Part: 2DI200M-050

Index Files Offer Index 9 ISD/NUVOTON, HYNIX, JRC, STMICROELECTRONICS, ISSI, REALTEK, IDT, FUJITSU, BOURNS, LITTELFUSE, POWER, SEIKO, MIC, SILICON, ELPIDA, TE, SONY, TRACO, EPCOS, MPS, BB, EUPEC, SST, RECOM, COSEL, CREE, IC, DIODES, SIPEX, CIRRUS, QFN, HVCA, CJ(CHINA), EPSON, SPANSION, NXP/PHI, CONEXANT, BB/TI, ASTEC, AOS, TI , JAE, TI, AD, ST, XILINX, MAX, NS, ATMEL, ALTERA, SAMSUNG, NXP, MICROCHIP, INTEL, FSC, CY, TOS, MURATA, FUJI, PANASONIC, ON, INFINEON, AVX, IR, MICRON, MIT, LINEAR, SEMIKRON, VISHAY, LATTICE, BRIGHT, 模块, MOT, FREESCALE, NVIDIA, NEC, ROHM, SANYO, PHI, BROADCOM, AMD, DALLAS, YAGEO, QUALCOMM, SHARP, INTERSIL, RENESAS, HARVATEK, AVAGO, KEMET, HIT, COOPER, MICREL, MOLEX, ISD/NUVOTON, TDK, JRC, ISSI, HYNIX, ATI, IDT, COILCRAFT, FUJITSU, BOURNS, LITTELFUSE, SEIKO, TE, ELPIDA, TRACO, SONY, POWER, EPCOS, MPS, RECOM, EUPEC, SST, COSEL, CREE, IC, EVERLIGHT, SILICON, QFN, CIRRUS, CJ(CHINA), SIPEX, BB, NXP/PHI, EPSON, DIODES, ASTEC, AOS, TI , SPANSION, JAE, JST, CONEXANT, MXIC, AUO, EXAR(SIPEX), MIC, REALTEK, AT, TI, AD, ST, ALTERA, MAX, XILINX, NS, ATMEL, NXP, SAMSUNG, MICROCHIP, INTEL, CY, FSC, TOS, MURATA, PANASONIC, ON, INFINEON, AVX, FUJI, IR, SEMIKRON, MICRON, LINEAR, VISHAY, LATTICE, MIT, BRIGHT, 模块, FREESCALE, NEC, MOT, NVIDIA, ROHM, SANYO, BROADCOM, AMD, PHI, QUALCOMM, STMICROELECTRONICS, DALLAS, RENESAS, YAGEO, SHARP, INTERSIL, HIT, AVAGO, HARVATEK, KEMET, COOPER, MICREL, MOLEX, ISD/NUVOTON, TDK, JRC, ISSI, HYNIX, ATI, IDT, FUJITSU, COILCRAFT, BOURNS, LITTELFUSE, SEIKO, EUPEC, TE, ELPIDA, SONY, TRACO, MPS, POWER, EPCOS, SST, RECOM, ASTEC, CREE, SILICON, IC, EVERLIGHT, CIRRUS, ABB, QFN, BB, CJ(CHINA), EPSON, SIPEX, NXP/PHI, DIODES, ALLEGRO, AOS, IXYS, TI , FTDI, SPANSION, VICOR, JAE, JST, MXIC, CONEXANT, TI, AD, ST, ALTERA, XILINX, NS, MAX, ATMEL, NXP, SAMSUNG, MICROCHIP, INTEL, CY, MURATA, FSC, PANASONIC, TOS, ON, INFINEON, AVX, IR, FUJI, MICRON, LINEAR, LATTICE, SEMIKRON, VISHAY, BRIGHT, 模块, FREESCALE, MIT, NVIDIA, MOT, SANYO, NEC, AMD, BROADCOM, ROHM, STMICROELECTRONICS, PHI, DALLAS, RENESAS, YAGEO, SHARP, QUALCOMM, HIT, HARVATEK, KEMET, AVAGO, COOPER, INTERSIL, MOLEX, MICREL, ISD/NUVOTON, TDK, ISSI, AGILENT, ATI, HYNIX, COILCRAFT, BOURNS, LITTELFUSE, FUJITSU, IDT, SEIKO, EUPEC, TE, ELPIDA, TRACO, CIRRUS, SONY, MPS, EPCOS, RECOM, SST, ASTEC, CREE, AUO, IC, SILICON, ABB, QFN, EVERLIGHT, CJ(CHINA), SIPEX, EPSON, NXP/PHI, DIODES, BB, AOS, POWER, ALLEGRO, IXYS, TI , FTDI, VICOR, JAE, JRC, JST, MXIC, TI, AD, ST, ALTERA, NS, XILINX, MAX, ATMEL, SAMSUNG, NXP, INTEL, MICROCHIP, CY, FSC, MURATA, TOS, PANASONIC, ON, INFINEON, IR, AVX, LINEAR, MICRON, NVIDIA, FUJI, LATTICE, VISHAY, SEMIKRON, FREESCALE, MOT, BRIGHT, AMD, 模块, NEC, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, MIT, SHARP, YAGEO, QUALCOMM, HIT, HARVATEK, AVAGO, KEMET, INTERSIL, COOPER, MOLEX, MICREL, ATI, ISD/NUVOTON, TDK, FUJITSU, AGILENT, HYNIX, ISSI, IDT, COILCRAFT, EUPEC, BOURNS, LITTELFUSE, SEIKO, TE, ELPIDA, CIRRUS, TRACO, SONY, EPCOS, MPS, SST, RECOM, LAMBDA, BB, CREE, AUO, IC, SILICON, EVERLIGHT, QFN, CJ(CHINA), EPSON, SIPEX, DIODES, IXYS, NXP/PHI, BB/TI, ASTEC, ALLEGRO, SPANSION, AOS, POWER, CONEXANT, TI , FTDI, MXIC, VICOR, TI, AD, ST, ALTERA, XILINX, NS, ATMEL, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, MURATA, PANASONIC, TOS, ON, AVX, IR, INFINEON, VISHAY, LINEAR, NVIDIA, FUJI, LATTICE, MICRON, BRIGHT, AMD, FREESCALE, MOT, 模块, PHI, BROADCOM, NEC, SEMIKRON, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, QUALCOMM, HIT, MIT, HARVATEK, KEMET, AVAGO, COOPER, MOLEX, INTERSIL, MICREL, ATI, ISD/NUVOTON, TDK, AGILENT, ISSI, BOURNS, HYNIX, COILCRAFT, IDT, LITTELFUSE, FUJITSU, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, MPS, SONY, EPCOS, RECOM, SST, LAMBDA, EPSON, AUO, CREE, IC, BB, SILICON, EVERLIGHT, QFN, CJ(CHINA), NXP/PHI, DIODES, SIPEX, STACKPOLE TECHNOLOGY, INC., ASTEC, BB/TI, MXIC, POWER, AOS, SPANSION, TI , ALLEGRO, FTDI, IXYS, REALTEK, VICOR, TI, AD, ST, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, TOS, MURATA, ON, PANASONIC, IR, AVX, VISHAY, INFINEON, LINEAR, FREESCALE, NVIDIA, FUJI, MICRON, LATTICE, AMD, BRIGHT, MOT, PHI, NEC, BROADCOM, SANYO, ROHM, SEMIKRON, STMICROELECTRONICS, RENESAS, DALLAS, SHARP, YAGEO, INTERSIL, QUALCOMM, HIT, MIT, HARVATEK, KEMET, AVAGO, MOLEX, MICREL, COOPER, ATI, ISD/NUVOTON, TDK, ISSI, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, CIRRUS, TRACO, MPS, POWER, AOS, SST, EPCOS, SONY, DIP, EPSON, SIPEX, RECOM, 模块, LAMBDA, EUPEC, AUO, IC, BB, CREE, QFN, SILICON, EVERLIGHT, SPANSION, CJ(CHINA), DIODES, NXP/PHI, STACKPOLE TECHNOLOGY, INC., MXIC, ASTEC, BB/TI, WINBOND, ALLEGRO, TI , FTDI, TI, ST, AD, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, TOS, MURATA, ON, PANASONIC, VISHAY, INFINEON, AVX, FUJI, IR, MICRON, LINEAR, FREESCALE, NVIDIA, LATTICE, SEMIKRON, MOT, BRIGHT, AMD, NEC, PHI, SANYO, ROHM, BROADCOM, STMICROELECTRONICS, RENESAS, SHARP, DALLAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, AVAGO, HARVATEK, KEMET, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, ISSI, TDK, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, CIRRUS, TRACO, MPS, AOS, EPCOS, POWER, DIP, LAMBDA, SIPEX, RECOM, 模块, EUPEC, BB/TI, SST, AUO, CREE, IC, EVERLIGHT, QFN, SILICON, ABB, RECTRON, EPSON, CJ(CHINA), DIODES, SONY, NXP/PHI, STACKPOLE TECHNOLOGY, INC., SPANSION, ASTEC, WINBOND, ALLEGRO, TI , CONEXANT, TI, ST, AD, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, FSC, CY, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, IR, FUJI, MICRON, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MOT, NEC, AMD, BRIGHT, PHI, SANYO, ROHM, BROADCOM, RENESAS, STMICROELECTRONICS, DALLAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, AVAGO, KEMET, HARVATEK, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, TDK, FUJITSU, ISSI, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, SEIKO, KOA KAOHSIUNG CORPORATION, ELPIDA, EPCOS, TRACO, CIRRUS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, SST, AUO, BB/TI, CREE, IC, SILICON, EVERLIGHT, QFN, ABB, SONY, EPSON, RECTRON, SIPEX, DIODES, CJ(CHINA), SPANSION, AOS, ALLEGRO, NXP/PHI, STACKPOLE TECHNOLOGY, INC., WINBOND, CONEXANT, ASTEC, MXIC, TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, NEC, AMD, BRIGHT, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, AVAGO, MIT, KEMET, HARVATEK, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, TDK, ISSI, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, SST, AUO, BB/TI, CREE, IC, SILICON, EVERLIGHT, ABB, QFN, SONY, EPSON, RECTRON, SIPEX, AUO, NXP/PHI, SONY, BOSCH, EUPEC, REALTEK, FANUC, LGIT, WINBOND, PI, CJ(CHINA), AOS, ALLEGRO, NXP/PHI, SPANSION, STACKPOLE TECHNOLOGY, INC., WINBOND, CONEXANT, ASTEC, REALTEK, TI , TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, NEC, AMD, BRIGHT, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, AVAGO, MIT, KEMET, HARVATEK, ISSI, MOLEX, COOPER, MICREL, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, SST, AUO, BB/TI, CREE, IC, SILICON, BCD, EVERLIGHT, ABB, QFN, SONY, EPSON, RECTRON, SIPEX, CJ(CHINA), AOS, ALLEGRO, NXP/PHI, SPANSION, STACKPOLE TECHNOLOGY, INC., CONEXANT, ASTEC, TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, MURATA, TOS, PANASONIC, ON, INFINEON, VISHAY, AVX, FUJI, IR, FREESCALE, LINEAR, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, AMD, BRIGHT, NEC, PHI, BROADCOM, ROHM, STMICROELECTRONICS, SANYO, DALLAS, SHARP, RENESAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, KEMET, AVAGO, HARVATEK, ISSI, MOLEX, COOPER, MICREL, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, IDT, HYNIX, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, SST, AUO, BB/TI, CREE, IC, SILICON, BCD, EVERLIGHT, ABB, QFN, EPSON, RECTRON, POWER, SONY, CJ(CHINA), AOS, NXP/PHI, SIPEX, SPANSION, STACKPOLE TECHNOLOGY, INC., ASTEC, ALLEGRO, TI , TI, AD, ST, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, MURATA, TOS, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, FREESCALE, LINEAR, NVIDIA, SEMIKRON, MICRON, LATTICE, AMD, MOT, BRIGHT, NEC, PHI, BROADCOM, ROHM, DALLAS, STMICROELECTRONICS, SANYO, ALLEGRO, SHARP, RENESAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, KEMET, AVAGO, ISSI, HARVATEK, MOLEX, MICREL, COOPER, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, INNOLUX, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, SST, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, AUO, BB/TI, SILICON, CREE, IC, BB, BCD, EVERLIGHT, ABB, POWER, QFN, EPSON, RECTRON, SPANSION, SONY, CJ(CHINA), AOS, NXP/PHI, SIPEX, STACKPOLE TECHNOLOGY, INC., TI, AD, ST, MAX, ALTERA, ATMEL, NXP, NS, XILINX, INTEL, MICROCHIP, SAMSUNG, CY, FSC, ON, MURATA, TOS, PANASONIC, INFINEON, VISHAY, IR, AVX, FREESCALE, LINEAR, NVIDIA, LATTICE, MICRON, MOT, SEMIKRON, AMD, NEC, PHI, BROADCOM, ALLEGRO, ROHM, SANYO, DALLAS, FUJI, SHARP, STMICROELECTRONICS, COILCRAFT, RENESAS, YAGEO, INTERSIL, AVAGO, QUALCOMM, HIT, MIT, KEMET, ISSI, HARVATEK, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, ATI, ISD/NUVOTON, FUJITSU, HYNIX, AGILENT, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, TRACO, SEIKO, INNOLUX, BB, ELPIDA, CIRRUS, EPCOS, MPS, SST, SILICON, DIP, EUPEC, RECOM, 模块, POWER, WINBOND, AUO, BB/TI, CREE, IC, EVERLIGHT, BCD, SPANSION, EPSON, SONY, RECTRON, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., COSEL, MXIC, TI, AD, ST, MAX, ALTERA, ATMEL, NXP, NS, XILINX, INTEL, MICROCHIP, CY, SAMSUNG, ON, FSC, MURATA, TOS, INFINEON, PANASONIC, VISHAY, IR, AVX, FREESCALE, LINEAR, NVIDIA, LATTICE, MICRON, MOT, AMD, SEMIKRON, NEC, PHI, BROADCOM, ALLEGRO, ROHM, SANYO, DALLAS, FUJI, SHARP, STMICROELECTRONICS, COILCRAFT, RENESAS, YAGEO, INTERSIL, AVAGO, HIT, QUALCOMM, MIT, ISSI, KEMET, HARVATEK, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, ATI, ISD/NUVOTON, FUJITSU, AGILENT, IDT, BOURNS, LITTELFUSE, HYNIX, KOA KAOHSIUNG CORPORATION, TRACO, BB, SEIKO, INNOLUX, CIRRUS, EPCOS, MPS, SST, SILICON, DIP, EUPEC, RECOM, 模块, POWER, WINBOND, TE CONNECTIVITY , AUO, BB/TI, CREE, IC, EVERLIGHT, BCD, SPANSION, SONY, EPSON, RECTRON, DIODES, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., COSEL, TI, AD, MAX, ALTERA, ST, ATMEL, NXP, NS, MICROCHIP, XILINX, TOS, CY, ON, INFINEON, FSC, INTEL, MURATA, PANASONIC, IR, VISHAY, MICRON, SAMSUNG, AVX, FREESCALE, LINEAR, LATTICE, MOT, SEMIKRON, MIT, NEC, PHI, BROADCOM, ALLEGRO, DALLAS, COILCRAFT, AMD, ROHM, RENESAS, SHARP, FUJI, NVIDIA, STMICROELECTRONICS, YAGEO, AVAGO, INTERSIL, HIT, QUALCOMM, KEMET, HARVATEK, ISSI, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, SANYO, ISD/NUVOTON, AGILENT, FUJITSU, VICOR, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, TRACO, BB, SEIKO, INNOLUX, SONY, CIRRUS, EPCOS, MPS, SILICON, DIP, SST, 模块, POWER, TE CONNECTIVITY , BB/TI, AUO, WINBOND, IC, CREE, EVERLIGHT, ATI, EUPEC, BCD, SPANSION, EPSON, DIODES, AOS, CJ(CHINA), QFN, NXP/PHI, SIPEX, STACKPOLE TECHNOLOGY, INC., MIC, JST, MXIC, TI, AD, MAX, ST, ALTERA, NS, ATMEL, NXP, MICROCHIP, XILINX, TOS, CY, ON, INFINEON, INTEL, FSC, MURATA, PANASONIC, IR, VISHAY, MICRON, SAMSUNG, FREESCALE, AVX, LINEAR, LATTICE, MOT, SEMIKRON, PHI, NEC, RENESAS, MIT, BROADCOM, ALLEGRO, DALLAS, NVIDIA, ROHM, COILCRAFT, AMD, SHARP, FUJI, STMICROELECTRONICS, YAGEO, HIT, INTERSIL, AVAGO, QUALCOMM, ISSI, KEMET, HARVATEK, SUMIDA, MOLEX, MICREL, COOPER, SANYO, TDK, NUVOTON, BB, ISD/NUVOTON, FUJITSU, AGILENT, VICOR, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SONY, TRACO, SEIKO, INNOLUX, CIRRUS, MPS, EPCOS, SST, SILICON, DIP, 模块, POWER, TE CONNECTIVITY , BB/TI, WINBOND, AUO, IC, CREE, EVERLIGHT, ATI, EUPEC, BCD, SPANSION, MIC, EPSON, DIODES, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., HYNIX, MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, TOS, ATMEL, ON, MICROCHIP, INTEL, XILINX, INFINEON, VISHAY, CY, FSC, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, LINEAR, FREESCALE, LATTICE, MOT, AMD, PHI, SEMIKRON, NEC, NVIDIA, RENESAS, BROADCOM, ALLEGRO, ROHM, COILCRAFT, DALLAS, SHARP, AVAGO, YAGEO, HIT, INTERSIL, KEMET, HARVATEK, ISSI, MIT, SANYO, SUMIDA, MOLEX, COOPER, MICREL, QUALCOMM, NUVOTON, BB, ATI, ISD/NUVOTON, TDK, FUJI, FUJITSU, AGILENT, VICOR, BOURNS, EUPEC, LITTELFUSE, KOA KAOHSIUNG CORPORATION, MCP, TRACO, IDT, SEIKO, SONY, INNOLUX, EPCOS, MPS, CIRRUS, SST, SILICON, DIP, RECOM, 模块, POWER, TE CONNECTIVITY , BB/TI, AUO, IC, EVERLIGHT, SPANSION, WINBOND, CREE, MIC, BCD, DIODES, AOS, CJ(CHINA), QFN, NXP/PHI, AT, EPSON, STACKPOLE TECHNOLOGY, INC., MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, TOS, ATMEL, FSC, ON, MICROCHIP, INTEL, XILINX, INFINEON, VISHAY, CY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, AMD, LATTICE, MOT, PHI, SEMIKRON, NEC, NVIDIA, RENESAS, BROADCOM, ALLEGRO, ROHM, COILCRAFT, DALLAS, SHARP, AVAGO, YAGEO, FUJI, HIT, HARVATEK, ISSI, KEMET, MIT, SANYO, INTERSIL, MOLEX, SUMIDA, COOPER, MICREL, QUALCOMM, NUVOTON, BB, ATI, ISD/NUVOTON, TDK, FUJITSU, AGILENT, VICOR, BOURNS, EUPEC, LITTELFUSE, KOA KAOHSIUNG CORPORATION, MCP, SONY, TRACO, IDT, SEIKO, INNOLUX, EPCOS, MPS, CIRRUS, SST, SPANSION, DIP, SILICON, RECOM, 模块, TE CONNECTIVITY , WINBOND, BB/TI, AUO, IC, EVERLIGHT, BCD, CREE, MIC, POWER, DIODES, AOS, HYNIX, CJ(CHINA), QFN, NXP/PHI, AT, EPSON, STACKPOLE TECHNOLOGY, INC., TI, AD, ST, MAX, NS, NXP, ALTERA, ATMEL, FSC, MICROCHIP, ON, TOS, INTEL, XILINX, INFINEON, CY, VISHAY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, MOT, LATTICE, AMD, SEMIKRON, PHI, NEC, IXYS, BROADCOM, ALLEGRO, ROHM, RENESAS, COILCRAFT, AVAGO, DALLAS, SHARP, NVIDIA, YAGEO, FUJI, HIT, 模块, SANYO, HARVATEK, ISSI, KEMET, MIT, INTERSIL, MOLEX, SUMIDA, ATI, COOPER, QUALCOMM, MICREL, NUVOTON, POWER, TDK, BB, ISD/NUVOTON, VICOR, EUPEC, IDT, BOURNS, LITTELFUSE, FUJITSU, SONY, TRACO, KOA KAOHSIUNG CORPORATION, MCP, SEIKO, EPCOS, MPS, SST, SPANSION, SILICON, RECOM, MURATA PS, WINBOND, TE CONNECTIVITY , INNOLUX, BB/TI, EVERLIGHT, IC, BCD, CREE, MIC, CIRRUS, DIODES, AT, QFN, AOS, NXP/PHI, EPSON, STACKPOLE TECHNOLOGY, INC., JST, REALTEK, MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, ATMEL, FSC, MICROCHIP, ON, TOS, INTEL, XILINX, INFINEON, CY, VISHAY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, MOT, SEMIKRON, LATTICE, AMD, PHI, NEC, IXYS, BROADCOM, ALLEGRO, ROHM, RENESAS, AVAGO, COILCRAFT, DALLAS, SHARP, NVIDIA, YAGEO, FUJI, HIT, 模块, MIT, SANYO, HARVATEK, ISSI, KEMET, INTERSIL, MOLEX, SUMIDA, ATI, COOPER, QUALCOMM, MICREL, NUVOTON, POWER, TDK, BB, ISD/NUVOTON, VICOR, EUPEC, IDT, BOURNS, FUJITSU, LITTELFUSE, SONY, TRACO, KOA KAOHSIUNG CORPORATION, MCP, SEIKO, EPCOS, MPS, SST, SPANSION, SILICON, RECOM, MURATA PS, WINBOND, TE CONNECTIVITY , INNOLUX, BB/TI, EVERLIGHT, IC, BCD, CREE, MIC, CIRRUS, DIODES, AT, QFN, AOS, NXP/PHI, EPSON, STACKPOLE TECHNOLOGY, INC., JST, REALTEK, MXIC, TI, AD, ST, MAX, NS, NXP, FSC, MICROCHIP, ATMEL, ALTERA, ON, XILINX, TOS, INFINEON, CY, INTEL, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, IR, FREESCALE, LINEAR, MOT, NEC, SEMIKRON, LATTICE, AMD, ALLEGRO, PHI, BROADCOM, HIT, ROHM, RENESAS, AVAGO, DALLAS, SHARP, YAGEO, FUJI, IXYS, SUMIDA, 模块, MIT, HARVATEK, SANYO, KEMET, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, VICOR, 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KEMET, FUJITSU, LITTELFUSE, MCP, SEIKO, SONY, JRC, ATI, POWER, MPS, IDT, MOLEX, EPCOS, ALLEGRO, BB, EVERLIGHT, SILICON, SST, SPANSION, VISHAY DALE, INNOLUX, BB/TI, DIODES, IC, CREE, AT, QFN, CIRRUS, NXP/PHI, MIC, AOS, AUO, TI , ASTEC, HYNIX, WCH, EUPEC, IXYS, EPSON, BOSCH, JAE, REALTEK, TI, AD, ST, NS, MAX, NXP, FSC, ATMEL, MICROCHIP, ALTERA, XILINX, TOS, ON, INTEL, INFINEON, IR, CY, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, MOT, LINEAR, NEC, LATTICE, PHI, ROHM, AMD, SEMIKRON, BROADCOM, RENESAS, AVAGO, HIT, RECOM, SHARP, DALLAS, YAGEO, FUJI, SUMIDA, MIT, 模块, HARVATEK, KEMET, MICREL, SANYO, NVIDIA, INTERSIL, COOPER, QUALCOMM, POWER, TDK, ISD/NUVOTON, VICOR, TRACO, ISSI, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, MIC, SONY, MCP, SEIKO, STMICROELECTRONICS, IDT, JRC, ATI, MPS, MOLEX, EPCOS, ALLEGRO, EVERLIGHT, BB, SILICON, SST, SPANSION, VISHAY DALE, INNOLUX, BB/TI, DIODES, IC, CREE, AT, CIRRUS, QFN, NXP/PHI, EPSON, AOS, HYNIX, TI , IXYS, REALTEK, WCH, ASTEC, EUPEC, AUO, 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MIT, WURTH, SUMIDA, 模块, HARVATEK, KEMET, MICREL, IDT, NVIDIA, SANYO, TDK, COOPER, INTERSIL, QUALCOMM, ISD/NUVOTON, TRACO, ISSI, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, MCP, SEIKO, SILICON, MIC, JRC, ATI, MPS, EVERLIGHT, MOLEX, EPCOS, ALLEGRO, VICOR, IXYS, AUO, INNOLUX, VISHAY DALE, BB/TI, SPANSION, SST, AT, IC, CREE, REALTEK, STMICROELECTRONICS, EUPEC, POWER, SONY, CIRRUS, QFN, NXP/PHI, AOS, DIODES, BOSCH, HYNIX, EPSON, TI , WCH, ASTEC, TI, AD, ST, MAX, NXP, NS, XILINX, ALTERA, TOS, ATMEL, IR, ON, FSC, MICROCHIP, INFINEON, MURATA, CY, INTEL, MICRON, SAMSUNG, VISHAY, SEMIKRON, AVX, PANASONIC, MIT, LINEAR, MOT, SHARP, NEC, LATTICE, PHI, ROHM, FREESCALE, BROADCOM, AVAGO, FUJI, DALLAS, HIT, RECOM, YAGEO, RENESAS, WURTH, AMD, IXYS, SUMIDA, 模块, HARVATEK, KEMET, NVIDIA, MICREL, SANYO, IDT, COOPER, INTERSIL, QUALCOMM, TDK, ISD/NUVOTON, TRACO, ISSI, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, SEIKO, SILICON, JRC, MIC, ATI, MPS, EVERLIGHT, MOLEX, EPCOS, VICOR, ALLEGRO, AUO, VISHAY DALE, BB/TI, IC, SST, CREE, POWER, REALTEK, SPANSION, STMICROELECTRONICS, EUPEC, SONY, QFN, CIRRUS, NXP/PHI, AOS, DIODES, BOSCH, HYNIX, TI , EPSON, WCH, ASTEC, JAE, BB, EXAR(SIPEX), TI, AD, ST, XILINX, MAX, NXP, NS, ALTERA, ATMEL, TOS, ON, IR, FSC, MICROCHIP, INFINEON, MURATA, INTEL, CY, MICRON, SAMSUNG, VISHAY, SEMIKRON, AVX, PANASONIC, MIT, LINEAR, NEC, MOT, SHARP, LATTICE, PHI, ROHM, FREESCALE, ALLEGRO, BROADCOM, AVAGO, FUJI, HIT, DALLAS, RECOM, RENESAS, YAGEO, WURTH, AMD, IXYS, SUMIDA, 模块, HARVATEK, KEMET, NVIDIA, IDT, MICREL, SANYO, INTERSIL, COOPER, TDK, QUALCOMM, ISD/NUVOTON, TRACO, ISSI, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, SEIKO, MIC, SILICON, JRC

Google Search Product Summary FUJI 2DI200M-050 This is an offer provided by HKin.com member. In stock! Order now! Category: Electronic Components. Product #: 2DI200M-050. Available from: BeiJing Jietuozijing Science and Technology Co., Ltd. Condition: in excellent condition In stock! Order now! Part Numbers Previous Parts:K4D553238F-VC33, L6207N, L6227PD, LA55-P, LM2675N-ADJ, LM358ADR, LPD150-N0252, LT1085CM, LT3471EDD, MAX3209ECUU, MAX3263CAG, MB90F342CA, MB90F488B, MC005C, MC68HC705J1ACP, 2DI150MB-050 (+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: 2DI200M-050": Post Date Part Number Brand D/C Desc Qty Company Fri May 24 02:19:00 UTC 2013 2DI200M-050 (from standard server 2) FUJI 652 BeiJing Jietuozijing Science and Technology Co., Ltd. Fri May 24 02:19:00 UTC 2013 2DI200M-050 (from parts server 2) FUJI 652 BeiJing Jietuozijing Science and Technology Co., Ltd. Fri May 24 02:19:00 UTC 2013 2DI200M-050 (from hkin.com 2) FUJI 652 BeiJing Jietuozijing Science and Technology Co., Ltd. Fri May 24 02:19:00 UTC 2013 2DI200M-050 (from hkin.com 2) FUJI 652 BeiJing Jietuozijing Science and Technology Co., Ltd. Last record 2DI150MB-050: Post Date Part Number Brand D/C Desc Qty Company Last record MC68HC705J1ACP: Post Date Part Number Brand D/C Desc Qty Company Last record MC005C: Post Date Part Number Brand D/C Desc Qty Company If you want to find more about 2DI200M-050, please visit us on HKin vid:offerengine20130526 Part Number Prefix 2DI200M-050,2DI200M-050,Comments from user about 2DI200M-050: The desire for High definition (HD) content has led the industry to develop a number of technologies, such as WirelessHD or ITU-T G. The IGBT is a recent component, so its performance improves regularly as technology evolves. However, many formational and functional block parameters can be tuned (capacity parameters, memory size, element base, block composition and interconnection structure). One disadvantage of the thyristor for switching circuits is that once it is 'latched-on' in the conducting state it cannot be turned off by external control. the bandwidth around the notch before attenuation becomes small. Machines with different microarchitectures may have the same instruction set architecture, and thus be capable of executing the same programs. Circuit designers will sometimes refer to this class of components as dissipative, or thermodynamically passive. This effectively multiplies the processor's potential performance by the number of cores (as long as the operating system and software is designed to take advantage of more than one processor core). Anything related to :2DI200M-050, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: 2DI200M-050, search hkinventory: 2DI200M-050, VHDL also allows arrays to be indexed in either ascending or descending direction; both conventions are used in hardware, whereas in Ada and most programming languages only ascending indexing is available. Competing projects would result in the IBM POWER and Sun SPARC architectures. LEDs present many advantages over incandescent light sources including lower energy consumption, longer lifetime, improved robustness, smaller size, faster switching, and greater durability and reliability. The complexity of an integrated circuit is bounded by physical limitations of the number of transistors that can be put onto one chip, the number of package terminations that can connect the processor to other parts of the system, the number of interconnections it is possible to make on the chip, and the heat that the chip can dissipate. Datasheet Dir, DataSheet Archive Bipolar junction transistors are formed from two p-n junctions, in either n-p-n or p-n-p configuration. Some common power devices are the power diode, thyristor, power MOSFET and IGBT. The pipelined datapath is the most commonly used datapath design in microarchitecture today. In 2005, the first personal computer dual-core processors were announced. The logic section retrieves instruction operation codes from memory, and iniates whatever sequence of operations of the ALU required to carry out the instruction. In principle, a single microarchitecture could execute several different ISAs with only minor changes to the microcode. Its major limitation for low voltage applications is the high voltage drop it exhibits in on-state (2 to 4 V). Common-emitter amplifiers are also used in radio frequency circuits, for example to amplify faint signals received by an antenna. any passive component and active component such as:1N4148, or 6502 However, its excellent performance in low voltage make it the device of choice (actually the only choice) for applications below 200 V. Introduced as a practical electronic component in 1962, early LEDs emitted low-intensity red light, but modern versions are available across the visible, ultraviolet and infrared wavelengths, with very high brightness.0 to the IEEE for balloting for inclusion in IEEE 1076-2008. In principle, a single microarchitecture could execute several different ISAs with only minor changes to the microcode. For example driver circuit 2DI200M-050,2DI200M-050,Comments from user about 2DI200M-050: However, many formational and functional block parameters can be tuned (capacity parameters, memory size, element base, block composition and interconnection structure). A power diode or MOSFET operates on similar principles to its low-power counterpart, but is able to carry a larger amount of current and typically is able to support a larger reverse-bias voltage in the off-state. Each operation of the ALU sets one or more flags in a status register, which indicate the results of the last operation (zero value, negative number, overflow. or others). As of 2009, dual-core and quad-core processors are widely used in servers, workstations and PCs while six and eight-core processors will be available for high-end applications in both the home and professional environments. LEDs present many advantages over incandescent light sources including lower energy consumption, longer lifetime, improved robustness, smaller size, faster switching, and greater durability and reliability. Techniques such as branch prediction and speculative execution are used to lessen these branch penalties. The integrated circuit's mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. Microprocessors make it possible to put a computer into thousands of items that were traditionally not computer-related. Anything related to :2DI200M-050, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: 2DI200M-050See also: Capacitor Transistor Diode