Part: 74F02

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Offer Index 29

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Part Numbers

Previous Parts:6MBR35SB120,6N137S,6N303/2029/30,6RI50G-120,6S0765RC,73K221AL-IP,73K322L-IP,74AC138M,74AC14DR2,74AC16244DLR,74AC374MTR,74ACQ373PC,74ALS244AWMX,74ALS373N,74CBT16212ADGGR,74CS30

The followings are offers provided by our member in Electronic Components Offer site about the following parts: 74F02":

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 18 08:46:00 UTC 200674F02 (from hkin.com)TI00+SOP-3.92500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:46:00 UTC 200674F02 (from standard server 2)TI00+SOP-3.92500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:46:00 UTC 200674F02 (from parts server 2)TI00+SOP-3.92500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:46:00 UTC 200674F02 (from hkin.com 2)TI00+SOP-3.92500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:46:00 UTC 200674F02 (from hkin.com 2)TI00+SOP-3.92500KAM MING TIK (HK) ELECTRON CO.
Tue Sep 26 09:25:00 UTC 200674F02 (from hkin.com)03+SOP-1473JINLONGFENG (H.K) SEMICONDUCTOR LIMITED
Tue Sep 26 09:25:00 UTC 200674F02 (from standard server 2)03+SOP-1473JINLONGFENG (H.K) SEMICONDUCTOR LIMITED
Tue Sep 26 09:25:00 UTC 200674F02 (from parts server 2)03+SOP-1473JINLONGFENG (H.K) SEMICONDUCTOR LIMITED
Tue Sep 26 09:25:00 UTC 200674F02 (from hkin.com 2)03+SOP-1473JINLONGFENG (H.K) SEMICONDUCTOR LIMITED
Tue Sep 26 09:25:00 UTC 200674F02 (from hkin.com 2)03+SOP-1473JINLONGFENG (H.K) SEMICONDUCTOR LIMITED
Tue Sep 19 17:38:00 UTC 200674F02PC (from hkin.com)FAIR98+DIP148668SUNTON INT'L ELECTRONICS (UK) CO., LTD
Tue Sep 19 17:38:00 UTC 200674F02PC (from standard server 2)FAIR98+DIP148668SUNTON INT'L ELECTRONICS (UK) CO., LTD
Tue Sep 19 17:38:00 UTC 200674F02PC (from parts server 2)FAIR98+DIP148668SUNTON INT'L ELECTRONICS (UK) CO., LTD
Tue Sep 19 17:38:00 UTC 200674F02PC (from hkin.com 2)FAIR98+DIP148668SUNTON INT'L ELECTRONICS (UK) CO., LTD
Tue Sep 19 17:38:00 UTC 200674F02PC (from hkin.com 2)FAIR98+DIP148668SUNTON INT'L ELECTRONICS (UK) CO., LTD
Mon Sep 18 08:47:00 UTC 200674F02PC (from hkin.com)NS99+DIP2500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:47:00 UTC 200674F02PC (from standard server 2)NS99+DIP2500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:47:00 UTC 200674F02PC (from parts server 2)NS99+DIP2500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:47:00 UTC 200674F02PC (from hkin.com 2)NS99+DIP2500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:47:00 UTC 200674F02PC (from hkin.com 2)NS99+DIP2500KAM MING TIK (HK) ELECTRON CO.
Sat Sep 30 03:29:00 UTC 200674F02SCX (from hkin.com)TI906+2500ShenZhen SiZhiHong Electronics Technology Co., Ltd.
Sat Sep 30 03:29:00 UTC 200674F02SCX (from standard server 2)TI906+2500ShenZhen SiZhiHong Electronics Technology Co., Ltd.
Sat Sep 30 03:29:00 UTC 200674F02SCX (from parts server 2)TI906+2500ShenZhen SiZhiHong Electronics Technology Co., Ltd.
Sat Sep 30 03:29:00 UTC 200674F02SCX (from hkin.com 2)TI906+2500ShenZhen SiZhiHong Electronics Technology Co., Ltd.
Sat Sep 30 03:29:00 UTC 200674F02SCX (from hkin.com 2)TI906+2500ShenZhen SiZhiHong Electronics Technology Co., Ltd.

Last record 74CS30:

Post DatePart NumberBrandD/CDescQtyCompany
Thu Sep 28 02:04:00 UTC 200674CS30 (from hkin.com)TI05+DIP500FIGOER INT'L LIMITED

Last record 74CBT16212ADGGR:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Sep 30 07:20:00 UTC 200674CBT16212ADGGR (from hkin.com)TI97154AOHUADA TECHNOLOGICAL (HONGKONG) LIMITED

Last record 74ALS373N:

Post DatePart NumberBrandD/CDescQtyCompany
Thu Sep 28 02:28:00 UTC 200674ALS373N (from hkin.com)TI1998DIP2000Shen Zhen OML Technology Co.,Ltd
Mon Sep 18 08:46:00 UTC 200674ALS373N (from hkin.com)S88+DIP2500KAM MING TIK (HK) ELECTRON CO.

If you want to find more about 74F02, please visit us on HKin


vid:offerengine20111021

74F02,74F02,Comments from user about 74F02: There are some VHDL compilers which build executable binaries. It is a multipurpose, programmable device that accepts digital data as input, processes it according to instructions stored in its memory, and provides results as output. Once a fault is detected, contacts within the circuit breaker must open to interrupt the circuit; some mechanically-stored energy (using something such as springs or compressed air) contained within the breaker is used to separate the contacts, although some of the energy required may be obtained from the fault current itself. High-end Intel Xeon processors that are on the LGA771 socket are DP (dual processor) capable, as well as the Intel Core 2 Extreme QX9775 also used in the Mac Pro by Apple and the Intel Skulltrail motherboard. In reality one side or the other of the branch will be called much more often than the other. This effect is called electroluminescence and the color of the light (corresponding to the energy of the photon) is determined by the energy gap of the semiconductor. The capacitance is greatest when there is a narrow separation between large areas of conductor, hence capacitor conductors are often called "plates," referring to an early means of construction. VHDL is a dataflow language, unlike procedural computing languages such as BASIC, C, and assembly code, which all run sequentially, one instruction at a time. Anything related to :74F02, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: 74F02, search hkinventory: 74F02, Notch filters ?attenuation of certain frequencies while allowing all others to pass. The main reason why semiconductor materials are so useful is that the behavior of a semiconductor can be easily manipulated by the addition of impurities, known as doping. As of 2009, dual-core and quad-core processors are widely used in servers, workstations and PCs while six and eight-core processors will be available for high-end applications in both the home and professional environments. A digital signal processor (DSP) is specialized for signal processing. Datasheet Dir, DataSheet Archive
With the transition to the LGA1366 and LGA1156 socket and the Intel i7 and i5 chips, quad core is now considered mainstream, but with the release of the i7-980x, six core processors are now well within reach. These components overcame some limitations of the thyristors because they can be turned on or off with an applied signal. With the ability to put large numbers of transistors on one chip, it becomes feaible to integrate memory on the same die as the processor. Increasingly these products have become based on digital technologies, and have largely merged with the computer industry in what is increasingly referred to as the consumerization of information technology. It is relatively easy for an inexperienced developer to produce code that simulates successfully but that cannot be synthesized into a real device, or is too large to be practical. A digital signal processor (DSP) is specialized for signal processing. These changes should improve quality of synthesizable VHDL code, make testbenches more flexible, and allow wider use of VHDL for system-level descriptions. The microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA.
any passive component and active component such as:Diode, One particular pitfall is the accidental production of transparent latches rather than D-type flip-flops as storage elements The initial version of VHDL, designed to IEEE standard 1076-1987, included a wide range of data types, including numerical (integer and real), logical (bit and boolean), character and time, plus arrays of bit called bit_vector and of character called string. Often logic "0" will be a lower voltage and referred to as "Low" while logic "1" is referred to as "High". High-end Intel Xeon processors that are on the LGA771 socket are DP (dual processor) capable, as well as the Intel Core 2 Extreme QX9775 also used in the Mac Pro by Apple and the Intel Skulltrail motherboard. Bipolar junction transistors are formed from two p-n junctions, in either n-p-n or p-n-p configuration. For example driver circuit
74F02,74F02,Comments from user about 74F02: Semiconductor components benefit from Moore's Law, an observed principle which states that, for a given price, semiconductor functionality doubles every two years. This can be seen in figure 2. This required IEEE standard 1164, which defined the 9-value logic types: scalar std_ulogic and its vector version std_ulogic_vector. Different features can be implemented in different models of a product line at negligible production cost. Microprocessors integrated into one or a few large-scale ICs the architectures that had previously been implemented using many medium- and small-scale integrated circuits. Actually, all power semiconductors rely on a PIN diode structure to sustain voltage. They use electronic conduction in the solid state as opposed to the gaseous state or thermionic emission in a high vacuum. When there is a potential difference (voltage) across the conductors, a static electric field develops across the dielectric, causing positive charge to collect on one plate and negative charge on the other plate. Anything related to :74F02, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: 74F02See also: