Part: HD6473644P

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Previous Parts:GRM43DR71C226KA01L,GSET910BSV2.2,H5007T,HA2-2645-5,HA4-4741/883,HA7-5137A-5,HCF4013BEY,HCF4093BEY,HCNW139,HCPL2200,HCPL2232,HCPL-2731,HD44007A,HD6433725A24H,HD64570CP16,HD647180XOCP8L

The followings are offers provided by our member in Electronic Components Offer site about the following parts: HD6473644P":

Post DatePart NumberBrandD/CDescQtyCompany
Wed Sep 27 03:04:00 UTC 2006HD6473644P (from hkin.com)HITDIP153Shenzhen HangtianLong Electronics Technology Co.,Ltd
Wed Sep 27 03:04:00 UTC 2006HD6473644P (from standard server 2)HITDIP153Shenzhen HangtianLong Electronics Technology Co.,Ltd
Wed Sep 27 03:04:00 UTC 2006HD6473644P (from parts server 2)HITDIP153Shenzhen HangtianLong Electronics Technology Co.,Ltd
Wed Sep 27 03:04:00 UTC 2006HD6473644P (from hkin.com 2)HITDIP153Shenzhen HangtianLong Electronics Technology Co.,Ltd
Wed Sep 27 03:04:00 UTC 2006HD6473644P (from hkin.com 2)HITDIP153Shenzhen HangtianLong Electronics Technology Co.,Ltd
Tue Sep 19 02:30:00 UTC 2006HD6473644P (from hkin.com)HIDIP-64120MALAYSIA H.P ELECTRONICS TECHNOLOGY COMPANY
Tue Sep 19 02:30:00 UTC 2006HD6473644P (from standard server 2)HIDIP-64120MALAYSIA H.P ELECTRONICS TECHNOLOGY COMPANY
Tue Sep 19 02:30:00 UTC 2006HD6473644P (from parts server 2)HIDIP-64120MALAYSIA H.P ELECTRONICS TECHNOLOGY COMPANY
Tue Sep 19 02:30:00 UTC 2006HD6473644P (from hkin.com 2)HIDIP-64120MALAYSIA H.P ELECTRONICS TECHNOLOGY COMPANY
Tue Sep 19 02:30:00 UTC 2006HD6473644P (from hkin.com 2)HIDIP-64120MALAYSIA H.P ELECTRONICS TECHNOLOGY COMPANY
Mon Oct 2 01:33:00 UTC 2006HD6473644P (from hkin.com)HIDIP-641320YINGKE ELECTRONICS TECHNOLGY COMPANY
Mon Oct 2 01:33:00 UTC 2006HD6473644P (from standard server 2)HIDIP-641320YINGKE ELECTRONICS TECHNOLGY COMPANY
Mon Oct 2 01:33:00 UTC 2006HD6473644P (from parts server 2)HIDIP-641320YINGKE ELECTRONICS TECHNOLGY COMPANY
Mon Oct 2 01:33:00 UTC 2006HD6473644P (from hkin.com 2)HIDIP-641320YINGKE ELECTRONICS TECHNOLGY COMPANY
Mon Oct 2 01:33:00 UTC 2006HD6473644P (from hkin.com 2)HIDIP-641320YINGKE ELECTRONICS TECHNOLGY COMPANY

Last record HD647180XOCP8L:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 11 01:52:00 UTC 2006HD647180XOCP8L (from hkin.com)HIT04+PLCC66800SANTER (HK) ELECTRONICS CO.,LIMITED

Last record HD64570CP16:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Sep 22 07:59:00 UTC 2006HD64570CP16 (from hkin.com)N/A2004+PLCC325Songlin Electronics (HK) Co., Ltd.

Last record HD6433725A24H:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 19 17:41:00 UTC 2006HD6433725A24H (from hkin.com)HIT94+QFP966SUNTON INT'L ELECTRONICS (UK) CO., LTD

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HD6473644P,HD6473644P,Comments from user about HD6473644P: The first microprocessors emerged in the early 1970s and were used for electronic calculators, using binary-coded decimal (BCD) arithmetic on 4-bit words. VHDL has file input and output capabilities, and can be used as a general-purpose language for text processing, but files are more commonly used by a simulation testbench for stimulus or verification data., followed soon after. This includes decisions on the performance-level and connectivity of these peripherals. Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. The MOSFET is particularly suited to this configuration because its positive thermal coefficient of resistance tends to balance current between individual devices. Furthermore, much less material is used to construct a packaged IC die than to construct a discrete circuit. A power diode or MOSFET operates on similar principles to its low-power counterpart, but is able to carry a larger amount of current and typically is able to support a larger reverse-bias voltage in the off-state. Anything related to :HD6473644P, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: HD6473644P, search hkinventory: HD6473644P, Digital Signal Processors are another example. In this case it is common to replace the load resistor with a tuned circuit. With this structure, one of the connections of the device is located on the bottom of the semiconductor die. Single-chip processors increase reliability as there were many fewer electrical connections to fail. Datasheet Dir, DataSheet Archive
Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage. The integrated circuit's mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. Performance is high because the components switch quickly and consume little power (compared to their discrete counterparts) as a result of the small size and close proximity of the components. Generally, processor speed has increased more rapidly than external memory speed, so cache memory is necessary if the processor is not to be delayed by slower external memory. This type of circuit is usually called "mixed signal" rather than analog or digital. Circuit breakers for large currents or high voltages are usually arranged with pilot devices to sense a fault current and to operate the trip opening mechanism. Non-programmable controls would require complex, bulky, or costly implementation to achieve the results possible with a microprocessor.3 introduced signed and unsigned types to facilitate arithmetical operations on vectors.
any passive component and active component such as:Diode, A capacitor (formerly known as condenser) is a device for storing electric charge. The circuit can be made to change state by signals applied to one or more control inputs and will have one or two outputs. Its importance in today's society rests on its ability to be mass produced using a highly automated process (semiconductor device fabrication) that achieves astonishingly low per-transistor costs. However, its excellent performance in low voltage make it the device of choice (actually the only choice) for applications below 200 V. For example driver circuit
HD6473644P,HD6473644P,Comments from user about HD6473644P: System-level design decisions such as whether or not to include peripherals, such as memory controllers, can be considered part of the microarchitectural design process. Microprocessor control of a system can provide control strategies that would be impractical to implement using electromechanical controls or purpose-built electronic controls. The MOSFET is particularly suited to this configuration because its positive thermal coefficient of resistance tends to balance current between individual devices. It is relatively easy for an inexperienced developer to produce code that simulates successfully but that cannot be synthesized into a real device, or is too large to be practical. The IGCT's much faster turn-off times compared to the GTO's allows them to operate at higher frequenciesXup to several of kHz for very short periods of time. Bipolar junction transistors are formed from two p-n junctions, in either n-p-n or p-n-p configuration. Many products include Internet connectivity using technologies such as Wi-Fi, Bluetooth or Ethernet. The internal arrangement of a microprocessor varies depending on the age of the design and the intended purposes of the processor. Anything related to :HD6473644P, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: HD6473644PSee also: