Part: EP2A25F672C7

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Previous Parts:EC-M212-054,ECRJA010A11X,ECRKN006A61W,ECRLA010A53R,EDR1000/2000,EECS050045,EEFCD1C8R2R,EL2210CS,EL5225IRZ,EL5324IREZ,EL5396ACS,ElanSC520-100AC,EM78P4515AQS,EMZ6.8N,EP1K50FC256-3Q,EP20K200EFC484-1

The followings are offers provided by our member in Electronic Components Offer site about the following parts: EP2A25F672C7":

Post DatePart NumberBrandD/CDescQtyCompany
Sat Sep 30 02:06:00 UTC 2006EP2A25F672C7 (from hkin.com)ALTERA12DONG YI(INTERNATIONAL) ELECTRONICS CO.LTD
Sat Sep 30 02:06:00 UTC 2006EP2A25F672C7 (from standard server 2)ALTERA12DONG YI(INTERNATIONAL) ELECTRONICS CO.LTD
Sat Sep 30 02:06:00 UTC 2006EP2A25F672C7 (from parts server 2)ALTERA12DONG YI(INTERNATIONAL) ELECTRONICS CO.LTD
Sat Sep 30 02:06:00 UTC 2006EP2A25F672C7 (from hkin.com 2)ALTERA12DONG YI(INTERNATIONAL) ELECTRONICS CO.LTD
Sat Sep 30 02:06:00 UTC 2006EP2A25F672C7 (from hkin.com 2)ALTERA12DONG YI(INTERNATIONAL) ELECTRONICS CO.LTD

Last record EP20K200EFC484-1:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Sep 29 06:58:00 UTC 2006EP20K200EFC484-1 (from hkin.com)BGAALTERA134JET LEE TAT (HK) ELECTRONICS CO.
Thu Sep 7 03:28:00 UTC 2006EP20K200EFC484-1 (from hkin.com)EPM17ForLida International Limited

Last record EP1K50FC256-3Q:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Sep 27 12:49:00 UTC 2006EP1K50FC256-3Q (from hkin.com)ALTERA99\02BGA100ANWELL COMPONENTS CO.

Last record EMZ6.8N:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Sep 20 11:22:00 UTC 2006EMZ6.8N (from hkin.com)ROHMSOT-52339000BEST (HK) ELECTRONICS LIMITED
Wed Sep 20 11:22:00 UTC 2006EMZ6.8N TL (from hkin.com)ROHMSOT-5233000BEST (HK) ELECTRONICS LIMITED
Mon Sep 25 09:22:00 UTC 2006EMZ6.8NFTL (from hkin.com)TOSHIBA03+PB-FREESOT423-6C96000HONGKONG IN FORTUNE ELECTRONICS CO. LIMITED
Mon Sep 25 09:22:00 UTC 2006EMZ6.8NTR (from hkin.com)ROHM04+SOT423-6.8V-6C3000HONGKONG IN FORTUNE ELECTRONICS CO. LIMITED

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vid:offerengine20111021

EP2A25F672C7,EP2A25F672C7,Comments from user about EP2A25F672C7: With this structure, one of the connections of the device is located on the bottom of the semiconductor die. For example, most constructs that explicitly deal with timing such as wait for 10 ns; are not synthesizable despite being valid for simulation. With this structure, one of the connections of the device is located on the bottom of the semiconductor die. Advancing technology makes more complex and powerful chips feasible to manufacture. As integrated circuit technology advanced, it was feasible to manufacture more and more complex processors on a single chip. This creates a much larger current between the collector and emitter, controlled by the base-emitter current. Another benefit is that VHDL allows the description of a concurrent system. The microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. Anything related to :EP2A25F672C7, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: EP2A25F672C7, search hkinventory: EP2A25F672C7, This is the ratio of the electric charge on each conductor to the potential difference between them. A simulation program is used to test the logic design using simulation models to represent the logic circuits that interface to the design. There is a gradual shift towards e-commerce web-storefronts. Compared to the MOSFET, the operating frequency of the IGBT is relatively low (few devices are rated over 50 kHz), mainly because of a so-called 'current-tail' problem during turn-off. Datasheet Dir, DataSheet Archive
The net result is that the turn-off switching loss of an IGBT is considerably higher than its turn-on loss. Occasionally the physical limitations of integrated circuits made such practices as a bit slice approach necessary. As of 2007, two 64-bit RISC architectures are still produced in volume for non-embedded applications: SPARC and Power ISA. The microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. As it is a physical limit, no improvement is expected from silicon MOSFETs concerning their maximum voltage ratings. Power semiconductor devices first appeared in 1952 with the introduction of the power diode by R. Integration of the floating point unit first as a separate integrated circuit and then as part of the same microprocessor chip, speeded up floating point calculations. Microcontrollers integrate a microprocessor with periphal devices for control of embedded system.
any passive component and active component such as:Diode, IEEE 1076. Microprocessors make it possible to put a computer into thousands of items that were traditionally not computer-related. The MOSFET is the most used semiconductor device today. A circuit breaker is an automatically operated electrical switch designed to protect an electrical circuit from damage caused by overload or short circuit. For example driver circuit
EP2A25F672C7,EP2A25F672C7,Comments from user about EP2A25F672C7: Increasingly these products have become based on digital technologies, and have largely merged with the computer industry in what is increasingly referred to as the consumerization of information technology. Under this methodology, voltage and current sources are considered active, while resistors, transistors, tunnel diodes, glow tubes, capacitors, metamaterials and other dissipative and energy-neutral components are considered passive. These limit the circuit topologies available; for example, most, but not all active filter topologies provide a buffered (low impedance) output. The integrated circuit's mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. New microarchitectures and/or circuitry solutions, along with advances in semiconductor manufacturing, are what allows newer generations of processors to achieve higher performance while using the same ISA. An LED is often small in area (less than 1 mm2), and integrated optical components may be used to shape its radiation pattern. Desirable properties of MOSFETs, such as their utility in low-power devices, usually in the CMOS configuration, allowed them to capture nearly all market share for digital circuits; more recently MOSFETs have captured most analog and power applications as well, including modern clocked analog circuits, voltage regulators, amplifiers, power transmitters, motor drivers, etc. In principle, a single microarchitecture could execute several different ISAs with only minor changes to the microcode. Anything related to :EP2A25F672C7, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: EP2A25F672C7See also: