Part: XC3030-50

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Offer Index 11

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Part Numbers

Previous Parts:WM9710G,X28C256JI-20T2,X9315W,X9410WS,X94R01,X9C503P,XC145660COGC,XC18V01SC,XC2S150-5QP208C,XC2S15-5TQ144C,XC2S200-5 FG456C,XC2S50-5FG256C,XC2V4000-5FF1152I,XC2V500-6FG256C,XC2V6000-5FF1152I,XC2V80-4FG256I

The followings are offers provided by our member in Electronic Components Offer site about the following parts: XC3030-50":

Post DatePart NumberBrandD/CDescQtyCompany
Thu Sep 21 01:53:00 UTC 2006XC3030-50 (from hkin.com)XILINX04+2Shenzhou Kunpeng Science & Tech Co.
Thu Sep 21 01:53:00 UTC 2006XC3030-50 (from standard server 2)XILINX04+2Shenzhou Kunpeng Science & Tech Co.
Thu Sep 21 01:53:00 UTC 2006XC3030-50 (from parts server 2)XILINX04+2Shenzhou Kunpeng Science & Tech Co.
Thu Sep 21 01:53:00 UTC 2006XC3030-50 (from hkin.com 2)XILINX04+2Shenzhou Kunpeng Science & Tech Co.
Thu Sep 21 01:53:00 UTC 2006XC3030-50 (from hkin.com 2)XILINX04+2Shenzhou Kunpeng Science & Tech Co.
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC44C (from hkin.com)XILINX102ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC44C (from standard server 2)XILINX102ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC44C (from parts server 2)XILINX102ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC44C (from hkin.com 2)XILINX102ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC44C (from hkin.com 2)XILINX102ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC44I (from hkin.com)XILINX261ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC44I (from standard server 2)XILINX261ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC44I (from parts server 2)XILINX261ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC44I (from hkin.com 2)XILINX261ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC44I (from hkin.com 2)XILINX261ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC68C (from hkin.com)XILINX836ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC68C (from standard server 2)XILINX836ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC68C (from parts server 2)XILINX836ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC68C (from hkin.com 2)XILINX836ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC68C (from hkin.com 2)XILINX836ARCBASE ELECTRONICS CO., LIMITED
Sat Sep 30 01:49:00 UTC 2006XC3030-50PC68C (from hkin.com)XILINX200Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006XC3030-50PC68C (from standard server 2)XILINX200Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006XC3030-50PC68C (from parts server 2)XILINX200Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006XC3030-50PC68C (from hkin.com 2)XILINX200Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:49:00 UTC 2006XC3030-50PC68C (from hkin.com 2)XILINX200Shen Zhen OML Technology Co.,Ltd
Fri Sep 1 12:38:00 UTC 2006XC3030-50PC68C (from hkin.com)XILINX200ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Fri Sep 1 12:38:00 UTC 2006XC3030-50PC68C (from standard server 2)XILINX200ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Fri Sep 1 12:38:00 UTC 2006XC3030-50PC68C (from parts server 2)XILINX200ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Fri Sep 1 12:38:00 UTC 2006XC3030-50PC68C (from hkin.com 2)XILINX200ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Fri Sep 1 12:38:00 UTC 2006XC3030-50PC68C (from hkin.com 2)XILINX200ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC68I (from hkin.com)XILINX172ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC68I (from standard server 2)XILINX172ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC68I (from parts server 2)XILINX172ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC68I (from hkin.com 2)XILINX172ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC68I (from hkin.com 2)XILINX172ARCBASE ELECTRONICS CO., LIMITED
Sat Sep 30 01:44:00 UTC 2006XC3030-50PC68I (from hkin.com)XILINX150Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:44:00 UTC 2006XC3030-50PC68I (from standard server 2)XILINX150Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:44:00 UTC 2006XC3030-50PC68I (from parts server 2)XILINX150Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:44:00 UTC 2006XC3030-50PC68I (from hkin.com 2)XILINX150Shen Zhen OML Technology Co.,Ltd
Sat Sep 30 01:44:00 UTC 2006XC3030-50PC68I (from hkin.com 2)XILINX150Shen Zhen OML Technology Co.,Ltd
Fri Sep 1 12:38:00 UTC 2006XC3030-50PC68I (from hkin.com)XILINX200ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Fri Sep 1 12:38:00 UTC 2006XC3030-50PC68I (from standard server 2)XILINX200ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Fri Sep 1 12:38:00 UTC 2006XC3030-50PC68I (from parts server 2)XILINX200ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Fri Sep 1 12:38:00 UTC 2006XC3030-50PC68I (from hkin.com 2)XILINX200ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Fri Sep 1 12:38:00 UTC 2006XC3030-50PC68I (from hkin.com 2)XILINX200ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC84C (from hkin.com)XILINX7238ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC84C (from standard server 2)XILINX7238ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC84C (from parts server 2)XILINX7238ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC84C (from hkin.com 2)XILINX7238ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC84C (from hkin.com 2)XILINX7238ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC84I (from hkin.com)XILINX4414ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC84I (from standard server 2)XILINX4414ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC84I (from parts server 2)XILINX4414ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC84I (from hkin.com 2)XILINX4414ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PC84I (from hkin.com 2)XILINX4414ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PQ100C (from hkin.com)XILINX90ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PQ100C (from standard server 2)XILINX90ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PQ100C (from parts server 2)XILINX90ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PQ100C (from hkin.com 2)XILINX90ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PQ100C (from hkin.com 2)XILINX90ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PQ100I (from hkin.com)XILINX113ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PQ100I (from standard server 2)XILINX113ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PQ100I (from parts server 2)XILINX113ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PQ100I (from hkin.com 2)XILINX113ARCBASE ELECTRONICS CO., LIMITED
Wed Sep 27 12:57:00 UTC 2006XC3030-50PQ100I (from hkin.com 2)XILINX113ARCBASE ELECTRONICS CO., LIMITED

Last record XC2V80-4FG256I:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Sep 30 02:11:00 UTC 2006XC2V80-4FG256I (from hkin.com)XILINX41DONG YI(INTERNATIONAL) ELECTRONICS CO.LTD

Last record XC2V6000-5FF1152I:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Sep 30 02:11:00 UTC 2006XC2V6000-5FF1152I (from hkin.com)XILINX10DONG YI(INTERNATIONAL) ELECTRONICS CO.LTD

Last record XC2V500-6FG256C:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Sep 30 02:11:00 UTC 2006XC2V500-6FG256C (from hkin.com)XILINX25DONG YI(INTERNATIONAL) ELECTRONICS CO.LTD

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vid:offerengine20111021

XC3030-50,XC3030-50,Comments from user about XC3030-50: As clock speeds increase the depth of the pipeline increases with it, and some modern processors may have 20 stages or more. This CPU cache has the advantage of faster access than off-chip memory, and increses the processing speed of the system for many applications. A minimal hypothetical microprocessor might only include an arithmetic logic unit (ALU) and a control logic section.0 also informally known as VHDL 2008, which addressed more than 90 issues discovered during the trial period for version 3. Being created for one element base, a computing device project can be ported on another element base, for example VLSI with various technologies. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. These diagrams generally separate the datapath (where data is placed) and the control path (which can be said to steer the data). The key advantage of VHDL, when used for systems design, is that it allows the behavior of the required system to be described (modeled) and verified (simulated) before synthesis tools translate the design into real hardware (gates and wires). Anything related to :XC3030-50, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: XC3030-50, search hkinventory: XC3030-50, A conventional solid-state diode will not allow significant current if it is reverse-biased below its reverse breakdown voltage. With this structure, one of the connections of the device is located on the bottom of the semiconductor die.1 (known as VHDL-AMS) provided analog and mixed-signal circuit design extensions. Semiconductor components benefit from Moore's Law, an observed principle which states that, for a given price, semiconductor functionality doubles every two years. Datasheet Dir, DataSheet Archive
The gate electrode is charged to produce an electric field that controls the conductivity of a "channel" between two terminals, called the source and drain. In addition to IEEE standard 1164, several child standards were introduced to extend functionality of the language.0 to the IEEE for balloting for inclusion in IEEE 1076-2008. It is relatively easy for an inexperienced developer to produce code that simulates successfully but that cannot be synthesized into a real device, or is too large to be practical. When used in a finite-state machine, the output and next state depend not only on its current input, but also on its current state (and hence, previous inputs.) It can also be used for counting of pulses, and for synchronizing variably-timed input signals to some reference timing signal. Unlike a fuse, which operates once and then has to be replaced, a circuit breaker can be reset (either manually or automatically) to resume normal operation. Flip-flops and latches are a fundamental building block of digital electronics systems used in computers, communications, and many other types of systems. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements.
any passive component and active component such as:Diode, When a light-emitting diode is forward biased (switched on), electrons are able to recombine with electron holes within the device, releasing energy in the form of photons. The junctions which form where n-type and p-type semiconductors join together are called p-n junctions. Keeping up with Moore's Law is becoming increasingly challenging as chip-making technologies approach their physical limits. Speculative execution is a further enhancement in which the code along the predicted path is not just prefetched but also executed before it is known whether the branch should be taken or not. For example driver circuit
XC3030-50,XC3030-50,Comments from user about XC3030-50: Digital circuits are the most common physical representation of Boolean algebra and are the basis of all digital computers. Doping a semiconductor such as silicon with a small amount of impurity atoms, such as phosphorus or boron, greatly increases the number of free electrons or holes within the semiconductor. The first bipolar transistors devices with substantial power handling capabilities were introduced in the 1960s. This creates a much larger current between the collector and emitter, controlled by the base-emitter current. A capacitor is a passive electronic component consisting of a pair of conductors separated by a dielectric (insulator). Generally, in datasheets, turn-off energy is mentioned as a measured parameter and one has to multiply that number with the switching frequency of the intended application to estimate the turn-off loss. As it is a physical limit, no improvement is expected from silicon MOSFETs concerning their maximum voltage ratings. The microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. Anything related to :XC3030-50, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: XC3030-50See also: