Part: BYV52-200

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The followings are offers provided by our member in Electronic Components Offer site about the following parts: BYV52-200":

Post DatePart NumberBrandD/CDescQtyCompany
Wed Sep 27 01:12:00 UTC 2006BYV52-200 (from hkin.com)ST0040+TO-3P900MINGXINDA (HK) ELECTRONICS LIMITED
Wed Sep 27 01:12:00 UTC 2006BYV52-200 (from standard server 2)ST0040+TO-3P900MINGXINDA (HK) ELECTRONICS LIMITED
Wed Sep 27 01:12:00 UTC 2006BYV52-200 (from parts server 2)ST0040+TO-3P900MINGXINDA (HK) ELECTRONICS LIMITED
Wed Sep 27 01:12:00 UTC 2006BYV52-200 (from hkin.com 2)ST0040+TO-3P900MINGXINDA (HK) ELECTRONICS LIMITED
Wed Sep 27 01:12:00 UTC 2006BYV52-200 (from hkin.com 2)ST0040+TO-3P900MINGXINDA (HK) ELECTRONICS LIMITED
Mon Sep 18 06:04:00 UTC 2006BYV52-200 (from hkin.com)ST02+TO-3P10000Aosiwei Electronics Co.,Ltd.
Mon Sep 18 06:04:00 UTC 2006BYV52-200 (from standard server 2)ST02+TO-3P10000Aosiwei Electronics Co.,Ltd.
Mon Sep 18 06:04:00 UTC 2006BYV52-200 (from parts server 2)ST02+TO-3P10000Aosiwei Electronics Co.,Ltd.
Mon Sep 18 06:04:00 UTC 2006BYV52-200 (from hkin.com 2)ST02+TO-3P10000Aosiwei Electronics Co.,Ltd.
Mon Sep 18 06:04:00 UTC 2006BYV52-200 (from hkin.com 2)ST02+TO-3P10000Aosiwei Electronics Co.,Ltd.
Tue Sep 19 06:29:00 UTC 2006BYV52-200 (from hkin.com)ST01+TO3P1500Well Foundation (H.K.) Eelctronics Co
Tue Sep 19 06:29:00 UTC 2006BYV52-200 (from standard server 2)ST01+TO3P1500Well Foundation (H.K.) Eelctronics Co
Tue Sep 19 06:29:00 UTC 2006BYV52-200 (from parts server 2)ST01+TO3P1500Well Foundation (H.K.) Eelctronics Co
Tue Sep 19 06:29:00 UTC 2006BYV52-200 (from hkin.com 2)ST01+TO3P1500Well Foundation (H.K.) Eelctronics Co
Tue Sep 19 06:29:00 UTC 2006BYV52-200 (from hkin.com 2)ST01+TO3P1500Well Foundation (H.K.) Eelctronics Co

Last record BYV27-600:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 18 07:23:00 UTC 2006BYV27-600 (from hkin.com)PHILIPS04+new and original50000BELD ELECTRONICS TECHNOLOGY LIMITED
Fri Sep 8 14:07:00 UTC 2006BYV27-600 (from hkin.com)50000East Semiconductor International Co.,Ltd
Sat Sep 9 01:31:00 UTC 2006BYV27-600 (from hkin.com)150000LANCENT INT'L TRADING LTD
Thu Sep 14 02:41:00 UTC 2006BYV27-600 (from hkin.com)PHILIPS05/06+D0-5723000TONGYOU (HK) ELECTRONICS LIMITED

Last record BYR235:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 26 10:16:00 UTC 2006BYR235 (from hkin.com)PHILIPSSOT22315000KE JIE DA (HONGKONG) ELECTRONICS CO., LIMITED

Last record BYM26B:

Post DatePart NumberBrandD/CDescQtyCompany
Thu Sep 14 02:41:00 UTC 2006BYM26B (from hkin.com)PHILIPS05/06+DO-6410000TONGYOU (HK) ELECTRONICS LIMITED

If you want to find more about BYV52-200, please visit us on HKin


vid:offerengine20111021

BYV52-200,BYV52-200,Comments from user about BYV52-200: Power semiconductor devices first appeared in 1952 with the introduction of the power diode by R. This effect is called electroluminescence and the color of the light (corresponding to the energy of the photon) is determined by the energy gap of the semiconductor. The MOSFET is the most used semiconductor device today. The MOSFET is particularly suited to this configuration because its positive thermal coefficient of resistance tends to balance current between individual devices.[3] Some of these stages include instruction fetch, instruction decode, execute, and write back. The main reason why semiconductor materials are so useful is that the behavior of a semiconductor can be easily manipulated by the addition of impurities, known as doping. As clock speeds increase the depth of the pipeline increases with it, and some modern processors may have 20 stages or more. They are also called power devices or when used in integrated circuits, called power ICs. Anything related to :BYV52-200, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: BYV52-200, search hkinventory: BYV52-200, As of 2009, dual-core and quad-core processors are widely used in servers, workstations and PCs while six and eight-core processors will be available for high-end applications in both the home and professional environments. A capacitor (formerly known as condenser) is a device for storing electric charge. Microcontrollers integrate a microprocessor with periphal devices for control of embedded system. An integrated circuit or monolithic integrated circuit (also referred to as IC, chip, and microchip) is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material. Datasheet Dir, DataSheet Archive
LEDs present many advantages over incandescent light sources including lower energy consumption, longer lifetime, improved robustness, smaller size, faster switching, and greater durability and reliability.Different temperature coefficients are specified for various applications, including nuclear, electrical and magnetic., the power must be disconnected from the device. Alternatively, additional logic can be added to a simple transparent latch to make it non-transparent or opaque when another input (an "enable" input) is not asserted. When there is a potential difference (voltage) across the conductors, a static electric field develops across the dielectric, causing positive charge to collect on one plate and negative charge on the other plate. The trade-off between voltage, current and frequency ratings also exists for the switches. Light-emitting diodes are used in applications as diverse as replacements for aviation lighting, automotive lighting (particularly brake lamps, turn signals and indicators) as well as in traffic signals. One overriding characteristic of consumer electronic products is the trend of ever-falling prices.
any passive component and active component such as:Diode, With the vertical structure, the current rating of the device is proportional to its area, and the voltage blocking capability is achieved in the height of the die. That is, input signal changes cause immediate changes in output; when several transparent latches follow each other, using the same clock signal, signals can propagate through all of them at once. Some other standards support wider use of VHDL, notably VITAL (VHDL Initiative Towards ASIC Libraries) and microwave circuit design extensions. It has already completely replaced the bipolar transistor in power applications, and the availability of power modules (in which several IGBT dice are connected in parallel) makes it attractive for power levels up to several megawatts, pushing further the limit where thyristors and GTOs become the only option. For example driver circuit
BYV52-200,BYV52-200,Comments from user about BYV52-200: While this required extra logic to handle, for example, carry and overflow within each slice, the result was a system that could handle, say, 32-bit words using integrated circuits with a capacity for only 4 bits each. Furthermore, much less material is used to construct a packaged IC die than to construct a discrete circuit. The ALU performs operations such as addition, subtraction, and operations such as AND or OR. It is a multipurpose, programmable device that accepts digital data as input, processes it according to instructions stored in its memory, and provides results as output. The pipeline includes several different stages which are fundamental in microarchitecture designs. the bandwidth around the notch before attenuation becomes small. The VHDL standard IEEE 1076-2008 was published in January 2009. These techniques use convection, conduction, & radiation of heat energy. Anything related to :BYV52-200, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: BYV52-200See also: