Part: 2DI30D-050

Index Files Offer Index 9 HYNIX, JRC, STMICROELECTRONICS, ISSI, REALTEK, IDT, FUJITSU, BOURNS, LITTELFUSE, POWER, SEIKO, MIC, SILICON, ELPIDA, TE, SONY, TRACO, EPCOS, MPS, BB, EUPEC, SST, RECOM, COSEL, CREE, IC, DIODES, SIPEX, CIRRUS, QFN, HVCA, CJ(CHINA), EPSON, SPANSION, NXP/PHI, CONEXANT, BB/TI, ASTEC, AOS, TI , JAE, TI, AD, ST, XILINX, MAX, NS, ATMEL, ALTERA, SAMSUNG, NXP, MICROCHIP, INTEL, FSC, CY, TOS, MURATA, FUJI, PANASONIC, ON, INFINEON, AVX, IR, MICRON, MIT, LINEAR, SEMIKRON, VISHAY, LATTICE, BRIGHT, 模块, MOT, FREESCALE, NVIDIA, NEC, ROHM, SANYO, PHI, BROADCOM, AMD, DALLAS, YAGEO, QUALCOMM, SHARP, INTERSIL, RENESAS, HARVATEK, AVAGO, KEMET, HIT, COOPER, MICREL, MOLEX, ISD/NUVOTON, TDK, JRC, ISSI, HYNIX, ATI, IDT, COILCRAFT, FUJITSU, BOURNS, LITTELFUSE, SEIKO, TE, ELPIDA, TRACO, SONY, POWER, EPCOS, MPS, RECOM, EUPEC, SST, COSEL, CREE, IC, EVERLIGHT, SILICON, QFN, CIRRUS, CJ(CHINA), SIPEX, BB, NXP/PHI, EPSON, DIODES, ASTEC, AOS, TI , SPANSION, JAE, JST, CONEXANT, MXIC, AUO, EXAR(SIPEX), MIC, REALTEK, AT, TI, AD, ST, ALTERA, MAX, XILINX, NS, ATMEL, NXP, SAMSUNG, MICROCHIP, INTEL, CY, FSC, TOS, MURATA, PANASONIC, ON, INFINEON, AVX, FUJI, IR, SEMIKRON, MICRON, LINEAR, VISHAY, LATTICE, MIT, BRIGHT, 模块, FREESCALE, NEC, MOT, NVIDIA, ROHM, SANYO, BROADCOM, AMD, PHI, QUALCOMM, STMICROELECTRONICS, DALLAS, RENESAS, YAGEO, SHARP, INTERSIL, HIT, AVAGO, HARVATEK, KEMET, COOPER, MICREL, MOLEX, ISD/NUVOTON, TDK, JRC, ISSI, HYNIX, ATI, IDT, FUJITSU, COILCRAFT, BOURNS, LITTELFUSE, SEIKO, EUPEC, TE, ELPIDA, SONY, TRACO, MPS, POWER, EPCOS, SST, RECOM, ASTEC, CREE, SILICON, IC, EVERLIGHT, CIRRUS, ABB, QFN, BB, CJ(CHINA), EPSON, SIPEX, NXP/PHI, DIODES, ALLEGRO, AOS, IXYS, TI , FTDI, SPANSION, VICOR, JAE, JST, MXIC, CONEXANT, TI, AD, ST, ALTERA, XILINX, NS, MAX, ATMEL, NXP, SAMSUNG, MICROCHIP, INTEL, CY, MURATA, FSC, PANASONIC, TOS, ON, INFINEON, AVX, IR, FUJI, MICRON, LINEAR, LATTICE, SEMIKRON, VISHAY, BRIGHT, 模块, FREESCALE, MIT, NVIDIA, MOT, SANYO, NEC, AMD, BROADCOM, ROHM, STMICROELECTRONICS, PHI, DALLAS, RENESAS, YAGEO, SHARP, QUALCOMM, HIT, HARVATEK, KEMET, AVAGO, COOPER, INTERSIL, MOLEX, MICREL, ISD/NUVOTON, TDK, ISSI, AGILENT, ATI, HYNIX, COILCRAFT, BOURNS, LITTELFUSE, FUJITSU, IDT, SEIKO, EUPEC, TE, ELPIDA, TRACO, CIRRUS, SONY, MPS, EPCOS, RECOM, SST, ASTEC, CREE, AUO, IC, SILICON, ABB, QFN, EVERLIGHT, CJ(CHINA), SIPEX, EPSON, NXP/PHI, DIODES, BB, AOS, POWER, ALLEGRO, IXYS, TI , FTDI, VICOR, JAE, JRC, JST, MXIC, TI, AD, ST, ALTERA, NS, XILINX, MAX, ATMEL, SAMSUNG, NXP, INTEL, MICROCHIP, CY, FSC, MURATA, TOS, PANASONIC, ON, INFINEON, IR, AVX, LINEAR, MICRON, NVIDIA, FUJI, LATTICE, VISHAY, SEMIKRON, FREESCALE, MOT, BRIGHT, AMD, 模块, NEC, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, MIT, SHARP, YAGEO, QUALCOMM, HIT, HARVATEK, AVAGO, KEMET, INTERSIL, COOPER, MOLEX, MICREL, ATI, ISD/NUVOTON, TDK, FUJITSU, AGILENT, HYNIX, ISSI, IDT, COILCRAFT, EUPEC, BOURNS, LITTELFUSE, SEIKO, TE, ELPIDA, CIRRUS, TRACO, SONY, EPCOS, MPS, SST, RECOM, LAMBDA, BB, CREE, AUO, IC, SILICON, EVERLIGHT, QFN, CJ(CHINA), EPSON, SIPEX, DIODES, IXYS, NXP/PHI, BB/TI, ASTEC, ALLEGRO, SPANSION, AOS, POWER, CONEXANT, TI , FTDI, MXIC, VICOR, TI, AD, ST, ALTERA, XILINX, NS, ATMEL, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, MURATA, PANASONIC, TOS, ON, AVX, IR, INFINEON, VISHAY, LINEAR, NVIDIA, FUJI, LATTICE, MICRON, BRIGHT, AMD, FREESCALE, MOT, 模块, PHI, BROADCOM, NEC, SEMIKRON, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, QUALCOMM, HIT, MIT, HARVATEK, KEMET, AVAGO, COOPER, MOLEX, INTERSIL, MICREL, ATI, ISD/NUVOTON, TDK, AGILENT, ISSI, BOURNS, HYNIX, COILCRAFT, IDT, LITTELFUSE, FUJITSU, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, MPS, SONY, EPCOS, RECOM, SST, LAMBDA, EPSON, AUO, CREE, IC, BB, SILICON, EVERLIGHT, QFN, CJ(CHINA), NXP/PHI, DIODES, SIPEX, STACKPOLE TECHNOLOGY, INC., ASTEC, BB/TI, MXIC, POWER, AOS, SPANSION, TI , ALLEGRO, FTDI, IXYS, REALTEK, VICOR, TI, AD, ST, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, TOS, MURATA, ON, PANASONIC, IR, AVX, VISHAY, INFINEON, LINEAR, FREESCALE, NVIDIA, FUJI, MICRON, LATTICE, AMD, BRIGHT, MOT, PHI, NEC, BROADCOM, SANYO, ROHM, SEMIKRON, STMICROELECTRONICS, RENESAS, DALLAS, SHARP, YAGEO, INTERSIL, QUALCOMM, HIT, MIT, HARVATEK, KEMET, AVAGO, MOLEX, MICREL, COOPER, ATI, ISD/NUVOTON, TDK, ISSI, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, CIRRUS, TRACO, MPS, POWER, AOS, SST, EPCOS, SONY, DIP, EPSON, SIPEX, RECOM, 模块, LAMBDA, EUPEC, AUO, IC, BB, CREE, QFN, SILICON, EVERLIGHT, SPANSION, CJ(CHINA), DIODES, NXP/PHI, STACKPOLE TECHNOLOGY, INC., MXIC, ASTEC, BB/TI, WINBOND, ALLEGRO, TI , FTDI, TI, ST, AD, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, TOS, MURATA, ON, PANASONIC, VISHAY, INFINEON, AVX, FUJI, IR, MICRON, LINEAR, FREESCALE, NVIDIA, LATTICE, SEMIKRON, MOT, BRIGHT, AMD, NEC, PHI, SANYO, ROHM, BROADCOM, STMICROELECTRONICS, RENESAS, SHARP, DALLAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, AVAGO, HARVATEK, KEMET, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, ISSI, TDK, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, CIRRUS, TRACO, MPS, AOS, EPCOS, POWER, DIP, LAMBDA, SIPEX, RECOM, 模块, EUPEC, BB/TI, SST, AUO, CREE, IC, EVERLIGHT, QFN, SILICON, ABB, RECTRON, EPSON, CJ(CHINA), DIODES, SONY, NXP/PHI, STACKPOLE TECHNOLOGY, INC., SPANSION, ASTEC, WINBOND, ALLEGRO, TI , CONEXANT, TI, ST, AD, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, FSC, CY, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, IR, FUJI, MICRON, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MOT, NEC, AMD, BRIGHT, PHI, SANYO, ROHM, BROADCOM, RENESAS, STMICROELECTRONICS, DALLAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, AVAGO, KEMET, HARVATEK, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, TDK, FUJITSU, ISSI, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, SEIKO, KOA KAOHSIUNG CORPORATION, ELPIDA, EPCOS, TRACO, CIRRUS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, SST, AUO, BB/TI, CREE, IC, SILICON, EVERLIGHT, QFN, ABB, SONY, EPSON, RECTRON, SIPEX, DIODES, CJ(CHINA), SPANSION, AOS, ALLEGRO, NXP/PHI, STACKPOLE TECHNOLOGY, INC., WINBOND, CONEXANT, ASTEC, MXIC, TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, NEC, AMD, BRIGHT, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, AVAGO, MIT, KEMET, HARVATEK, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, TDK, ISSI, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, SST, AUO, BB/TI, CREE, IC, SILICON, EVERLIGHT, ABB, QFN, SONY, EPSON, RECTRON, SIPEX, AUO, NXP/PHI, SONY, BOSCH, EUPEC, REALTEK, FANUC, LGIT, WINBOND, PI, CJ(CHINA), AOS, ALLEGRO, NXP/PHI, SPANSION, STACKPOLE TECHNOLOGY, INC., WINBOND, CONEXANT, ASTEC, REALTEK, TI , TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, NEC, AMD, BRIGHT, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, AVAGO, MIT, KEMET, HARVATEK, ISSI, MOLEX, COOPER, MICREL, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, SST, AUO, BB/TI, CREE, IC, SILICON, BCD, EVERLIGHT, ABB, QFN, SONY, EPSON, RECTRON, SIPEX, CJ(CHINA), AOS, ALLEGRO, NXP/PHI, SPANSION, STACKPOLE TECHNOLOGY, INC., CONEXANT, ASTEC, TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, MURATA, TOS, PANASONIC, ON, INFINEON, VISHAY, AVX, FUJI, IR, FREESCALE, LINEAR, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, AMD, BRIGHT, NEC, PHI, BROADCOM, ROHM, STMICROELECTRONICS, SANYO, DALLAS, SHARP, RENESAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, KEMET, AVAGO, HARVATEK, ISSI, MOLEX, COOPER, MICREL, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, IDT, HYNIX, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, SST, AUO, BB/TI, CREE, IC, SILICON, BCD, EVERLIGHT, ABB, QFN, EPSON, RECTRON, POWER, SONY, CJ(CHINA), AOS, NXP/PHI, SIPEX, SPANSION, STACKPOLE TECHNOLOGY, INC., ASTEC, ALLEGRO, TI , TI, AD, ST, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, MURATA, TOS, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, FREESCALE, LINEAR, NVIDIA, SEMIKRON, MICRON, LATTICE, AMD, MOT, BRIGHT, NEC, PHI, BROADCOM, ROHM, DALLAS, STMICROELECTRONICS, SANYO, ALLEGRO, SHARP, RENESAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, KEMET, AVAGO, ISSI, HARVATEK, MOLEX, MICREL, COOPER, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, INNOLUX, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, SST, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, AUO, BB/TI, SILICON, CREE, IC, BB, BCD, EVERLIGHT, ABB, POWER, QFN, EPSON, RECTRON, SPANSION, SONY, CJ(CHINA), AOS, NXP/PHI, SIPEX, STACKPOLE TECHNOLOGY, INC., TI, AD, ST, MAX, ALTERA, ATMEL, NXP, NS, XILINX, INTEL, MICROCHIP, SAMSUNG, CY, FSC, ON, MURATA, TOS, PANASONIC, INFINEON, VISHAY, IR, AVX, FREESCALE, LINEAR, NVIDIA, LATTICE, MICRON, MOT, SEMIKRON, AMD, NEC, PHI, BROADCOM, ALLEGRO, ROHM, SANYO, DALLAS, FUJI, SHARP, STMICROELECTRONICS, COILCRAFT, RENESAS, YAGEO, INTERSIL, AVAGO, QUALCOMM, HIT, MIT, KEMET, ISSI, HARVATEK, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, ATI, ISD/NUVOTON, FUJITSU, HYNIX, AGILENT, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, TRACO, SEIKO, INNOLUX, BB, ELPIDA, CIRRUS, EPCOS, MPS, SST, SILICON, DIP, EUPEC, RECOM, 模块, POWER, WINBOND, AUO, BB/TI, CREE, IC, EVERLIGHT, BCD, SPANSION, EPSON, SONY, RECTRON, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., COSEL, MXIC, TI, AD, ST, MAX, ALTERA, ATMEL, NXP, NS, XILINX, INTEL, MICROCHIP, CY, SAMSUNG, ON, FSC, MURATA, TOS, INFINEON, PANASONIC, VISHAY, IR, AVX, FREESCALE, LINEAR, NVIDIA, LATTICE, MICRON, MOT, AMD, SEMIKRON, NEC, PHI, BROADCOM, ALLEGRO, ROHM, SANYO, DALLAS, FUJI, SHARP, STMICROELECTRONICS, COILCRAFT, RENESAS, YAGEO, INTERSIL, AVAGO, HIT, QUALCOMM, MIT, ISSI, KEMET, HARVATEK, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, ATI, ISD/NUVOTON, FUJITSU, AGILENT, IDT, BOURNS, LITTELFUSE, HYNIX, KOA KAOHSIUNG CORPORATION, TRACO, BB, SEIKO, INNOLUX, CIRRUS, EPCOS, MPS, SST, SILICON, DIP, EUPEC, RECOM, 模块, POWER, WINBOND, TE CONNECTIVITY , AUO, BB/TI, CREE, IC, EVERLIGHT, BCD, SPANSION, SONY, EPSON, RECTRON, DIODES, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., COSEL, TI, AD, MAX, ALTERA, ST, ATMEL, NXP, NS, MICROCHIP, XILINX, TOS, CY, ON, INFINEON, FSC, INTEL, MURATA, PANASONIC, IR, VISHAY, MICRON, SAMSUNG, AVX, FREESCALE, LINEAR, LATTICE, MOT, SEMIKRON, MIT, NEC, PHI, BROADCOM, ALLEGRO, DALLAS, COILCRAFT, AMD, ROHM, RENESAS, SHARP, FUJI, NVIDIA, STMICROELECTRONICS, YAGEO, AVAGO, INTERSIL, HIT, QUALCOMM, KEMET, HARVATEK, ISSI, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, SANYO, ISD/NUVOTON, AGILENT, FUJITSU, VICOR, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, TRACO, BB, SEIKO, INNOLUX, SONY, CIRRUS, EPCOS, MPS, SILICON, DIP, SST, 模块, POWER, TE CONNECTIVITY , BB/TI, AUO, WINBOND, IC, CREE, EVERLIGHT, ATI, EUPEC, BCD, SPANSION, EPSON, DIODES, AOS, CJ(CHINA), QFN, NXP/PHI, SIPEX, STACKPOLE TECHNOLOGY, INC., MIC, JST, MXIC, TI, AD, MAX, ST, ALTERA, NS, ATMEL, NXP, MICROCHIP, XILINX, TOS, CY, ON, INFINEON, INTEL, FSC, MURATA, PANASONIC, IR, VISHAY, MICRON, SAMSUNG, FREESCALE, AVX, LINEAR, LATTICE, MOT, SEMIKRON, PHI, NEC, RENESAS, MIT, BROADCOM, ALLEGRO, DALLAS, NVIDIA, ROHM, COILCRAFT, AMD, SHARP, FUJI, STMICROELECTRONICS, YAGEO, HIT, INTERSIL, AVAGO, QUALCOMM, ISSI, KEMET, HARVATEK, SUMIDA, MOLEX, MICREL, COOPER, SANYO, TDK, NUVOTON, BB, ISD/NUVOTON, FUJITSU, AGILENT, VICOR, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SONY, TRACO, SEIKO, INNOLUX, CIRRUS, MPS, EPCOS, SST, SILICON, DIP, 模块, POWER, TE CONNECTIVITY , BB/TI, WINBOND, AUO, IC, CREE, EVERLIGHT, ATI, EUPEC, BCD, SPANSION, MIC, EPSON, DIODES, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., HYNIX, MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, TOS, ATMEL, ON, MICROCHIP, INTEL, XILINX, INFINEON, VISHAY, CY, FSC, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, LINEAR, FREESCALE, LATTICE, MOT, AMD, PHI, SEMIKRON, NEC, NVIDIA, RENESAS, BROADCOM, ALLEGRO, ROHM, COILCRAFT, DALLAS, SHARP, AVAGO, YAGEO, HIT, INTERSIL, KEMET, HARVATEK, ISSI, MIT, SANYO, SUMIDA, MOLEX, COOPER, MICREL, QUALCOMM, NUVOTON, BB, ATI, ISD/NUVOTON, TDK, FUJI, FUJITSU, AGILENT, VICOR, BOURNS, EUPEC, LITTELFUSE, KOA KAOHSIUNG CORPORATION, MCP, TRACO, IDT, SEIKO, SONY, INNOLUX, EPCOS, MPS, CIRRUS, SST, SILICON, DIP, RECOM, 模块, POWER, TE CONNECTIVITY , BB/TI, AUO, IC, EVERLIGHT, SPANSION, WINBOND, CREE, MIC, BCD, DIODES, AOS, CJ(CHINA), QFN, NXP/PHI, AT, EPSON, STACKPOLE TECHNOLOGY, INC., MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, TOS, ATMEL, FSC, ON, MICROCHIP, INTEL, XILINX, INFINEON, VISHAY, CY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, AMD, LATTICE, MOT, PHI, SEMIKRON, NEC, NVIDIA, RENESAS, BROADCOM, ALLEGRO, ROHM, COILCRAFT, DALLAS, SHARP, AVAGO, YAGEO, FUJI, HIT, HARVATEK, ISSI, KEMET, MIT, SANYO, INTERSIL, MOLEX, SUMIDA, COOPER, MICREL, QUALCOMM, NUVOTON, BB, ATI, ISD/NUVOTON, TDK, FUJITSU, AGILENT, VICOR, BOURNS, EUPEC, LITTELFUSE, KOA KAOHSIUNG CORPORATION, MCP, SONY, TRACO, IDT, SEIKO, INNOLUX, EPCOS, MPS, CIRRUS, SST, SPANSION, DIP, SILICON, RECOM, 模块, TE CONNECTIVITY , WINBOND, BB/TI, AUO, IC, EVERLIGHT, BCD, CREE, MIC, POWER, DIODES, AOS, HYNIX, CJ(CHINA), QFN, NXP/PHI, AT, EPSON, STACKPOLE TECHNOLOGY, INC., TI, AD, ST, MAX, NS, NXP, ALTERA, ATMEL, FSC, MICROCHIP, ON, TOS, INTEL, XILINX, INFINEON, CY, VISHAY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, MOT, LATTICE, AMD, SEMIKRON, PHI, NEC, IXYS, BROADCOM, ALLEGRO, ROHM, RENESAS, COILCRAFT, AVAGO, DALLAS, SHARP, NVIDIA, YAGEO, FUJI, HIT, 模块, SANYO, HARVATEK, ISSI, KEMET, MIT, INTERSIL, MOLEX, SUMIDA, ATI, COOPER, QUALCOMM, MICREL, NUVOTON, POWER, TDK, BB, ISD/NUVOTON, VICOR, EUPEC, IDT, BOURNS, LITTELFUSE, FUJITSU, SONY, TRACO, KOA KAOHSIUNG CORPORATION, MCP, SEIKO, EPCOS, MPS, SST, SPANSION, SILICON, RECOM, MURATA PS, WINBOND, TE CONNECTIVITY , INNOLUX, BB/TI, EVERLIGHT, IC, BCD, CREE, MIC, CIRRUS, DIODES, AT, QFN, AOS, NXP/PHI, EPSON, STACKPOLE TECHNOLOGY, INC., JST, REALTEK, MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, ATMEL, FSC, MICROCHIP, ON, TOS, INTEL, XILINX, INFINEON, CY, VISHAY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, MOT, SEMIKRON, LATTICE, AMD, PHI, NEC, IXYS, BROADCOM, ALLEGRO, ROHM, RENESAS, AVAGO, COILCRAFT, DALLAS, SHARP, NVIDIA, YAGEO, FUJI, HIT, 模块, MIT, SANYO, HARVATEK, ISSI, KEMET, INTERSIL, MOLEX, SUMIDA, ATI, COOPER, QUALCOMM, MICREL, NUVOTON, POWER, TDK, BB, ISD/NUVOTON, VICOR, EUPEC, IDT, BOURNS, FUJITSU, LITTELFUSE, SONY, TRACO, KOA KAOHSIUNG CORPORATION, MCP, SEIKO, EPCOS, MPS, SST, SPANSION, SILICON, RECOM, MURATA PS, WINBOND, TE CONNECTIVITY , INNOLUX, BB/TI, EVERLIGHT, IC, BCD, CREE, MIC, CIRRUS, DIODES, AT, QFN, AOS, NXP/PHI, EPSON, STACKPOLE TECHNOLOGY, INC., JST, REALTEK, MXIC, TI, AD, ST, MAX, NS, NXP, FSC, MICROCHIP, ATMEL, ALTERA, ON, XILINX, TOS, INFINEON, CY, INTEL, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, IR, FREESCALE, LINEAR, MOT, NEC, SEMIKRON, LATTICE, AMD, ALLEGRO, PHI, BROADCOM, HIT, ROHM, RENESAS, AVAGO, DALLAS, SHARP, YAGEO, FUJI, IXYS, SUMIDA, 模块, MIT, HARVATEK, SANYO, KEMET, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, VICOR, 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MIT, WURTH, SUMIDA, 模块, HARVATEK, KEMET, MICREL, IDT, NVIDIA, SANYO, TDK, COOPER, INTERSIL, QUALCOMM, ISD/NUVOTON, TRACO, ISSI, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, MCP, SEIKO, SILICON, MIC, JRC, ATI, MPS, EVERLIGHT, MOLEX, EPCOS, ALLEGRO, VICOR, IXYS, AUO, INNOLUX, VISHAY DALE, BB/TI, SPANSION, SST, AT, IC, CREE, REALTEK, STMICROELECTRONICS, EUPEC, POWER, SONY, CIRRUS, QFN, NXP/PHI, AOS, DIODES, BOSCH, HYNIX, EPSON, TI , WCH, ASTEC, TI, AD, ST, MAX, NXP, NS, XILINX, ALTERA, TOS, ATMEL, IR, ON, FSC, MICROCHIP, INFINEON, MURATA, CY, INTEL, MICRON, SAMSUNG, VISHAY, SEMIKRON, AVX, PANASONIC, MIT, LINEAR, MOT, SHARP, NEC, LATTICE, PHI, ROHM, FREESCALE, BROADCOM, AVAGO, FUJI, DALLAS, HIT, RECOM, YAGEO, RENESAS, WURTH, AMD, IXYS, SUMIDA, 模块, HARVATEK, KEMET, NVIDIA, MICREL, SANYO, IDT, COOPER, INTERSIL, QUALCOMM, TDK, ISD/NUVOTON, TRACO, ISSI, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, SEIKO, SILICON, JRC, MIC, ATI, MPS, EVERLIGHT, MOLEX, EPCOS, VICOR, ALLEGRO, AUO, VISHAY DALE, BB/TI, IC, SST, CREE, POWER, REALTEK, SPANSION, STMICROELECTRONICS, EUPEC, SONY, QFN, CIRRUS, NXP/PHI, AOS, DIODES, BOSCH, HYNIX, TI , EPSON, WCH, ASTEC, JAE, BB, EXAR(SIPEX), TI, AD, ST, XILINX, MAX, NXP, NS, ALTERA, ATMEL, TOS, ON, IR, FSC, MICROCHIP, INFINEON, MURATA, INTEL, CY, MICRON, SAMSUNG, VISHAY, SEMIKRON, AVX, PANASONIC, MIT, LINEAR, NEC, MOT, SHARP, LATTICE, PHI, ROHM, FREESCALE, ALLEGRO, BROADCOM, AVAGO, FUJI, HIT, DALLAS, RECOM, RENESAS, YAGEO, WURTH, AMD, IXYS, SUMIDA, 模块, HARVATEK, KEMET, NVIDIA, IDT, MICREL, SANYO, INTERSIL, COOPER, TDK, QUALCOMM, ISD/NUVOTON, TRACO, ISSI, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, SEIKO, MIC, SILICON, JRC, ATI

Google Search Product Summary FUJI 2DI30D-050 This is an offer provided by HKin.com member. In stock! Order now! Category: Electronic Components. Product #: 2DI30D-050. Available from: BeiJing Jietuozijing Science and Technology Co., Ltd. Condition: in excellent condition In stock! Order now! Part Numbers Previous Parts:L6207N, L6227PD, LA55-P, LM2675N-ADJ, LM358ADR, LPD150-N0252, LT1085CM, LT3471EDD, MAX3209ECUU, MAX3263CAG, MB90F342CA, MB90F488B, MC005C, MC68HC705J1ACP, 2DI150MB-050, 2DI200M-050 (+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: 2DI30D-050": Post Date Part Number Brand D/C Desc Qty Company Fri May 24 02:19:00 UTC 2013 2DI30D-050A (from standard server 2) FUJI 632 BeiJing Jietuozijing Science and Technology Co., Ltd. Fri May 24 02:19:00 UTC 2013 2DI30D-050A (from parts server 2) FUJI 632 BeiJing Jietuozijing Science and Technology Co., Ltd. Fri May 24 02:19:00 UTC 2013 2DI30D-050A (from hkin.com 2) FUJI 632 BeiJing Jietuozijing Science and Technology Co., Ltd. Fri May 24 02:19:00 UTC 2013 2DI30D-050A (from hkin.com 2) FUJI 632 BeiJing Jietuozijing Science and Technology Co., Ltd. Last record 2DI200M-050: Post Date Part Number Brand D/C Desc Qty Company Last record 2DI150MB-050: Post Date Part Number Brand D/C Desc Qty Company Last record MC68HC705J1ACP: Post Date Part Number Brand D/C Desc Qty Company If you want to find more about 2DI30D-050, please visit us on HKin vid:offerengine20130526 Part Number Prefix 2DI30D-050,2DI30D-050,Comments from user about 2DI30D-050: Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. Analog circuits are sometimes called linear circuits although many non-linear effects are used in analog circuits such as mixers, modulators, etc. Small circuit breakers may be manually operated; larger units have solenoids to trip the mechanism, and electric motors to restore energy to the springs. For quantities that vary polynomially or logarithmically with temperature, it may be possible to calculate a temperature coefficient that is a useful approximation for a certain range of temperatures. For high-pass and low-pass (as well as band-pass filters far from the center frequency), the required rejection may determine the slope of attenuation needed, and thus the "order" of the filter. VHDL project is portable. A second-order all-pole filter gives an ultimate slope of about 12 dB per octave (40dB/decade), but the slope close to the corner frequency is much less, sometimes necessitating a notch be added to the filter. Typically, analog designers use this term to refer to incrementally passive components and systems, while control systems engineers will use this to refer to thermodynamically passive ones. Anything related to :2DI30D-050, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: 2DI30D-050, search hkinventory: 2DI30D-050, Thyristors are able to withstand very high reverse breakdown voltage and are also capable of carrying high current. It is relatively easy for an inexperienced developer to produce code that simulates successfully but that cannot be synthesized into a real device, or is too large to be practical. Introduced as a practical electronic component in 1962, early LEDs emitted low-intensity red light, but modern versions are available across the visible, ultraviolet and infrared wavelengths, with very high brightness. IEEE standard 1076. Datasheet Dir, DataSheet Archive Normally, whether a conditional branch will be taken isn't known until late in the pipeline as conditional branches depend on results coming from a register. It is often easier and cheaper to use a standard microcontroller and write a computer program to carry out a control function than to design an equivalent mechanical control function. As it is a physical limit, no improvement is expected from silicon MOSFETs concerning their maximum voltage ratings. Notch filters ?attenuation of certain frequencies while allowing all others to pass. In electronics, a flip-flop or latch is a circuit that has two stable states and can be used to store state information. The circuit can be made to change state by signals applied to one or more control inputs and will have one or two outputs. The large number of discrete logic gates used more electrical powerXand therefore, produced more heatXthan a more integrated design with fewer ICs. LEDs present many advantages over incandescent light sources including lower energy consumption, longer lifetime, improved robustness, smaller size, faster switching, and greater durability and reliability. any passive component and active component such as:1N4148, or 6502 By paralleling several devices, it is possible to increase the current rating of a switch. When a light-emitting diode is forward biased (switched on), electrons are able to recombine with electron holes within the device, releasing energy in the form of photons. Input and output impedance requirements. It is relatively easy for an inexperienced developer to produce code that simulates successfully but that cannot be synthesized into a real device, or is too large to be practical. For example driver circuit 2DI30D-050,2DI30D-050,Comments from user about 2DI30D-050: Like Ada, VHDL is strongly typed and is not case sensitive. Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage. Consumer electronics are electronic equipment intended for everyday use, most often in entertainment, communications and office productivity. From the time that the processor's instruction decoder has figured out that it has encountered a conditional branch instruction to the time that the deciding register value can be read out, the pipeline needs to be stalled for several cycles, or if it's not and the branch is taken, the pipeline needs to be flushed. Ternary (with three states) logic has been studied, and some prototype computers made. The desire for High definition (HD) content has led the industry to develop a number of technologies, such as WirelessHD or ITU-T G. For example, most constructs that explicitly deal with timing such as wait for 10 ns; are not synthesizable despite being valid for simulation. They are also called power devices or when used in integrated circuits, called power ICs. Anything related to :2DI30D-050, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: 2DI30D-050See also: Capacitor Transistor Diode