Part: HSMP-381E

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Previous Parts:HM629127HJP-20,HM62W8512BLTT-5,HM9270D,HMBT468,HMC149S14,HMC174MS8,HMC310MS8G,HMC327MS8G,HN1K02FU/K1,HPA1456H,HPFC-5100C/2.3,HSD150PKX14,HSD150PUX15,HSD15PK14,HSM221C,HSM88AS

The followings are offers provided by our member in Electronic Components Offer site about the following parts: HSMP-381E":

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 11 08:30:00 UTC 2006HSMP-381E (from hkin.com)Agilent03+/04+Stock;SOT-323 (SC-70) common anode pair ;3000pcs/reel81000High-E Electronics Co.,Limited
Mon Sep 11 08:30:00 UTC 2006HSMP-381E (from standard server 2)Agilent03+/04+Stock;SOT-323 (SC-70) common anode pair ;3000pcs/reel81000High-E Electronics Co.,Limited
Mon Sep 11 08:30:00 UTC 2006HSMP-381E (from parts server 2)Agilent03+/04+Stock;SOT-323 (SC-70) common anode pair ;3000pcs/reel81000High-E Electronics Co.,Limited
Mon Sep 11 08:30:00 UTC 2006HSMP-381E (from hkin.com 2)Agilent03+/04+Stock;SOT-323 (SC-70) common anode pair ;3000pcs/reel81000High-E Electronics Co.,Limited
Mon Sep 11 08:30:00 UTC 2006HSMP-381E (from hkin.com 2)Agilent03+/04+Stock;SOT-323 (SC-70) common anode pair ;3000pcs/reel81000High-E Electronics Co.,Limited
Thu Sep 21 07:59:00 UTC 2006HSMP-381E-TR1 (from hkin.com)Agilent03+/04+10000KETAI ELECTRONICS (HK)LIMITED
Thu Sep 21 07:59:00 UTC 2006HSMP-381E-TR1 (from standard server 2)Agilent03+/04+10000KETAI ELECTRONICS (HK)LIMITED
Thu Sep 21 07:59:00 UTC 2006HSMP-381E-TR1 (from parts server 2)Agilent03+/04+10000KETAI ELECTRONICS (HK)LIMITED
Thu Sep 21 07:59:00 UTC 2006HSMP-381E-TR1 (from hkin.com 2)Agilent03+/04+10000KETAI ELECTRONICS (HK)LIMITED
Thu Sep 21 07:59:00 UTC 2006HSMP-381E-TR1 (from hkin.com 2)Agilent03+/04+10000KETAI ELECTRONICS (HK)LIMITED
Sat Sep 23 02:15:00 UTC 2006HSMP-381E-TR1 (from hkin.com)Agilent00+14580XINXUN (HK) ELECTRONIC CO.,LIMITED
Sat Sep 23 02:15:00 UTC 2006HSMP-381E-TR1 (from standard server 2)Agilent00+14580XINXUN (HK) ELECTRONIC CO.,LIMITED
Sat Sep 23 02:15:00 UTC 2006HSMP-381E-TR1 (from parts server 2)Agilent00+14580XINXUN (HK) ELECTRONIC CO.,LIMITED
Sat Sep 23 02:15:00 UTC 2006HSMP-381E-TR1 (from hkin.com 2)Agilent00+14580XINXUN (HK) ELECTRONIC CO.,LIMITED
Sat Sep 23 02:15:00 UTC 2006HSMP-381E-TR1 (from hkin.com 2)Agilent00+14580XINXUN (HK) ELECTRONIC CO.,LIMITED
Mon Sep 11 08:30:00 UTC 2006HSMP-381E-TR1 (from hkin.com)Agilent03+/04+Stock;SOT-323 (SC-70) common anode pair ;3000pcs/reel81000High-E Electronics Co.,Limited
Mon Sep 11 08:30:00 UTC 2006HSMP-381E-TR1 (from standard server 2)Agilent03+/04+Stock;SOT-323 (SC-70) common anode pair ;3000pcs/reel81000High-E Electronics Co.,Limited
Mon Sep 11 08:30:00 UTC 2006HSMP-381E-TR1 (from parts server 2)Agilent03+/04+Stock;SOT-323 (SC-70) common anode pair ;3000pcs/reel81000High-E Electronics Co.,Limited
Mon Sep 11 08:30:00 UTC 2006HSMP-381E-TR1 (from hkin.com 2)Agilent03+/04+Stock;SOT-323 (SC-70) common anode pair ;3000pcs/reel81000High-E Electronics Co.,Limited
Mon Sep 11 08:30:00 UTC 2006HSMP-381E-TR1 (from hkin.com 2)Agilent03+/04+Stock;SOT-323 (SC-70) common anode pair ;3000pcs/reel81000High-E Electronics Co.,Limited

Last record HSM88AS:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 11 04:15:00 UTC 2006HSM88AS (from hkin.com)RENESAS0612000ShenZhen KaiRuiFu Electronics Trading Company
Mon Sep 11 04:15:00 UTC 2006HSM88ASR (from hkin.com)RENESAS0630000ShenZhen KaiRuiFu Electronics Trading Company

Last record HSM221C:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 5 01:31:00 UTC 2006HSM221C (from hkin.com)SOT-232004HITACHI150000Creator International (HK) Ltd.,
Wed Sep 13 21:39:00 UTC 2006HSM221CTL (from hkin.com)RENESAS3F4IN OUR STOCK9000Metrocomp UK Limited
Wed Sep 20 11:23:00 UTC 2006HSM221CTR (from hkin.com)HITACHISOT-23370BEST (HK) ELECTRONICS LIMITED

Last record HSD15PK14:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Sep 25 07:29:00 UTC 2006HSD15PK14 (from hkin.com)1515HongKong Truly Electronics Tech Co.,Ltd

If you want to find more about HSMP-381E, please visit us on HKin


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HSMP-381E,HSMP-381E,Comments from user about HSMP-381E: Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies, made possible by the low cost of production of integrated circuits. When used in a finite-state machine, the output and next state depend not only on its current input, but also on its current state (and hence, previous inputs.) It can also be used for counting of pulses, and for synchronizing variably-timed input signals to some reference timing signal. Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage. A power diode or MOSFET operates on similar principles to its low-power counterpart, but is able to carry a larger amount of current and typically is able to support a larger reverse-bias voltage in the off-state. These techniques use convection, conduction, & radiation of heat energy. In principle, a single microarchitecture could execute several different ISAs with only minor changes to the microcode. That is, input signal changes cause immediate changes in output; when several transparent latches follow each other, using the same clock signal, signals can propagate through all of them at once. Soon every major vendor was releasing a RISC design, including the AT&T CRISP, AMD 29000, Intel i860 and Intel i960, Motorola 88000, DEC Alpha. Anything related to :HSMP-381E, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: HSMP-381E, search hkinventory: HSMP-381E, Sometimes it may be difficult to differentiate between analog and digital circuits as they have elements of both linear and non-linear operation. For quantities that vary exponentially with temperature, such as the rate of a chemical reaction, any temperature coefficient would be valid only over a very small temperature range. IEEE standard 1076. With this structure, one of the connections of the device is located on the bottom of the semiconductor die. Datasheet Dir, DataSheet Archive
As of 2009, dual-core and quad-core processors are widely used in servers, workstations and PCs while six and eight-core processors will be available for high-end applications in both the home and professional environments. In addition to IEEE standard 1164, several child standards were introduced to extend functionality of the language. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using electronic components. Light-emitting diodes are used in applications as diverse as replacements for aviation lighting, automotive lighting (particularly brake lamps, turn signals and indicators) as well as in traffic signals. Flip-flops and latches are used as data storage elements. Latches are designed to be transparent.0 of VHDL-2006. An integrated circuit or monolithic integrated circuit (also referred to as IC, chip, and microchip) is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material.
any passive component and active component such as:Diode, A power diode or MOSFET operates on similar principles to its low-power counterpart, but is able to carry a larger amount of current and typically is able to support a larger reverse-bias voltage in the off-state. While this required extra logic to handle, for example, carry and overflow within each slice, the result was a system that could handle, say, 32-bit words using integrated circuits with a capacity for only 4 bits each. Digital Signal Processors are another example. In control systems and circuit network theory, a passive component or circuit is one that consumes energy, but does not produce energy. For example driver circuit
HSMP-381E,HSMP-381E,Comments from user about HSMP-381E: Because the cores are physically very close to each other, they can communicate with each other much faster than separate processors in a multiprocessor system, which improves overall system performance. Compared to the MOSFET, the operating frequency of the IGBT is relatively low (few devices are rated over 50 kHz), mainly because of a so-called 'current-tail' problem during turn-off. In this case, it might be possible to use VHDL to write a testbench to verify the functionality of the design using files on the host computer to define stimuli, to interact with the user, and to compare results with those expected. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. Semiconductor devices have replaced thermionic devices (vacuum tubes) in most applications. Execution units are also essential to microarchitecture. During the 1960s, computer processors were constructed out of small and medium-scale ICs each containing from tens to a few hundred transistors. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using electronic components. Anything related to :HSMP-381E, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: HSMP-381ESee also: