Part: SN74S17J

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Previous Parts:SN74GTL1655DGGR,SN74HC123J,SN74HC244D,SN74HC244J,SN74HC257J,SN74HC38J,SN74HC4040DB,SN74LS123,SN74LS123J,SN74LS157NS,SN74LS165AN,SN74LS221N,SN74LS74A,SN74LV138APW,SN74LV74APWR,SN74LVC1G00YEAR

The followings are offers provided by our member in Electronic Components Offer site about the following parts: SN74S17J":

Post DatePart NumberBrandD/CDescQtyCompany
Wed Sep 27 06:15:00 UTC 2006SN74S17J (from hkin.com)TI02+DIP295Shenzhen HangtianLong Electronics Technology Co.,Ltd
Wed Sep 27 06:15:00 UTC 2006SN74S17J (from standard server 2)TI02+DIP295Shenzhen HangtianLong Electronics Technology Co.,Ltd
Wed Sep 27 06:15:00 UTC 2006SN74S17J (from parts server 2)TI02+DIP295Shenzhen HangtianLong Electronics Technology Co.,Ltd
Wed Sep 27 06:15:00 UTC 2006SN74S17J (from hkin.com 2)TI02+DIP295Shenzhen HangtianLong Electronics Technology Co.,Ltd
Wed Sep 27 06:15:00 UTC 2006SN74S17J (from hkin.com 2)TI02+DIP295Shenzhen HangtianLong Electronics Technology Co.,Ltd

Last record SN74LVC1G00YEAR:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 26 02:21:00 UTC 2006SN74LVC1G00YEAR (from hkin.com)TEXAS200218000AOHUADA TECHNOLOGICAL (HONGKONG) LIMITED

Last record SN74LV74APWR:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Sep 29 06:14:00 UTC 2006SN74LV74APWR (from hkin.com)TI00TSSOP2000REIZ TECHNOLOGY (HK) LIMITED

Last record SN74LV138APW:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Sep 15 01:21:00 UTC 2006SN74LV138APW (from hkin.com)TI0110+TSSOP500ShenZhen Union Components
Tue Sep 19 01:29:00 UTC 2006SN74LV138APW (from hkin.com)TI0110+TSSOP500ShenZhen Union Components
Thu Sep 28 11:23:00 UTC 2006SN74LV138APW (from hkin.com)TI0110+TSSOP500ShenZhen Union Components
Fri Sep 29 09:40:00 UTC 2006SN74LV138APW (from hkin.com)TI0110+TSSOP500ShenZhen Union Components
Wed Sep 27 12:50:00 UTC 2006SN74LV138APWR (from hkin.com)TI06+TSOP6000Andes Trading Company
Sat Sep 30 03:45:00 UTC 2006SN74LV138APWR (from hkin.com)TI/BB05+NIL6000SHENZHEN LIXIN INDUSTRIAI CO.LTD.
Sat Sep 30 09:36:00 UTC 2006SN74LV138APWR (from hkin.com)TI003+SMD5000ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Sat Sep 30 12:57:00 UTC 2006SN74LV138APWR (from hkin.com)TI003+5000ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED

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SN74S17J,SN74S17J,Comments from user about SN74S17J: Heat generated by electronic circuitry must be dissipated to prevent immediate failure and improve long term reliability. An LED is often small in area (less than 1 mm2), and integrated optical components may be used to shape its radiation pattern. Circuit designers will sometimes refer to this class of components as dissipative, or thermodynamically passive. Because the cores are physically very close to each other, they can communicate with each other much faster than separate processors in a multiprocessor system, which improves overall system performance. Its basic function is to detect a fault condition and, by interrupting continuity, to immediately discontinue electrical flow. Compared to the MOSFET, the operating frequency of the IGBT is relatively low (few devices are rated over 50 kHz), mainly because of a so-called 'current-tail' problem during turn-off. Most of them should not be used in linear operation. Because the cores are physically very close to each other, they can communicate with each other much faster than separate processors in a multiprocessor system, which improves overall system performance. Anything related to :SN74S17J, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: SN74S17J, search hkinventory: SN74S17J, Execution units include arithmetic logic units (ALU), floating point units (FPU), load/store units, branch prediction, and SIMD. Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage. For each computer built, all of these had to be placed and soldered onto printed circuit boards, and often multiple boards would have to be interconnected in a chassis. Performance is high because the components switch quickly and consume little power (compared to their discrete counterparts) as a result of the small size and close proximity of the components. Datasheet Dir, DataSheet Archive
0 and includes enhanced generic types. On average, every fifth instruction executed is a branch, so without any intervention, that's a high amount of stalling. With operating systems Windows XP x64, Windows Vista x64, Windows 7 x64, Linux, BSD and Mac OS X that run 64-bit native, the software is also geared to fully utilize the capabilities of such processors. However, most designers leave this job to the simulator. While consumer electronics continues in its trend of convergence, combining elements of many products, consumers face different decisions when purchasing. Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. Some architectures include other stages such as memory access. The first commercial RISC microprocessor design was released either by MIPS Computer Systems, the 32-bit R2000 (the R1000 was not released) or by Acorn computers, the 32-bit ARM2 in 1987.
any passive component and active component such as:Diode, Desirable properties of MOSFETs, such as their utility in low-power devices, usually in the CMOS configuration, allowed them to capture nearly all market share for digital circuits; more recently MOSFETs have captured most analog and power applications as well, including modern clocked analog circuits, voltage regulators, amplifiers, power transmitters, motor drivers, etc. The power MOSFET has the advantages of the majority carrier devices, so it can achieve very high operating frequency, but can't be used with high voltages. The internal arrangement of a microprocessor varies depending on the age of the design and the intended purposes of the processor. However, many formational and functional block parameters can be tuned (capacity parameters, memory size, element base, block composition and interconnection structure). For example driver circuit
SN74S17J,SN74S17J,Comments from user about SN74S17J: The gate electrode is charged to produce an electric field that controls the conductivity of a "channel" between two terminals, called the source and drain. The net result is that the turn-off switching loss of an IGBT is considerably higher than its turn-on loss. These techniques use convection, conduction, & radiation of heat energy. High-end Intel Xeon processors that are on the LGA771 socket are DP (dual processor) capable, as well as the Intel Core 2 Extreme QX9775 also used in the Mac Pro by Apple and the Intel Skulltrail motherboard. The compact size, the possibility of narrow bandwidth, switching speed, and extreme reliability of LEDs has allowed new text and video displays and sensors to be developed, while their high switching rates are also useful in advanced communications technology. Capacitors are widely used in electronic circuits for blocking direct current while allowing alternating current to pass, in filter networks, for smoothing the output of power supplies, in the resonant circuits that tune radios to particular frequencies and for many other purposes. Increasingly these products have become based on digital technologies, and have largely merged with the computer industry in what is increasingly referred to as the consumerization of information technology. Depending on the type of carrier in the channel, the device may be an n-channel (for electrons) or a p-channel (for holes) MOSFET. Anything related to :SN74S17J, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: SN74S17JSee also: