Part: M48Z512AY-70PM9

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Previous Parts:LXT385LE,LZ24535,LZ9FE18,M109A,M12L16161A-7T,M24C32,M27C1001-12F6,M27C64A-25F1,M28W160CT70ZB6,M29F200BB-70N6,M29F800DB70M1,M29W160ET-70N1,M29W320DB70N6,M29W400BB70N1,M35060-002SP,M452

The followings are offers provided by our member in Electronic Components Offer site about the following parts: M48Z512AY-70PM9":

Post DatePart NumberBrandD/CDescQtyCompany
Mon Oct 2 04:10:00 UTC 2006M48Z512AY-70PM9 (from hkin.com)STM04+05+DIP1320GEJIA INT‘L (HK) LIMITED
Mon Oct 2 04:10:00 UTC 2006M48Z512AY-70PM9 (from standard server 2)STM04+05+DIP1320GEJIA INT‘L (HK) LIMITED
Mon Oct 2 04:10:00 UTC 2006M48Z512AY-70PM9 (from parts server 2)STM04+05+DIP1320GEJIA INT‘L (HK) LIMITED
Mon Oct 2 04:10:00 UTC 2006M48Z512AY-70PM9 (from hkin.com 2)STM04+05+DIP1320GEJIA INT‘L (HK) LIMITED
Mon Oct 2 04:10:00 UTC 2006M48Z512AY-70PM9 (from hkin.com 2)STM04+05+DIP1320GEJIA INT‘L (HK) LIMITED
Mon Oct 2 07:13:00 UTC 2006M48Z512AY-70PM9 (from hkin.com)STM04+DIP685KAU CHONG (INT'L) ELECTRONICS CO.
Mon Oct 2 07:13:00 UTC 2006M48Z512AY-70PM9 (from standard server 2)STM04+DIP685KAU CHONG (INT'L) ELECTRONICS CO.
Mon Oct 2 07:13:00 UTC 2006M48Z512AY-70PM9 (from parts server 2)STM04+DIP685KAU CHONG (INT'L) ELECTRONICS CO.
Mon Oct 2 07:13:00 UTC 2006M48Z512AY-70PM9 (from hkin.com 2)STM04+DIP685KAU CHONG (INT'L) ELECTRONICS CO.
Mon Oct 2 07:13:00 UTC 2006M48Z512AY-70PM9 (from hkin.com 2)STM04+DIP685KAU CHONG (INT'L) ELECTRONICS CO.

Last record M452:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Sep 27 01:52:00 UTC 2006M452 (from hkin.com)SMD500HK LIANG MING ELECTRONICS TECHNOLOGY CO.,LIMITED
Fri Sep 29 07:28:00 UTC 2006M452 (from hkin.com)HP5000HONG TU TRADING LIMITED

Last record M35060-002SP:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 11 03:19:00 UTC 2006M35060-002SP (from hkin.com)MITDIP200BoLang ( HK) Electronics Limited

Last record M29W400BB70N1:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 25 07:15:00 UTC 2006M29W400BB70N1 (from hkin.com)ST04+SOP44散4HONGKONG BOTER ELECTRONICS COMPANY
Tue Sep 5 07:10:00 UTC 2006M29W400BB70N1 (from hkin.com)ST04+SOP44散4HONGKONG BOTER ELECTRONICS COMPANY
Fri Sep 15 04:06:00 UTC 2006M29W400BB70N1 (from hkin.com)ST04+4HONGKONG BOTER ELECTRONICS COMPANY

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A second-order all-pole filter gives an ultimate slope of about 12 dB per octave (40dB/decade), but the slope close to the corner frequency is much less, sometimes necessitating a notch be added to the filter. This is the ratio of the electric charge on each conductor to the potential difference between them. Many FPGA vendors have free (or inexpensive) tools to synthesize VHDL for use with their chips, where ASIC tools are often very expensive. For quantities that vary exponentially with temperature, such as the rate of a chemical reaction, any temperature coefficient would be valid only over a very small temperature range. The vast majority of the discrete (i.e non integrated) power devices are built using a vertical structure, whereas small-signal devices employ a lateral structure. The trip solenoid that releases the latch is usually energized by a separate battery, although some high-voltage circuit breakers are self-contained with current transformers, protection relays, and an internal control power source. Its major limitation for low voltage applications is the high voltage drop it exhibits in on-state (2 to 4 V). It has already completely replaced the bipolar transistor in power applications, and the availability of power modules (in which several IGBT dice are connected in parallel) makes it attractive for power levels up to several megawatts, pushing further the limit where thyristors and GTOs become the only option.
any passive component and active component such as:Diode, While consumer electronics continues in its trend of convergence, combining elements of many products, consumers face different decisions when purchasing. An integrated circuit or monolithic integrated circuit (also referred to as IC, chip, and microchip) is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material. Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies, made possible by the low cost of production of integrated circuits. Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. For example driver circuit
M48Z512AY-70PM9,M48Z512AY-70PM9,Comments from user about M48Z512AY-70PM9: As integrated circuit technology advanced, it was feasible to manufacture more and more complex processors on a single chip. Floating-point arithmetic, for example, was often not available on 8-bit microprocessors, but had to be carried out in software. IEEE standard 1076. Analog circuits use a continuous range of voltage as opposed to discrete levels as in digital circuits. The move to 64 bits by PowerPC processors had been intended since the processors' design in the early 90s and was not a major cause of incompatibility. Furthermore, much less material is used to construct a packaged IC die than to construct a discrete circuit.0 to the IEEE for balloting for inclusion in IEEE 1076-2008. Semiconductor devices are manufactured both as single discrete devices and as integrated circuits (ICs), which consist of a numberfrom a few (as low as two) to billionsof devices manufactured and interconnected on a single semiconductor substrate. Anything related to :M48Z512AY-70PM9, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: M48Z512AY-70PM9See also: