Part: 74LS157D

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Previous Parts:74FCT162501CTPV,74HC02RM13TR,74HC06,74HC08D,74HC138D 653 SMD REEL LEADFREE,74HC373N,74HC573D 653 SMD REEL LEADFREE,74HC688N,74HCT157,74HL33374DB,74LCX07M,74LCX08MX,74LCX157MX,74LQ541,74LS02,74LS145P

The followings are offers provided by our member in Electronic Components Offer site about the following parts: 74LS157D":

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 18 08:50:00 UTC 200674LS157D (from hkin.com)LGS*SOP-3.9MM2500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:50:00 UTC 200674LS157D (from standard server 2)LGS*SOP-3.9MM2500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:50:00 UTC 200674LS157D (from parts server 2)LGS*SOP-3.9MM2500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:50:00 UTC 200674LS157D (from hkin.com 2)LGS*SOP-3.9MM2500KAM MING TIK (HK) ELECTRON CO.
Mon Sep 18 08:50:00 UTC 200674LS157D (from hkin.com 2)LGS*SOP-3.9MM2500KAM MING TIK (HK) ELECTRON CO.

Last record 74LS145P:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Sep 30 01:53:00 UTC 200674LS145P (from hkin.com)HITACHI2004DIP9570HONGKONG FEILONG INDUSTRY INTERNATIONAL LIMITED

Last record 74LS02:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 26 10:14:00 UTC 200674LS02 (from hkin.com)TI3.9mm5KE JIE DA (HONGKONG) ELECTRONICS CO., LIMITED
Wed Sep 20 08:54:00 UTC 200674LS02 (from hkin.com)TI2000BEST (HK) ELECTRONICS LIMITED
Thu Sep 28 02:04:00 UTC 200674LS02 (from hkin.com)TI05+DIP200FIGOER INT'L LIMITED
Tue Sep 26 10:14:00 UTC 200674LS02D (from hkin.com)PHI3.9mm759KE JIE DA (HONGKONG) ELECTRONICS CO., LIMITED
Sat Sep 30 01:30:00 UTC 200674LS02N (from hkin.com)NSDIP100Shenzhen Ki Chuan Electronics Co;Ltd
Sat Sep 30 01:53:00 UTC 200674LS02N (from hkin.com)FSC2004DIP300HONGKONG FEILONG INDUSTRY INTERNATIONAL LIMITED
Sat Sep 30 01:53:00 UTC 200674LS02N (from hkin.com)TI2003DIP995HONGKONG FEILONG INDUSTRY INTERNATIONAL LIMITED
Thu Sep 28 02:28:00 UTC 200674LS02N (from hkin.com)TI2003DIP125Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:53:00 UTC 200674LS02P (from hkin.com)RENESAS2005DIP95400HONGKONG FEILONG INDUSTRY INTERNATIONAL LIMITED

Last record 74LQ541:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 12 16:17:00 UTC 200674LQ541 (from hkin.com)ST01+200Dunfa Industrial Co., Limited

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74LS157D,74LS157D,Comments from user about 74LS157D: Alternatively, additional logic can be added to a simple transparent latch to make it non-transparent or opaque when another input (an "enable" input) is not asserted. Circuit breakers for large currents or high voltages are usually arranged with pilot devices to sense a fault current and to operate the trip opening mechanism. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. Because the cores are physically very close to each other, they can communicate with each other much faster than separate processors in a multiprocessor system, which improves overall system performance. Many products include Internet connectivity using technologies such as Wi-Fi, Bluetooth or Ethernet. The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to precisely control the location and concentration of p- and n-type dopants. This problem is caused by the slow decay of the conduction current during turn-off resulting from slow recombination of large number of carriers, which flood the thick 'drift' region of the IGBT during conduction. These include large and small household appliances, cars (and their accessory equipment units), car keys, tools and test instruments, toys, light switches/dimmers and electrical circuit breakers, smoke alarms, battery packs, and hi-fi audio/visual components (from DVD players to phonograph turntables.) Such products as cellular telephones, DVD video system and ATSC HDTV broadcast system fundamentally require consumer devices with powerful, low-cost, microprocessors. Anything related to :74LS157D, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: 74LS157D, search hkinventory: 74LS157D, Computers, electronic clocks, and programmable logic controllers (used to control industrial processes) are constructed of digital circuits. The field may be applied by a reverse-biased p-n junction, forming a junction field effect transistor, or JFET; or by an electrode isolated from the bulk material by an oxide layer, forming a metal-oxide-semiconductor field effect transistor, or MOSFET. The circuit breaker must detect a fault condition; in low-voltage circuit breakers this is usually done within the breaker enclosure. The design of pipelines is one of the central microarchitectural tasks. Datasheet Dir, DataSheet Archive
Produced at Fairchild Semiconductor, it was made of silicon, whereas Kilby's chip was made of germanium. They are also called power devices or when used in integrated circuits, called power ICs. Consumer electronics are electronic equipment intended for everyday use, most often in entertainment, communications and office productivity. This effectively multiplies the processor's potential performance by the number of cores (as long as the operating system and software is designed to take advantage of more than one processor core). Desirable properties of MOSFETs, such as their utility in low-power devices, usually in the CMOS configuration, allowed them to capture nearly all market share for digital circuits; more recently MOSFETs have captured most analog and power applications as well, including modern clocked analog circuits, voltage regulators, amplifiers, power transmitters, motor drivers, etc. They are also called power devices or when used in integrated circuits, called power ICs. Performance is high because the components switch quickly and consume little power (compared to their discrete counterparts) as a result of the small size and close proximity of the components.1 (known as VHDL-AMS) provided analog and mixed-signal circuit design extensions.
any passive component and active component such as:Diode, The complexity of an integrated circuit is bounded by physical limitations of the number of transistors that can be put onto one chip, the number of package terminations that can connect the processor to other parts of the system, the number of interconnections it is possible to make on the chip, and the heat that the chip can dissipate. In practice the dielectric between the plates passes a small amount of leakage current and also has an electric field strength limit, resulting in a breakdown voltage, while the conductors and leads introduce an undesired inductance and resistance. A multi-core processor is simply a single chip containing more than one microprocessor core. The amount of the voltage drop depends on the semiconductor material and the doping concentrations. For example driver circuit
74LS157D,74LS157D,Comments from user about 74LS157D: Passivity, in most cases, can be used to demonstrate that passive circuits will be stable under specific criteria. Modern designs have rather complex statistical prediction systems, which watch the results of past branches to predict the future with greater accuracy. When the reverse bias breakdown voltage is exceeded, a conventional diode is subject to high current due to avalanche breakdown. Sun Microsystems has released the Niagara and Niagara 2 chips, both of which feature an eight-core design. With the vertical structure, the current rating of the device is proportional to its area, and the voltage blocking capability is achieved in the height of the die. They use electronic conduction in the solid state as opposed to the gaseous state or thermionic emission in a high vacuum. The size, latency, throughput and connectivity of memories within the system are also microarchitectural decisions. Often logic "0" will be a lower voltage and referred to as "Low" while logic "1" is referred to as "High". Anything related to :74LS157D, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: 74LS157DSee also: