Part: MAX309CPE

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Previous Parts:MA2P701A0L,MA2SD2400L,MA-406,MA4E2043-287,MAT01,MAX1406CPE,MAX1489CSD,MAX1607,MAX1631ECAI,MAX1676EUB,MAX1712EEG,MAX1999EEI-T,MAX211EWI,MAX2424EAI,MAX2820EGM,MAX294EPA

The followings are offers provided by our member in Electronic Components Offer site about the following parts: MAX309CPE":

Post DatePart NumberBrandD/CDescQtyCompany
Thu Sep 28 23:53:00 UTC 2006MAX309CPE (from hkin.com)MAXIM04+new original1000Newmay Electronics Company
Thu Sep 28 23:53:00 UTC 2006MAX309CPE (from standard server 2)MAXIM04+new original1000Newmay Electronics Company
Thu Sep 28 23:53:00 UTC 2006MAX309CPE (from parts server 2)MAXIM04+new original1000Newmay Electronics Company
Thu Sep 28 23:53:00 UTC 2006MAX309CPE (from hkin.com 2)MAXIM04+new original1000Newmay Electronics Company
Thu Sep 28 23:53:00 UTC 2006MAX309CPE (from hkin.com 2)MAXIM04+new original1000Newmay Electronics Company
Fri Sep 29 07:00:00 UTC 2006MAX309CPE (from hkin.com)MAXIM04+1000ShenZhen Tech-sun Electronics Co.,Ltd.
Fri Sep 29 07:00:00 UTC 2006MAX309CPE (from standard server 2)MAXIM04+1000ShenZhen Tech-sun Electronics Co.,Ltd.
Fri Sep 29 07:00:00 UTC 2006MAX309CPE (from parts server 2)MAXIM04+1000ShenZhen Tech-sun Electronics Co.,Ltd.
Fri Sep 29 07:00:00 UTC 2006MAX309CPE (from hkin.com 2)MAXIM04+1000ShenZhen Tech-sun Electronics Co.,Ltd.
Fri Sep 29 07:00:00 UTC 2006MAX309CPE (from hkin.com 2)MAXIM04+1000ShenZhen Tech-sun Electronics Co.,Ltd.
Mon Sep 4 01:23:00 UTC 2006MAX309CPE (from hkin.com)MAXIM04+DIP1000FRIEND ELECTRONICS COMPANY
Mon Sep 4 01:23:00 UTC 2006MAX309CPE (from standard server 2)MAXIM04+DIP1000FRIEND ELECTRONICS COMPANY
Mon Sep 4 01:23:00 UTC 2006MAX309CPE (from parts server 2)MAXIM04+DIP1000FRIEND ELECTRONICS COMPANY
Mon Sep 4 01:23:00 UTC 2006MAX309CPE (from hkin.com 2)MAXIM04+DIP1000FRIEND ELECTRONICS COMPANY
Mon Sep 4 01:23:00 UTC 2006MAX309CPE (from hkin.com 2)MAXIM04+DIP1000FRIEND ELECTRONICS COMPANY
Tue Sep 19 08:00:00 UTC 2006MAX309CPE (from hkin.com)MAXIM1HongKong HuaXinDa Electronic Co
Tue Sep 19 08:00:00 UTC 2006MAX309CPE (from standard server 2)MAXIM1HongKong HuaXinDa Electronic Co
Tue Sep 19 08:00:00 UTC 2006MAX309CPE (from parts server 2)MAXIM1HongKong HuaXinDa Electronic Co
Tue Sep 19 08:00:00 UTC 2006MAX309CPE (from hkin.com 2)MAXIM1HongKong HuaXinDa Electronic Co
Tue Sep 19 08:00:00 UTC 2006MAX309CPE (from hkin.com 2)MAXIM1HongKong HuaXinDa Electronic Co
Fri Sep 29 01:00:00 UTC 2006MAX309CPE+ (from hkin.com)MAXIM06+DIP-16997JIN WEI GUANG ELECTRONIC (HK) CO., LIMITED
Fri Sep 29 01:00:00 UTC 2006MAX309CPE+ (from standard server 2)MAXIM06+DIP-16997JIN WEI GUANG ELECTRONIC (HK) CO., LIMITED
Fri Sep 29 01:00:00 UTC 2006MAX309CPE+ (from parts server 2)MAXIM06+DIP-16997JIN WEI GUANG ELECTRONIC (HK) CO., LIMITED
Fri Sep 29 01:00:00 UTC 2006MAX309CPE+ (from hkin.com 2)MAXIM06+DIP-16997JIN WEI GUANG ELECTRONIC (HK) CO., LIMITED
Fri Sep 29 01:00:00 UTC 2006MAX309CPE+ (from hkin.com 2)MAXIM06+DIP-16997JIN WEI GUANG ELECTRONIC (HK) CO., LIMITED
Tue Sep 19 08:00:00 UTC 2006MAX309CPE+ (from hkin.com)MAXIM06+981HongKong HuaXinDa Electronic Co
Tue Sep 19 08:00:00 UTC 2006MAX309CPE+ (from standard server 2)MAXIM06+981HongKong HuaXinDa Electronic Co
Tue Sep 19 08:00:00 UTC 2006MAX309CPE+ (from parts server 2)MAXIM06+981HongKong HuaXinDa Electronic Co
Tue Sep 19 08:00:00 UTC 2006MAX309CPE+ (from hkin.com 2)MAXIM06+981HongKong HuaXinDa Electronic Co
Tue Sep 19 08:00:00 UTC 2006MAX309CPE+ (from hkin.com 2)MAXIM06+981HongKong HuaXinDa Electronic Co

Last record MAX294EPA:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 26 06:19:00 UTC 2006MAX294EPA (from hkin.com)MAXIMDIP1PARTSOON ELECTRONICS CO

Last record MAX2820EGM:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Sep 15 04:05:00 UTC 2006MAX2820EGM (from hkin.com)MAXIM02+2192HONGKONG BOTER ELECTRONICS COMPANY

Last record MAX2424EAI:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 26 06:19:00 UTC 2006MAX2424EAI (from hkin.com)MAXIMSSOP2174PARTSOON ELECTRONICS CO

If you want to find more about MAX309CPE, please visit us on HKin


vid:offerengine20111021

MAX309CPE,MAX309CPE,Comments from user about MAX309CPE: With the ability to put large numbers of transistors on one chip, it becomes feaible to integrate memory on the same die as the processor. Ternary (with three states) logic has been studied, and some prototype computers made. Power semiconductor devices first appeared in 1952 with the introduction of the power diode by R. When used in a finite-state machine, the output and next state depend not only on its current input, but also on its current state (and hence, previous inputs.) It can also be used for counting of pulses, and for synchronizing variably-timed input signals to some reference timing signal. These limit the circuit topologies available; for example, most, but not all active filter topologies provide a buffered (low impedance) output.VHDL is frequently used for two different goals: simulation of electronic designs and synthesis of such designs. Unlike a fuse, which operates once and then has to be replaced, a circuit breaker can be reset (either manually or automatically) to resume normal operation. An integrated circuit or monolithic integrated circuit (also referred to as IC, chip, and microchip) is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material. Anything related to :MAX309CPE, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: MAX309CPE, search hkinventory: MAX309CPE, It is relatively easy for an inexperienced developer to produce code that simulates successfully but that cannot be synthesized into a real device, or is too large to be practical.hn, which are optimized for distribution of HD content between CE devices in a home. This required IEEE standard 1164, which defined the 9-value logic types: scalar std_ulogic and its vector version std_ulogic_vector. Its importance in today's society rests on its ability to be mass produced using a highly automated process (semiconductor device fabrication) that achieves astonishingly low per-transistor costs. Datasheet Dir, DataSheet Archive
Advancing technology makes more complex and powerful chips feasible to manufacture. Occasionally the physical limitations of integrated circuits made such practices as a bit slice approach necessary. Similarly, an overdriven transistor amplifier can take on the characteristics of a controlled switch having essentially two levels of output. The updated IEEE 1076, in 1993, made the syntax more consistent, allowed more flexibility in naming, extended the character type to allow ISO-8859-1 printable characters, added the xnor operator, etc. The logic section retrieves instruction operation codes from memory, and iniates whatever sequence of operations of the ALU required to carry out the instruction. This effectively multiplies the processor's potential performance by the number of cores (as long as the operating system and software is designed to take advantage of more than one processor core). A passive component, depending on field, may be either a component that consumes (but does not produce) energy (thermodynamic passivity), or a component that is incapable of power gain (incremental passivity). The design of pipelines is one of the central microarchitectural tasks.
any passive component and active component such as:Diode, Some architectures include other stages such as memory access. Being created once, a calculation block can be used in many other projects. Actually, all power semiconductors rely on a PIN diode structure to sustain voltage. In case of large forward bias (current in the direction of the arrow), the diode exhibits a voltage drop due to its junction built-in voltage and internal resistance. For example driver circuit
MAX309CPE,MAX309CPE,Comments from user about MAX309CPE: A microprocessor control program can be easily tailored to different needs of a product line, allowing upgrades in performance with minimal redesign of the product. The first bipolar transistors devices with substantial power handling capabilities were introduced in the 1960s. Because the cores are physically very close to each other, they can communicate with each other much faster than separate processors in a multiprocessor system, which improves overall system performance.2 added better handling of real and complex data types.0 and includes enhanced generic types. An ideal capacitor is characterized by a single constant value, capacitance, measured in farads. For quantities that vary exponentially with temperature, such as the rate of a chemical reaction, any temperature coefficient would be valid only over a very small temperature range. While 64-bit microprocessor designs have been in use in several markets since the early 1990s, the early 2000s saw the introduction of 64-bit microprocessors targeted at the PC market. Anything related to :MAX309CPE, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: MAX309CPESee also: