC471J (from hkin.com)TI02+DIP467Shenzhen HangtianLong Electronics Technology Co.,Ltd

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vid:offerengine20111021

SN74LS10N,SN74LS10N,Comments from user about SN74LS10N: Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage. As microprocessor designs get faster, the cost of manufacturing a chip (with smaller components built on a semiconductor chip the same size) generally stays the same. For high-pass and low-pass (as well as band-pass filters far from the center frequency), the required rejection may determine the slope of attenuation needed, and thus the "order" of the filter. The complexity of an integrated circuit is bounded by physical limitations of the number of transistors that can be put onto one chip, the number of package terminations that can connect the processor to other parts of the system, the number of interconnections it is possible to make on the chip, and the heat that the chip can dissipate. Common-emitter amplifiers are also used in radio frequency circuits, for example to amplify faint signals received by an antenna.0 and includes enhanced generic types. However, many formational and functional block parameters can be tuned (capacity parameters, memory size, element base, block composition and interconnection structure).Solid-state electronics are those circuits or devices built entirely from solid materials and in which the electrons, or other charge carriers, are confined entirely within the solid material. Anything related to :SN74LS10N, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: SN74LS10N, search hkinventory: SN74LS10N, When the reverse bias breakdown voltage is exceeded, a conventional diode is subject to high current due to avalanche breakdown. System-level design decisions such as whether or not to include peripherals, such as memory controllers, can be considered part of the microarchitectural design process. Under this methodology, voltage and current sources are considered active, while resistors, transistors, tunnel diodes, glow tubes, capacitors, metamaterials and other dissipative and energy-neutral components are considered passive. The IGBT is a recent component, so its performance improves regularly as technology evolves. Datasheet Dir, DataSheet Archive
The ISA includes the execution model, processor registers, address and data formats among other things. With this structure, one of the connections of the device is located on the bottom of the semiconductor die. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. In electronics, a common-emitter amplifier is one of three basic single-stage bipolar-junction-transistor (BJT) amplifier topologies, typically used as a voltage amplifier. Flip-flops and latches are used as data storage elements. VHDL project is portable. For high-pass and low-pass (as well as band-pass filters far from the center frequency), the required rejection may determine the slope of attenuation needed, and thus the "order" of the filter. The first commercial RISC microprocessor design was released either by MIPS Computer Systems, the 32-bit R2000 (the R1000 was not released) or by Acorn computers, the 32-bit ARM2 in 1987.
any passive component and active component such as:Diode, Increasingly these products have become based on digital technologies, and have largely merged with the computer industry in what is increasingly referred to as the consumerization of information technology. Current conduction in a semiconductor occurs via mobile or "free" electrons and holes, collectively known as charge carriers. Input and output impedance requirements. Although several companies each produce over a billion individually packaged (known as discrete) transistors every year, the vast majority of transistors now produced are in integrated circuits (often shortened to IC, microchips or simply chips), along with diodes, resistors, capacitors and other electronic components, to produce complete electronic circuits. For example driver circuit
SN74LS10N,SN74LS10N,Comments from user about SN74LS10N: VHDL project is multipurpose. Desirable properties of MOSFETs, such as their utility in low-power devices, usually in the CMOS configuration, allowed them to capture nearly all market share for digital circuits; more recently MOSFETs have captured most analog and power applications as well, including modern clocked analog circuits, voltage regulators, amplifiers, power transmitters, motor drivers, etc. Bipolar junction transistors are formed from two p-n junctions, in either n-p-n or p-n-p configuration.[3] Some of these stages include instruction fetch, instruction decode, execute, and write back. Even after MOSFETs became widely available, the BJT remained the transistor of choice for many analog circuits such as simple amplifiers because of their greater linearity and ease of manufacture. The circuit can be made to change state by signals applied to one or more control inputs and will have one or two outputs. Introduced as a practical electronic component in 1962, early LEDs emitted low-intensity red light, but modern versions are available across the visible, ultraviolet and infrared wavelengths, with very high brightness. The move to 64 bits by PowerPC processors had been intended since the processors' design in the early 90s and was not a major cause of incompatibility. Anything related to :SN74LS10N, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: SN74LS10NSee also: