Part: 1008CS-152XJBC

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Previous Parts:293D476X96R3C2W,293D686X06R3D2T,293D686X9016D2T,2SB226,01-2,036A,06031C681MAT4A,0603CS-15NXJBG,08-0246-03,0805 361J,0805 J 4K7,0805CM151KTT,0986-2K,1.5KE110A,1.5KE30,1.5KE39CS

The followings are offers provided by our member in Electronic Components Offer site about the following parts: 1008CS-152XJBC":

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 11 15:21:00 UTC 20061008CS-152XJBC (from hkin.com)USA04+1008-1525500ShenZhen SanHuiZhengXing Technology Co.,Ltd
Mon Sep 11 15:21:00 UTC 20061008CS-152XJBC (from standard server 2)USA04+1008-1525500ShenZhen SanHuiZhengXing Technology Co.,Ltd
Mon Sep 11 15:21:00 UTC 20061008CS-152XJBC (from parts server 2)USA04+1008-1525500ShenZhen SanHuiZhengXing Technology Co.,Ltd
Mon Sep 11 15:21:00 UTC 20061008CS-152XJBC (from hkin.com 2)USA04+1008-1525500ShenZhen SanHuiZhengXing Technology Co.,Ltd
Mon Sep 11 15:21:00 UTC 20061008CS-152XJBC (from hkin.com 2)USA04+1008-1525500ShenZhen SanHuiZhengXing Technology Co.,Ltd

Last record 1.5KE39CS:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Sep 9 04:18:00 UTC 20061.5KE39CS (from hkin.com)EIC04+100000ShenZhen Linkrich Technology Co., Ltd.

Last record 1.5KE30:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Oct 2 03:05:00 UTC 20061.5KE30 (from hkin.com)2006bright-cn.com1000000Bright Electronics International Ltd
Sat Sep 9 04:18:00 UTC 20061.5KE30 (from hkin.com)EIC20014800ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE30 (from hkin.com)EIC04+100000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE300 (from hkin.com)EIC04+100000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE300A (from hkin.com)EIC04+50000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE300A (from hkin.com)EIC27500ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE300AS (from hkin.com)EIC04+50000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE300C (from hkin.com)EIC04+50000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE300CA (from hkin.com)EIC04+50000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE300CAS (from hkin.com)EIC20033000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE300CAS (from hkin.com)EIC04+50000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE300CS (from hkin.com)EIC04+50000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE300S (from hkin.com)EIC04+100000ShenZhen Linkrich Technology Co., Ltd.
Mon Oct 2 03:05:00 UTC 20061.5KE30A (from hkin.com)2006bright-cn.com1000000Bright Electronics International Ltd
Sat Sep 9 04:18:00 UTC 20061.5KE30A (from hkin.com)EIC04+100000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE30A (from hkin.com)EIC500ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE30AS (from hkin.com)EIC04+100000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE30C (from hkin.com)EIC04+100000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE30C (from hkin.com)EIC1000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE30CA (from hkin.com)EIC10000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE30CA (from hkin.com)EIC04+100000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE30CA (from hkin.com)EIC5000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE30CAS (from hkin.com)EIC04+100000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE30CS (from hkin.com)EIC04+100000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:18:00 UTC 20061.5KE30S (from hkin.com)EIC04+100000ShenZhen Linkrich Technology Co., Ltd.

Last record 1.5KE110A:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Sep 9 04:16:00 UTC 20061.5KE110A (from hkin.com)EIC04+100000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:16:00 UTC 20061.5KE110A (from hkin.com)EIC4000ShenZhen Linkrich Technology Co., Ltd.
Sat Sep 9 04:16:00 UTC 20061.5KE110AS (from hkin.com)EIC04+100000ShenZhen Linkrich Technology Co., Ltd.

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While 64-bit microprocessor designs have been in use in several markets since the early 1990s, the early 2000s saw the introduction of 64-bit microprocessors targeted at the PC market. One overriding characteristic of consumer electronic products is the trend of ever-falling prices. Semiconductor devices are electronic components that exploit the electronic properties of semiconductor materials, principally silicon, germanium, and gallium arsenide, as well as organic semiconductors. Execution units include arithmetic logic units (ALU), floating point units (FPU), load/store units, branch prediction, and SIMD. Being created once, a calculation block can be used in many other projects. This effectively multiplies the processor's potential performance by the number of cores (as long as the operating system and software is designed to take advantage of more than one processor core). Energy is stored in the electrostatic field. These techniques use convection, conduction, & radiation of heat energy.
any passive component and active component such as:Diode,0 of VHDL-2006. Notch filters ?attenuation of certain frequencies while allowing all others to pass. Used without qualifier, the term passive is ambiguous. The first bipolar transistors devices with substantial power handling capabilities were introduced in the 1960s. For example driver circuit
1008CS-152XJBC,1008CS-152XJBC,Comments from user about 1008CS-152XJBC: The integrated circuit processor was produced in large numbers by highly automated processes, so unit cost was low. Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies, made possible by the low cost of production of integrated circuits. It is an example of sequential digital logic, as it has internal memory. Style, price, specification and performance are all relevant. This equation is linear with respect to temperature. The pipelined datapath is the most commonly used datapath design in microarchitecture today. Furthermore, much less material is used to construct a packaged IC die than to construct a discrete circuit. Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage. Anything related to :1008CS-152XJBC, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: 1008CS-152XJBCSee also: