Part: XCV400E-6FG676C

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Previous Parts:XC68606FN16,XC7336-7P44C,XC95144XL-10TQ144C,XC95216-10HQ208I,XC95216PQ160,XC9572XV-7TQ100C,XCEZ328ZC16V,XCS05XL-4VQ100I,XCS103VQ100C,XCS10XL-4VQG100Q,XCS30XL-4VQ100AKP,XCV1000E-7FG1156C,XCV1000E-8FG680CES,XCV150-4FG456I,XCV1600E-6FG1156I,XCV1600E-7BG560C

The followings are offers provided by our member in Electronic Components Offer site about the following parts: XCV400E-6FG676C":

Post DatePart NumberBrandD/CDescQtyCompany
Sat Sep 2 01:48:00 UTC 2006XCV400E-6FG676C (from hkin.com)Xilinx03+BGA137HongKong MingXing Electronics Company
Sat Sep 2 01:48:00 UTC 2006XCV400E-6FG676C (from standard server 2)Xilinx03+BGA137HongKong MingXing Electronics Company
Sat Sep 2 01:48:00 UTC 2006XCV400E-6FG676C (from parts server 2)Xilinx03+BGA137HongKong MingXing Electronics Company
Sat Sep 2 01:48:00 UTC 2006XCV400E-6FG676C (from hkin.com 2)Xilinx03+BGA137HongKong MingXing Electronics Company
Sat Sep 2 01:48:00 UTC 2006XCV400E-6FG676C (from hkin.com 2)Xilinx03+BGA137HongKong MingXing Electronics Company
Thu Sep 28 13:26:00 UTC 2006XCV400E-6FG676C (from hkin.com)XILINX1064ARCBASE ELECTRONICS CO., LIMITED
Thu Sep 28 13:26:00 UTC 2006XCV400E-6FG676C (from standard server 2)XILINX1064ARCBASE ELECTRONICS CO., LIMITED
Thu Sep 28 13:26:00 UTC 2006XCV400E-6FG676C (from parts server 2)XILINX1064ARCBASE ELECTRONICS CO., LIMITED
Thu Sep 28 13:26:00 UTC 2006XCV400E-6FG676C (from hkin.com 2)XILINX1064ARCBASE ELECTRONICS CO., LIMITED
Thu Sep 28 13:26:00 UTC 2006XCV400E-6FG676C (from hkin.com 2)XILINX1064ARCBASE ELECTRONICS CO., LIMITED
Sat Sep 30 01:38:00 UTC 2006XCV400E-6FG676C (from hkin.com)XILINX00/01+25Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:38:00 UTC 2006XCV400E-6FG676C (from standard server 2)XILINX00/01+25Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:38:00 UTC 2006XCV400E-6FG676C (from parts server 2)XILINX00/01+25Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:38:00 UTC 2006XCV400E-6FG676C (from hkin.com 2)XILINX00/01+25Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:38:00 UTC 2006XCV400E-6FG676C (from hkin.com 2)XILINX00/01+25Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:38:00 UTC 2006XCV400E-6FG676C (from hkin.com)XILINX05+1888Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:38:00 UTC 2006XCV400E-6FG676C (from standard server 2)XILINX05+1888Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:38:00 UTC 2006XCV400E-6FG676C (from parts server 2)XILINX05+1888Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:38:00 UTC 2006XCV400E-6FG676C (from hkin.com 2)XILINX05+1888Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:38:00 UTC 2006XCV400E-6FG676C (from hkin.com 2)XILINX05+1888Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 09:36:00 UTC 2006XCV400E-6FG676C (from hkin.com)XILINX2003BGA20ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Sat Sep 30 09:36:00 UTC 2006XCV400E-6FG676C (from standard server 2)XILINX2003BGA20ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Sat Sep 30 09:36:00 UTC 2006XCV400E-6FG676C (from parts server 2)XILINX2003BGA20ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Sat Sep 30 09:36:00 UTC 2006XCV400E-6FG676C (from hkin.com 2)XILINX2003BGA20ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Sat Sep 30 09:36:00 UTC 2006XCV400E-6FG676C (from hkin.com 2)XILINX2003BGA20ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Wed Sep 27 10:13:00 UTC 2006XCV400E-6FG676C (from hkin.com)XILINXBGA300HK CO-FLYING INDUSTRY LIMITED
Wed Sep 27 10:13:00 UTC 2006XCV400E-6FG676C (from standard server 2)XILINXBGA300HK CO-FLYING INDUSTRY LIMITED
Wed Sep 27 10:13:00 UTC 2006XCV400E-6FG676C (from parts server 2)XILINXBGA300HK CO-FLYING INDUSTRY LIMITED
Wed Sep 27 10:13:00 UTC 2006XCV400E-6FG676C (from hkin.com 2)XILINXBGA300HK CO-FLYING INDUSTRY LIMITED
Wed Sep 27 10:13:00 UTC 2006XCV400E-6FG676C (from hkin.com 2)XILINXBGA300HK CO-FLYING INDUSTRY LIMITED

Last record XCV1600E-7BG560C:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Sep 30 01:39:00 UTC 2006XCV1600E-7BG560C (from hkin.com)XILINX05+1888Shen Zhen OML Technology Co.,Ltd

Last record XCV1600E-6FG1156I:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Sep 30 01:37:00 UTC 2006XCV1600E-6FG1156I (from hkin.com)XILINX05+1888Shen Zhen OML Technology Co.,Ltd
Wed Sep 27 10:14:00 UTC 2006XCV1600E-6FG1156I (from hkin.com)XILINX01+BGA300HK CO-FLYING INDUSTRY LIMITED

Last record XCV150-4FG456I:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Sep 27 13:03:00 UTC 2006XCV150-4FG456I (from hkin.com)XILINX140ARCBASE ELECTRONICS CO., LIMITED

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XCV400E-6FG676C,XCV400E-6FG676C,Comments from user about XCV400E-6FG676C: In the mid-1980s to early-1990s, a crop of new high-performance Reduced Instruction Set Computer (RISC) microprocessors appeared, influenced by discrete RISC-like CPU designs such as the IBM 801 and others. This is the ratio of the electric charge on each conductor to the potential difference between them. The thyristor appeared in 1957. Unlike a fuse, which operates once and then has to be replaced, a circuit breaker can be reset (either manually or automatically) to resume normal operation. Actually, all power semiconductors rely on a PIN diode structure to sustain voltage. These units perform the operations or calculations of the processor. These diagrams generally separate the datapath (where data is placed) and the control path (which can be said to steer the data). Cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time. Anything related to :XCV400E-6FG676C, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: XCV400E-6FG676C, search hkinventory: XCV400E-6FG676C, A light-emitting diode (LED) is a semiconductor light source. This effect is called electroluminescence and the color of the light (corresponding to the energy of the photon) is determined by the energy gap of the semiconductor. By paralleling several devices, it is possible to increase the current rating of a switch. Latches are designed to be transparent. Datasheet Dir, DataSheet Archive
The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to precisely control the location and concentration of p- and n-type dopants. Typically this will be a vacuum tube, or solid-state (transistor or operational amplifier). A digital signal processor (DSP) is specialized for signal processing. The size of data objects became larger; allowing more transistors on a chip allowed word sizes to increase from 4- and 8-bit words up to today's 64-bit words. A single operation code might affect many individual data paths, registers, and other elements of the processor. While this required extra logic to handle, for example, carry and overflow within each slice, the result was a system that could handle, say, 32-bit words using integrated circuits with a capacity for only 4 bits each. The logic section retrieves instruction operation codes from memory, and iniates whatever sequence of operations of the ALU required to carry out the instruction. This CPU cache has the advantage of faster access than off-chip memory, and increses the processing speed of the system for many applications.
any passive component and active component such as:Diode, Continued increases in microprocessor capacity have rendered other forms of computers almost completely obsolete (see history of computing hardware), with one or more microprocessors used in everything from the smallest embedded systems and handheld devices to the largest mainframes and supercomputers. They are also called power devices or when used in integrated circuits, called power ICs. The degree to which unwanted signals should be rejected. Later products include personal computers, telephones, MP3 players, audio equipment, televisions, calculators, GPS automotive electronics, digital cameras and players and recorders using video media such as DVDs, VCRs or camcorders. For example driver circuit
XCV400E-6FG676C,XCV400E-6FG676C,Comments from user about XCV400E-6FG676C: However, some systems use the reverse definition ("0" is "High") or are current based. Although the MOSFET is named in part for its "metal" gate, in modern devices polysilicon is typically used instead. From the time that the processor's instruction decoder has figured out that it has encountered a conditional branch instruction to the time that the deciding register value can be read out, the pipeline needs to be stalled for several cycles, or if it's not and the branch is taken, the pipeline needs to be flushed. An LED is often small in area (less than 1 mm2), and integrated optical components may be used to shape its radiation pattern. Although several companies each produce over a billion individually packaged (known as discrete) transistors every year, the vast majority of transistors now produced are in integrated circuits (often shortened to IC, microchips or simply chips), along with diodes, resistors, capacitors and other electronic components, to produce complete electronic circuits. The number of different analog circuits so far devised is huge, especially because a 'circuit' can be defined as anything from a single component, to systems containing thousands of components. A digital signal processor (DSP) is specialized for signal processing. The MOSFET is the most used semiconductor device today. Anything related to :XCV400E-6FG676C, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: XCV400E-6FG676CSee also: