Part: MAX802TEPA

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Offer Index 34

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Previous Parts:MAX3486CSA-T,MAX3875AEHJ,MAX4090EUT-T,MAX4120ESD,MAX412ESA,MAX4599EXT-T,MAX485CPA,MAX485ECPA,MAX488ECSA,MAX489ECPD,MAX5172AEEE,MAX6250AEPA,MAX6343TUT-TSOT-23,MAX636ESA,MAX680CSA,MAX694ESA

The followings are offers provided by our member in Electronic Components Offer site about the following parts: MAX802TEPA":

Post DatePart NumberBrandD/CDescQtyCompany
Fri Sep 29 03:41:00 UTC 2006MAX802TEPA (from hkin.com)MAXIM05+8 Pin PDIP3000YUANHUI INTERNATIONAL ELECTRONICS TECHNOLOGY LIMITED
Fri Sep 29 03:41:00 UTC 2006MAX802TEPA (from standard server 2)MAXIM05+8 Pin PDIP3000YUANHUI INTERNATIONAL ELECTRONICS TECHNOLOGY LIMITED
Fri Sep 29 03:41:00 UTC 2006MAX802TEPA (from parts server 2)MAXIM05+8 Pin PDIP3000YUANHUI INTERNATIONAL ELECTRONICS TECHNOLOGY LIMITED
Fri Sep 29 03:41:00 UTC 2006MAX802TEPA (from hkin.com 2)MAXIM05+8 Pin PDIP3000YUANHUI INTERNATIONAL ELECTRONICS TECHNOLOGY LIMITED
Fri Sep 29 03:41:00 UTC 2006MAX802TEPA (from hkin.com 2)MAXIM05+8 Pin PDIP3000YUANHUI INTERNATIONAL ELECTRONICS TECHNOLOGY LIMITED

Last record MAX694ESA:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Sep 29 03:41:00 UTC 2006MAX694ESA (from hkin.com)MAXIM05+8 Pin NSOIC3000YUANHUI INTERNATIONAL ELECTRONICS TECHNOLOGY LIMITED

Last record MAX680CSA:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 5 09:49:00 UTC 2006MAX680CSA (from hkin.com)94+SOP-8MAXIM168SAN HUANG ELECTRONIC (HONGKONG) LIMITED
Fri Sep 29 03:09:00 UTC 2006MAX680CSA (from hkin.com)MAXIM05+6000JUNXING ELECTRONIC (H.K) LIMITED
Wed Sep 20 07:12:00 UTC 2006MAX680CSA (from hkin.com)MAXIM94+168HongKong HuaXinDa Electronic Co
Wed Sep 6 09:52:00 UTC 2006MAX680CSA+ (from hkin.com)05+200KINGTECH INT'L ELECTRONICS LIMITED
Thu Sep 7 04:40:00 UTC 2006MAX680CSA-T (from hkin.com)MAXIM95+SOIC12500JINDONG ELECTRONIC TECHNOLOGY (HK) INTERNATIONAL TRADE CO

Last record MAX636ESA:

Post DatePart NumberBrandD/CDescQtyCompany
Thu Sep 14 07:37:00 UTC 2006MAX636ESA (from hkin.com)MAXIMSMD500SHENZHEN KEHAO ELECTRONICS CO., LTD [ MERRYTONE ELECTRONICS (HONGKONG)CO., LIMITED ]
Fri Sep 8 01:13:00 UTC 2006MAX636ESA (from hkin.com)200TELTOP INT'L TRADING LTD
Fri Sep 8 01:28:00 UTC 2006MAX636ESA (from hkin.com)200LANCENT INT'L TRADING LTD

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vid:offerengine20111021

MAX802TEPA,MAX802TEPA,Comments from user about MAX802TEPA: Advancing technology makes more complex and powerful chips feasible to manufacture.Solid-state electronics are those circuits or devices built entirely from solid materials and in which the electrons, or other charge carriers, are confined entirely within the solid material. The updated IEEE 1076, in 1993, made the syntax more consistent, allowed more flexibility in naming, extended the character type to allow ISO-8859-1 printable characters, added the xnor operator, etc. With this structure, one of the connections of the device is located on the bottom of the semiconductor die. It was made of Germanium and had a voltage capability of 200 volts and a current rating of 35 amperes. LEDs powerful enough for room lighting are relatively expensive and require more precise current and heat management than compact fluorescent lamp sources of comparable output. Non-programmable controls would require complex, bulky, or costly implementation to achieve the results possible with a microprocessor. VHDL is a dataflow language, unlike procedural computing languages such as BASIC, C, and assembly code, which all run sequentially, one instruction at a time. Anything related to :MAX802TEPA, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: MAX802TEPA, search hkinventory: MAX802TEPA, High-end Intel Xeon processors that are on the LGA771 socket are DP (dual processor) capable, as well as the Intel Core 2 Extreme QX9775 also used in the Mac Pro by Apple and the Intel Skulltrail motherboard. In addition to IEEE standard 1164, several child standards were introduced to extend functionality of the language. The forms of practical capacitors vary widely, but all contain at least two conductors separated by a non-conductor. However, its excellent performance in low voltage make it the device of choice (actually the only choice) for applications below 200 V. Datasheet Dir, DataSheet Archive
Microcontrollers integrate a microprocessor with periphal devices for control of embedded system. For quantities that vary polynomially or logarithmically with temperature, it may be possible to calculate a temperature coefficient that is a useful approximation for a certain range of temperatures. The pipelined datapath is the most commonly used datapath design in microarchitecture today. Semiconductor devices are electronic components that exploit the electronic properties of semiconductor materials, principally silicon, germanium, and gallium arsenide, as well as organic semiconductors. It is an example of sequential digital logic, as it has internal memory. Increasingly stringent pollution control standards effectively require automobile manufacturers to use microprocessor engine management systems, to allow optimal control of emissions over widely-varying operating conditions of an automobile. Although the MOSFET is named in part for its "metal" gate, in modern devices polysilicon is typically used instead. Digital Signal Processors are another example.
any passive component and active component such as:Diode, A capacitor (formerly known as condenser) is a device for storing electric charge. A second-order all-pole filter gives an ultimate slope of about 12 dB per octave (40dB/decade), but the slope close to the corner frequency is much less, sometimes necessitating a notch be added to the filter. There is an ever increasing need to keep product information updated and comparable, for the consumer to make an informed choice. It is generally considered a "best practice" to write very idiomatic code for synthesis as results can be incorrect or suboptimal for non-standard constructs. For example driver circuit
MAX802TEPA,MAX802TEPA,Comments from user about MAX802TEPA: Some common power devices are the power diode, thyristor, power MOSFET and IGBT. Used without qualifier, the term passive is ambiguous. Semiconductor devices have replaced thermionic devices (vacuum tubes) in most applications. In the reverse bias region for a normal P-N rectifier diode, the current through the device is very low (in the gA range). Actually, all power semiconductors rely on a PIN diode structure to sustain voltage. For example, most constructs that explicitly deal with timing such as wait for 10 ns; are not synthesizable despite being valid for simulation. The IGBT is a recent component, so its performance improves regularly as technology evolves. These diagrams generally separate the datapath (where data is placed) and the control path (which can be said to steer the data). Anything related to :MAX802TEPA, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: MAX802TEPASee also: