Part: 27C512-15

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Previous Parts:1528CRE,15KP33CA,15KP75C,15N06,160ID/QFP,1682,16S02,18K84,2N3351,2N3566,2N3627,2N3903RA,2N3957,2N3958,2N3972,27C256

The followings are offers provided by our member in Electronic Components Offer site about the following parts: 27C512-15":

Post DatePart NumberBrandD/CDescQtyCompany
Thu Sep 21 01:37:00 UTC 200627C512-15 (from hkin.com)TI9222+CDIP-282ShenZhen JinZeYu Electronics Co.,
Thu Sep 21 01:37:00 UTC 200627C512-15 (from standard server 2)TI9222+CDIP-282ShenZhen JinZeYu Electronics Co.,
Thu Sep 21 01:37:00 UTC 200627C512-15 (from parts server 2)TI9222+CDIP-282ShenZhen JinZeYu Electronics Co.,
Thu Sep 21 01:37:00 UTC 200627C512-15 (from hkin.com 2)TI9222+CDIP-282ShenZhen JinZeYu Electronics Co.,
Thu Sep 21 01:37:00 UTC 200627C512-15 (from hkin.com 2)TI9222+CDIP-282ShenZhen JinZeYu Electronics Co.,
Mon Sep 4 04:33:00 UTC 200627C512-15 (from hkin.com)MBM.PLCC500FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:33:00 UTC 200627C512-15 (from standard server 2)MBM.PLCC500FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:33:00 UTC 200627C512-15 (from parts server 2)MBM.PLCC500FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:33:00 UTC 200627C512-15 (from hkin.com 2)MBM.PLCC500FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:33:00 UTC 200627C512-15 (from hkin.com 2)MBM.PLCC500FLYTECH (HK) ELECTRON LIMITED
Wed Sep 27 02:06:00 UTC 200627C512-15 (from hkin.com)TI0DIP93HONGKONG FEILONG INDUSTRY INTERNATIONAL LIMITED
Wed Sep 27 02:06:00 UTC 200627C512-15 (from standard server 2)TI0DIP93HONGKONG FEILONG INDUSTRY INTERNATIONAL LIMITED
Wed Sep 27 02:06:00 UTC 200627C512-15 (from parts server 2)TI0DIP93HONGKONG FEILONG INDUSTRY INTERNATIONAL LIMITED
Wed Sep 27 02:06:00 UTC 200627C512-15 (from hkin.com 2)TI0DIP93HONGKONG FEILONG INDUSTRY INTERNATIONAL LIMITED
Wed Sep 27 02:06:00 UTC 200627C512-15 (from hkin.com 2)TI0DIP93HONGKONG FEILONG INDUSTRY INTERNATIONAL LIMITED
Mon Sep 11 10:09:00 UTC 200627C512-15 (from hkin.com)F95+PLCC3210OASIS ELECTRONICS (HK) CO., LIMITED
Mon Sep 11 10:09:00 UTC 200627C512-15 (from standard server 2)F95+PLCC3210OASIS ELECTRONICS (HK) CO., LIMITED
Mon Sep 11 10:09:00 UTC 200627C512-15 (from parts server 2)F95+PLCC3210OASIS ELECTRONICS (HK) CO., LIMITED
Mon Sep 11 10:09:00 UTC 200627C512-15 (from hkin.com 2)F95+PLCC3210OASIS ELECTRONICS (HK) CO., LIMITED
Mon Sep 11 10:09:00 UTC 200627C512-15 (from hkin.com 2)F95+PLCC3210OASIS ELECTRONICS (HK) CO., LIMITED
Mon Sep 18 05:57:00 UTC 200627C512-15 (from hkin.com)TEXAS00+DIP10Aosiwei Electronics Co.,Ltd.
Mon Sep 18 05:57:00 UTC 200627C512-15 (from standard server 2)TEXAS00+DIP10Aosiwei Electronics Co.,Ltd.
Mon Sep 18 05:57:00 UTC 200627C512-15 (from parts server 2)TEXAS00+DIP10Aosiwei Electronics Co.,Ltd.
Mon Sep 18 05:57:00 UTC 200627C512-15 (from hkin.com 2)TEXAS00+DIP10Aosiwei Electronics Co.,Ltd.
Mon Sep 18 05:57:00 UTC 200627C512-15 (from hkin.com 2)TEXAS00+DIP10Aosiwei Electronics Co.,Ltd.
Mon Sep 4 04:33:00 UTC 200627C512-15BUC (from hkin.com)MICROCHIP.LCC32200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:33:00 UTC 200627C512-15BUC (from standard server 2)MICROCHIP.LCC32200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:33:00 UTC 200627C512-15BUC (from parts server 2)MICROCHIP.LCC32200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:33:00 UTC 200627C512-15BUC (from hkin.com 2)MICROCHIP.LCC32200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:33:00 UTC 200627C512-15BUC (from hkin.com 2)MICROCHIP.LCC32200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 18 08:32:00 UTC 200627C512-15F (from hkin.com)ST97+DIP2500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:32:00 UTC 200627C512-15F (from standard server 2)ST97+DIP2500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:32:00 UTC 200627C512-15F (from parts server 2)ST97+DIP2500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:32:00 UTC 200627C512-15F (from hkin.com 2)ST97+DIP2500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:32:00 UTC 200627C512-15F (from hkin.com 2)ST97+DIP2500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 4 04:33:00 UTC 200627C512-15FA (from hkin.com)S/PHI.CWDIP28200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:33:00 UTC 200627C512-15FA (from standard server 2)S/PHI.CWDIP28200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:33:00 UTC 200627C512-15FA (from parts server 2)S/PHI.CWDIP28200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:33:00 UTC 200627C512-15FA (from hkin.com 2)S/PHI.CWDIP28200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:33:00 UTC 200627C512-15FA (from hkin.com 2)S/PHI.CWDIP28200FLYTECH (HK) ELECTRON LIMITED

Last record 27C256:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 18 03:32:00 UTC 200627C256 (from hkin.com)ST/NS/AMD99DIP1000JIECHUANGSEN TECHNOLOGY CO., LIMITED
Mon Sep 11 10:09:00 UTC 200627C256 (from hkin.com)ST00+400OASIS ELECTRONICS (HK) CO., LIMITED
Mon Sep 11 10:09:00 UTC 200627C256 (from hkin.com)DIP53OASIS ELECTRONICS (HK) CO., LIMITED
Mon Sep 11 10:09:00 UTC 200627C256 (from hkin.com)STDIP29OASIS ELECTRONICS (HK) CO., LIMITED
Mon Sep 11 10:09:00 UTC 200627C256 (from hkin.com)TOSDIP2820OASIS ELECTRONICS (HK) CO., LIMITED
Mon Sep 11 10:09:00 UTC 200627C256 (from hkin.com)STPLCC25OASIS ELECTRONICS (HK) CO., LIMITED
Wed Sep 27 14:48:00 UTC 200627C256 (from hkin.com)100Towering International Electronic Technogies(UK) Co.,Ltd
Wed Sep 27 16:23:00 UTC 200627C256 (from hkin.com)100East Semiconductor International Co.,Ltd
Thu Sep 28 01:46:00 UTC 200627C256 (from hkin.com)100LANCENT INT'L TRADING LTD
Thu Sep 28 01:47:00 UTC 200627C256 (from hkin.com)100TELTOP INT'L TRADING LTD
Mon Sep 11 10:09:00 UTC 200627C256 NEW (from hkin.com)323OASIS ELECTRONICS (HK) CO., LIMITED
Mon Sep 4 04:34:00 UTC 200627C256/BXA-20 5962-8606301XA (from hkin.com)S/PHI.CWDIP28500FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256-12 (from hkin.com)TMS02+DIP1000FLYTECH (HK) ELECTRON LIMITED
Mon Sep 25 03:46:00 UTC 200627C256-12 (from hkin.com)MICRCL9112镜面34ShenZhen XiangHe Technology Co., Ltd.
Mon Sep 11 10:09:00 UTC 200627C256-12/L (from hkin.com)97+PLCC145OASIS ELECTRONICS (HK) CO., LIMITED
Wed Sep 27 02:06:00 UTC 200627C256-12F (from hkin.com)ST2005DIP79HONGKONG FEILONG INDUSTRY INTERNATIONAL LIMITED
Fri Sep 22 06:46:00 UTC 200627C256-12FA (from hkin.com)ASIORIGINAL727Min Xin Technology (H.K.) Electronics Co.
Mon Sep 11 10:09:00 UTC 200627C256-15 (from hkin.com)MICORCHIP1993QFP58OASIS ELECTRONICS (HK) CO., LIMITED
Mon Sep 25 03:46:00 UTC 200627C256-15CHA (from hkin.com)MICROCHIP92+LCC1944ShenZhen XiangHe Technology Co., Ltd.
Mon Sep 4 04:34:00 UTC 200627C256-15FA (from hkin.com)S/PHI.CWDIP28500FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256-17FA (from hkin.com)S.CWDIP28200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 11 10:09:00 UTC 200627C256-20/4 (from hkin.com)ST95+PLCC145OASIS ELECTRONICS (HK) CO., LIMITED
Mon Sep 4 04:34:00 UTC 200627C256-20I/J (from hkin.com)MICROCHIP.CWDIP28200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 18 06:37:00 UTC 200627C256-25 (from hkin.com)MICROCHIN/ADIP-2850Aosiwei Electronics Co.,Ltd.
Mon Sep 25 03:46:00 UTC 200627C256-90/L (from hkin.com)MICROCHIP92PLCC34ShenZhen XiangHe Technology Co., Ltd.
Mon Sep 4 04:34:00 UTC 200627C256A-12 (from hkin.com)NEC.PLCC200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256A-15 (from hkin.com)MBM.PLCC500FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256A-20X (from hkin.com)FAIRCHILD.LCCW500FLYTECH (HK) ELECTRON LIMITED
Mon Sep 11 10:09:00 UTC 200627C256B-12B1 (from hkin.com)STDIP12OASIS ELECTRONICS (HK) CO., LIMITED
Wed Sep 27 02:06:00 UTC 200627C256B-12F1 (from hkin.com)ST04+DIP93HONGKONG FEILONG INDUSTRY INTERNATIONAL LIMITED
Mon Sep 4 04:34:00 UTC 200627C256B-15F1 (from hkin.com)ST95nDIP28160FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256D (from hkin.com)INTEL.CWDIP28200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256DC-12 (from hkin.com)MX.CWDIP28500FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256DC-70 (from hkin.com)MX.CWDIP28200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256DC-90 (from hkin.com)MX.CWDIP28200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 25 03:46:00 UTC 200627C256DC-90 (from hkin.com)MX91DIP10ShenZhen XiangHe Technology Co., Ltd.
Mon Sep 4 04:34:00 UTC 200627C256DI-12 (from hkin.com)MX.CWDIP28200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256I-20FA (from hkin.com)S.CWDIP28200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256L-12T (from hkin.com)WSI.CWDIP28500FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256L-12TMB (from hkin.com)WSI..1000FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256L-15DMB (from hkin.com)WSI.CWDIP28200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256L-20DI/Y (from hkin.com)WSI.CWDIP28500FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256L-90T/5 (from hkin.com)WSI.CWDIP28500FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256L-90T/5* (from hkin.com)WSI.CWDIP28200FLYTECH (HK) ELECTRON LIMITED
Mon Sep 4 04:34:00 UTC 200627C256L-90TMB (from hkin.com)WSI..1000FLYTECH (HK) ELECTRON LIMITED
Sat Sep 30 03:17:00 UTC 200627C256PC-12 (from hkin.com)5000YXD(HK) ELECTRONICS CO.
Mon Sep 11 10:09:00 UTC 200627C256PC-15 (from hkin.com)MX94+DIP44OASIS ELECTRONICS (HK) CO., LIMITED
Mon Sep 4 04:34:00 UTC 200627C256Q-150 (from hkin.com)NS97nDIP28550FLYTECH (HK) ELECTRON LIMITED
Mon Sep 11 10:09:00 UTC 200627C256T-15/SO (from hkin.com)MICROCHIP93SOP538OASIS ELECTRONICS (HK) CO., LIMITED

Last record 2N3972:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 25 08:57:00 UTC 20062N3972 (from hkin.com)CAN3MOT5000HONG KONG UNI-MEGA ELECTRONIC TECHNOLOGY LIMITED

Last record 2N3958:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 25 08:56:00 UTC 20062N3958 (from hkin.com)CAN6MOT5000HONG KONG UNI-MEGA ELECTRONIC TECHNOLOGY LIMITED
Thu Sep 14 15:22:00 UTC 20062N3958 (from hkin.com)100HK TAIRUI ELECTRONIC CO., LIMITED
Mon Sep 25 05:23:00 UTC 20062N3958 (from hkin.com)MOTOLORA02+CAN6100Chip E-Go Trading Ltd.
Mon Sep 25 17:19:00 UTC 20062N3958 (from hkin.com)30East Semiconductor International Co.,Ltd
Mon Sep 25 17:19:00 UTC 20062N3958 (from hkin.com)100East Semiconductor International Co.,Ltd
Tue Sep 26 01:15:00 UTC 20062N3958 (from hkin.com)100ADVANTEL TECHNOLOGIES CO., LTD.
Tue Sep 26 01:15:00 UTC 20062N3958 (from hkin.com)50ADVANTEL TECHNOLOGIES CO., LTD.

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27C512-15,27C512-15,Comments from user about 27C512-15: 2 added better handling of real and complex data types. There is a gradual shift towards e-commerce web-storefronts. There are some VHDL compilers which build executable binaries.[3] Each microarchitectural element is in turn represented by a schematic describing the interconnections of logic gates used to implement it. Many FPGA vendors have free (or inexpensive) tools to synthesize VHDL for use with their chips, where ASIC tools are often very expensive. Another type of transistor, the field effect transistor operates on the principle that semiconductor conductivity can be increased or decreased by the presence of an electric field. With the transition to the LGA1366 and LGA1156 socket and the Intel i7 and i5 chips, quad core is now considered mainstream, but with the release of the i7-980x, six core processors are now well within reach. A power diode or MOSFET operates on similar principles to its low-power counterpart, but is able to carry a larger amount of current and typically is able to support a larger reverse-bias voltage in the off-state. Anything related to :27C512-15, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: 27C512-15, search hkinventory: 27C512-15,[3] Some of these stages include instruction fetch, instruction decode, execute, and write back. However, most designers leave this job to the simulator.0 also informally known as VHDL 2008, which addressed more than 90 issues discovered during the trial period for version 3. Another benefit is that VHDL allows the description of a concurrent system. Datasheet Dir, DataSheet Archive
An integrated circuit or monolithic integrated circuit (also referred to as IC, chip, and microchip) is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material. When a light-emitting diode is forward biased (switched on), electrons are able to recombine with electron holes within the device, releasing energy in the form of photons. Execution units include arithmetic logic units (ALU), floating point units (FPU), load/store units, branch prediction, and SIMD. Indeed, it may be the desire to incorporate a passive filter that leads the designer to use the hybrid format. With this structure, one of the connections of the device is located on the bottom of the semiconductor die. Flip-flops and latches are a fundamental building block of digital electronics systems used in computers, communications, and many other types of systems. From the time that the processor's instruction decoder has figured out that it has encountered a conditional branch instruction to the time that the deciding register value can be read out, the pipeline needs to be stalled for several cycles, or if it's not and the branch is taken, the pipeline needs to be flushed. Low-pass filters ?attenuation of frequencies above their cut-off points.
any passive component and active component such as:Diode, Graphics processing units may have no, limited, or general programming facilities. The number of different analog circuits so far devised is huge, especially because a 'circuit' can be defined as anything from a single component, to systems containing thousands of components. Passivity, in most cases, can be used to demonstrate that passive circuits will be stable under specific criteria. Heat generated by electronic circuitry must be dissipated to prevent immediate failure and improve long term reliability. For example driver circuit
27C512-15,27C512-15,Comments from user about 27C512-15: The complexity of an integrated circuit is bounded by physical limitations of the number of transistors that can be put onto one chip, the number of package terminations that can connect the processor to other parts of the system, the number of interconnections it is possible to make on the chip, and the heat that the chip can dissipate. Additional features were added to the processor architecture; more on-chip registers speeded up programs, and complex instructions could be used to make more compact programs. While consumer electronics continues in its trend of convergence, combining elements of many products, consumers face different decisions when purchasing. High-end Intel Xeon processors that are on the LGA771 socket are DP (dual processor) capable, as well as the Intel Core 2 Extreme QX9775 also used in the Mac Pro by Apple and the Intel Skulltrail motherboard. This effect is called electroluminescence and the color of the light (corresponding to the energy of the photon) is determined by the energy gap of the semiconductor.3 introduced signed and unsigned types to facilitate arithmetical operations on vectors. It has already completely replaced the bipolar transistor in power applications, and the availability of power modules (in which several IGBT dice are connected in parallel) makes it attractive for power levels up to several megawatts, pushing further the limit where thyristors and GTOs become the only option. Power semiconductor devices first appeared in 1952 with the introduction of the power diode by R. Anything related to :27C512-15, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: 27C512-15See also: