Part: MC1489AP

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Previous Parts:MC100ELT22DTG,MC100EP142FAG,MC100EP33DR2,MC10104,MC10130L,MC10H158L,MC13281FYP,MC1330AP,MC1377P,MC14175DR2,MC14410BCP,MC14412BCP,MC145106P,MC145483DT,MC145485VF,MC14584BCP

The followings are offers provided by our member in Electronic Components Offer site about the following parts: MC1489AP":

Post DatePart NumberBrandD/CDescQtyCompany
Thu Sep 21 07:14:00 UTC 2006MC1489AP (from hkin.com)20ChaoJia (HongKong) Electronic Co
Thu Sep 21 07:14:00 UTC 2006MC1489AP (from standard server 2)20ChaoJia (HongKong) Electronic Co
Thu Sep 21 07:14:00 UTC 2006MC1489AP (from parts server 2)20ChaoJia (HongKong) Electronic Co
Thu Sep 21 07:14:00 UTC 2006MC1489AP (from hkin.com 2)20ChaoJia (HongKong) Electronic Co
Thu Sep 21 07:14:00 UTC 2006MC1489AP (from hkin.com 2)20ChaoJia (HongKong) Electronic Co
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from hkin.com)MOT96DIP60EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from standard server 2)MOT96DIP60EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from parts server 2)MOT96DIP60EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from hkin.com 2)MOT96DIP60EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from hkin.com 2)MOT96DIP60EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from hkin.com)ON00+DIP85EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from standard server 2)ON00+DIP85EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from parts server 2)ON00+DIP85EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from hkin.com 2)ON00+DIP85EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from hkin.com 2)ON00+DIP85EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from hkin.com)MOTOROLA89DIP-1439EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from standard server 2)MOTOROLA89DIP-1439EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from parts server 2)MOTOROLA89DIP-1439EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from hkin.com 2)MOTOROLA89DIP-1439EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from hkin.com 2)MOTOROLA89DIP-1439EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from hkin.com)MOTOROLA90DIP-1424EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from standard server 2)MOTOROLA90DIP-1424EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from parts server 2)MOTOROLA90DIP-1424EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from hkin.com 2)MOTOROLA90DIP-1424EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from hkin.com 2)MOTOROLA90DIP-1424EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from hkin.com)XP97DIP-14125EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from standard server 2)XP97DIP-14125EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from parts server 2)XP97DIP-14125EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from hkin.com 2)XP97DIP-14125EAGLE ELECTRONICS (HK) CO.
Tue Sep 26 16:53:00 UTC 2006MC1489AP (from hkin.com 2)XP97DIP-14125EAGLE ELECTRONICS (HK) CO.

Last record MC14584BCP:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 18 03:18:00 UTC 2006MC14584BCP (from hkin.com)ON0601+new and original500ABD Technology Company
Tue Sep 19 15:29:00 UTC 2006MC14584BCP (from hkin.com)MOT96+DIP16328SOUROE (HK)ELECTRONICS LIMITED
Tue Sep 26 16:53:00 UTC 2006MC14584BCP (from hkin.com)MOT99DIP33EAGLE ELECTRONICS (HK) CO.

Last record MC145485VF:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Sep 29 07:29:00 UTC 2006MC145485VF (from hkin.com)sop5000HONG TU TRADING LIMITED

Last record MC145483DT:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 19 03:07:00 UTC 2006MC145483DT (from hkin.com)MOT05+550lead electronics co.
Fri Sep 29 01:47:00 UTC 2006MC145483DT (from hkin.com)MOT05+N/A550ShenZhen Union Components
Fri Sep 29 09:39:00 UTC 2006MC145483DT (from hkin.com)MOT05+N/A550ShenZhen Union Components

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vid:offerengine20111021

MC1489AP,MC1489AP,Comments from user about MC1489AP: Although the MOSFET is named in part for its "metal" gate, in modern devices polysilicon is typically used instead. From the time that the processor's instruction decoder has figured out that it has encountered a conditional branch instruction to the time that the deciding register value can be read out, the pipeline needs to be stalled for several cycles, or if it's not and the branch is taken, the pipeline needs to be flushed. With the ability to put large numbers of transistors on one chip, it becomes feaible to integrate memory on the same die as the processor. The power MOSFET has the advantages of the majority carrier devices, so it can achieve very high operating frequency, but can't be used with high voltages. In this case, it might be possible to use VHDL to write a testbench to verify the functionality of the design using files on the host computer to define stimuli, to interact with the user, and to compare results with those expected. Indeed, it may be the desire to incorporate a passive filter that leads the designer to use the hybrid format. Indeed, it may be the desire to incorporate a passive filter that leads the designer to use the hybrid format. In control systems and circuit network theory, a passive component or circuit is one that consumes energy, but does not produce energy. Anything related to :MC1489AP, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: MC1489AP, search hkinventory: MC1489AP, In addition, passive circuits will not necessarily be stable under all stability criteria. Semiconductor conductivity can be controlled by introduction of an electric or magnetic field, by exposure to light or heat, or by mechanical deformation of a doped monocrystalline grid; thus, semiconductors can make excellent sensors. In the case of narrow-band bandpass filters, the Q determines the -3dB bandwidth but also the degree of rejection of frequencies far removed from the center frequency; if these two requirements are in conflict then a staggered-tuning bandpass filter may be needed. The choice of the number of execution units, their latency and throughput is a central microarchitectural design task. Datasheet Dir, DataSheet Archive
The thyristor turn-off is passive, i. Competing projects would result in the IBM POWER and Sun SPARC architectures. A logic gate consists of up to about twenty transistors whereas an advanced microprocessor, as of 2011, can use as many as 3 billion transistors (MOSFETs). The design of pipelines is one of the central microarchitectural tasks. Desirable properties of MOSFETs, such as their utility in low-power devices, usually in the CMOS configuration, allowed them to capture nearly all market share for digital circuits; more recently MOSFETs have captured most analog and power applications as well, including modern clocked analog circuits, voltage regulators, amplifiers, power transmitters, motor drivers, etc. Actually, all power semiconductors rely on a PIN diode structure to sustain voltage. Microcontrollers integrate a microprocessor with periphal devices for control of embedded system. Microprocessors integrated into one or a few large-scale ICs the architectures that had previously been implemented using many medium- and small-scale integrated circuits.
any passive component and active component such as:Diode, This required IEEE standard 1164, which defined the 9-value logic types: scalar std_ulogic and its vector version std_ulogic_vector. Thyristors are able to withstand very high reverse breakdown voltage and are also capable of carrying high current. The size, latency, throughput and connectivity of memories within the system are also microarchitectural decisions. Advancing technology makes more complex and powerful chips feasible to manufacture. For example driver circuit
MC1489AP,MC1489AP,Comments from user about MC1489AP: For quantities that vary polynomially or logarithmically with temperature, it may be possible to calculate a temperature coefficient that is a useful approximation for a certain range of temperatures. These techniques use convection, conduction, & radiation of heat energy. Basically, an IGBT is a bipolar transistor driven by a power MOSFET: it has the advantages of being a minority carrier device (good performance in on-state, even for high voltage devices), with the high input impedance of a MOSFET (it can be driven on or off with a very low amount of power). The pipelined datapath is the most commonly used datapath design in microarchitecture today. A passive component, depending on field, may be either a component that consumes (but does not produce) energy (thermodynamic passivity), or a component that is incapable of power gain (incremental passivity). These units perform the operations or calculations of the processor. The complexity of an integrated circuit is bounded by physical limitations of the number of transistors that can be put onto one chip, the number of package terminations that can connect the processor to other parts of the system, the number of interconnections it is possible to make on the chip, and the heat that the chip can dissipate. With operating systems Windows XP x64, Windows Vista x64, Windows 7 x64, Linux, BSD and Mac OS X that run 64-bit native, the software is also geared to fully utilize the capabilities of such processors. Anything related to :MC1489AP, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: MC1489APSee also: