Part: M38227ECFP

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Offer Index 49

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Previous Parts:M093B1,M12L6416A-77,M1541A1,M22100B1,M27C010-12F1,M27C160-50F1,M27C2001-70KF1,M27C512-90F1,M29W400BB-90N6,M3054D12ES,M30624MGN-057GP,M32L32321DA-7Q,M3307-A1E,M34238MK-269GP,M34570M4-214FP,M35055-052FP

The followings are offers provided by our member in Electronic Components Offer site about the following parts: M38227ECFP":

Post DatePart NumberBrandD/CDescQtyCompany
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from hkin.com)MIT02+QFP390Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from standard server 2)MIT02+QFP390Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from parts server 2)MIT02+QFP390Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from hkin.com 2)MIT02+QFP390Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from hkin.com 2)MIT02+QFP390Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from hkin.com)QFP02+483Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from standard server 2)QFP02+483Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from parts server 2)QFP02+483Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from hkin.com 2)QFP02+483Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from hkin.com 2)QFP02+483Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from hkin.com)MIT02+QFP495Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from standard server 2)MIT02+QFP495Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from parts server 2)MIT02+QFP495Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from hkin.com 2)MIT02+QFP495Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from hkin.com 2)MIT02+QFP495Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from hkin.com)MIT02+495Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from standard server 2)MIT02+495Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from parts server 2)MIT02+495Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from hkin.com 2)MIT02+495Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from hkin.com 2)MIT02+495Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from hkin.com)MIT2002QFP495Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from standard server 2)MIT2002QFP495Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from parts server 2)MIT2002QFP495Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from hkin.com 2)MIT2002QFP495Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006M38227ECFP (from hkin.com 2)MIT2002QFP495Shen Zhen OML Technology Co.,Ltd
Fri Sep 1 07:23:00 UTC 2006M38227ECFP (from hkin.com)Mitsubishi0236Future Net International Co., Ltd( Shanghai)
Fri Sep 1 07:23:00 UTC 2006M38227ECFP (from standard server 2)Mitsubishi0236Future Net International Co., Ltd( Shanghai)
Fri Sep 1 07:23:00 UTC 2006M38227ECFP (from parts server 2)Mitsubishi0236Future Net International Co., Ltd( Shanghai)
Fri Sep 1 07:23:00 UTC 2006M38227ECFP (from hkin.com 2)Mitsubishi0236Future Net International Co., Ltd( Shanghai)
Fri Sep 1 07:23:00 UTC 2006M38227ECFP (from hkin.com 2)Mitsubishi0236Future Net International Co., Ltd( Shanghai)

Last record M35055-052FP:

Post DatePart NumberBrandD/CDescQtyCompany
Thu Sep 28 02:41:00 UTC 2006M35055-052FP (from hkin.com)Renesas06+6000HONGKONG FEILONG INDUSTRY INTERNATIONAL LIMITED
Sat Sep 30 01:49:00 UTC 2006M35055-052FP (from hkin.com)RENESAS06+SOP2000Shen Zhen OML Technology Co.,Ltd

Last record M34570M4-214FP:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 26 02:29:00 UTC 2006M34570M4-214FP (from hkin.com)0251+48000AOHUADA TECHNOLOGICAL (HONGKONG) LIMITED

Last record M34238MK-269GP:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 5 05:54:00 UTC 2006M34238MK-269GP (from hkin.com)MIT02+SOP2684SHUN ZHAN (HONGKONG) ELECTRONICS CO., LIMITED

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M38227ECFP,M38227ECFP,Comments from user about M38227ECFP: Semiconductor devices are manufactured both as single discrete devices and as integrated circuits (ICs), which consist of a numberfrom a few (as low as two) to billionsof devices manufactured and interconnected on a single semiconductor substrate. Several specialized processing devices have followed from the technology. With the transition to the LGA1366 and LGA1156 socket and the Intel i7 and i5 chips, quad core is now considered mainstream, but with the release of the i7-980x, six core processors are now well within reach. When a doped semiconductor contains excess holes it is called "p-type", and when it contains excess free electrons it is known as "n-type", where p (positive for holes) or n (negative for electrons) is the sign of the charge of the majority mobile charge carriers. Several specialized processing devices have followed from the technology. Actually, all power semiconductors rely on a PIN diode structure to sustain voltage.[specify] Minor changes in the standard (2000 and 2002) added the idea of protected types (similar to the concept of class in C++) and removed some restrictions from port mapping rules. A light-emitting diode (LED) is a semiconductor light source. Anything related to :M38227ECFP, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: M38227ECFP, search hkinventory: M38227ECFP, There is a gradual shift towards e-commerce web-storefronts. The Niagara 2 supports more threads and operates at 1. This problem is caused by the slow decay of the conduction current during turn-off resulting from slow recombination of large number of carriers, which flood the thick 'drift' region of the IGBT during conduction. Similarly, an overdriven transistor amplifier can take on the characteristics of a controlled switch having essentially two levels of output. Datasheet Dir, DataSheet Archive
These days analog circuitry may use digital or even microprocessor techniques to improve performance. Semiconductor conductivity can be controlled by introduction of an electric or magnetic field, by exposure to light or heat, or by mechanical deformation of a doped monocrystalline grid; thus, semiconductors can make excellent sensors. IEEE standard 1076. For example, an engine control system in an automobile can adjust ignition timing based on engine speed, load on the engine, ambient temperature, and any observed tendency for knocking - allowing an automobile to operate on a range of fuel grades.The second region, at reverse biases more positive than the PIV, has only a very small reverse saturation current. The capacitance is greatest when there is a narrow separation between large areas of conductor, hence capacitor conductors are often called "plates," referring to an early means of construction. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. Sun Microsystems has released the Niagara and Niagara 2 chips, both of which feature an eight-core design.
any passive component and active component such as:Diode, The move to 64 bits by PowerPC processors had been intended since the processors' design in the early 90s and was not a major cause of incompatibility. Basically, an IGBT is a bipolar transistor driven by a power MOSFET: it has the advantages of being a minority carrier device (good performance in on-state, even for high voltage devices), with the high input impedance of a MOSFET (it can be driven on or off with a very low amount of power). Continued increases in microprocessor capacity have rendered other forms of computers almost completely obsolete (see history of computing hardware), with one or more microprocessors used in everything from the smallest embedded systems and handheld devices to the largest mainframes and supercomputers. Basically, an IGBT is a bipolar transistor driven by a power MOSFET: it has the advantages of being a minority carrier device (good performance in on-state, even for high voltage devices), with the high input impedance of a MOSFET (it can be driven on or off with a very low amount of power). For example driver circuit
M38227ECFP,M38227ECFP,Comments from user about M38227ECFP: The thyristor appeared in 1957. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using electronic components. RISC microprocessors were initially used in special-purpose machines and Unix workstations, but then gained wide acceptance in other roles. The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to precisely control the location and concentration of p- and n-type dopants. With operating systems Windows XP x64, Windows Vista x64, Windows 7 x64, Linux, BSD and Mac OS X that run 64-bit native, the software is also geared to fully utilize the capabilities of such processors. Execution units include arithmetic logic units (ALU), floating point units (FPU), load/store units, branch prediction, and SIMD. Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage. While 64-bit microprocessor designs have been in use in several markets since the early 1990s, the early 2000s saw the introduction of 64-bit microprocessors targeted at the PC market. Anything related to :M38227ECFP, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: M38227ECFPSee also: