Part: M27C64A-30F6

Index Files

Offer Index 62

VISHAY,
MURATA,
NEC,
ROHM,
POWER,
LINEAR,
SAMSUNG,
FREESCALE,
MOT,
DALLAS,
MICROCHIP,
MIT,
BB,
PHI,
INTEL,
PANASONIC,
ALLEGRO,
IXYS,
WJ,
FUJI,
RENESAS,
INTERSIL,
AMD,
YAGEO,
MPS,
AVAGO,
SIEMENS,
SHARP,
MIC,
BOURNS,
VICOR,
HIT,
MOLEX,
NICHICON,
ISSI,
MICREL,
AMP,
TDK,
NIPPON CHEMI-CON,
PERICOM

 
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Product Summary
ST M27C64A-30F6
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: M27C64A-30F6.


Available from: Hongkong Booyi Technology Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:LQW18AN82NG00D, LSM2-T/6-W3-C, LT1054CS, LT1155, LT1376CS8, LTST-C150CKT, LV25-P, LW015A81, LWA673, LY62W1024, M200O3-LA1, M27C1001-10F3, M27C1001-70XF1, M27C1001-80XF6, M27C256B-12F6, M27C256B-70F3

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: M27C64A-30F6":

Post DatePart NumberBrandD/CDescQtyCompany
Mon Jan 16 05:50:00 UTC 2012M27C64A-30F6 (from hkin.com)ST07+/08+DIP2600Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012M27C64A-30F6 (from standard server 2)ST07+/08+DIP2600Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012M27C64A-30F6 (from parts server 2)ST07+/08+DIP2600Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012M27C64A-30F6 (from hkin.com 2)ST07+/08+DIP2600Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012M27C64A-30F6 (from hkin.com 2)ST07+/08+DIP2600Hongkong Booyi Technology Limited

Last record M27C256B-70F3:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Jan 16 05:50:00 UTC 2012M27C256B-70F3 (from hkin.com)ST07+/08+DIP1560Hongkong Booyi Technology Limited

Last record M27C256B-12F6:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Jan 16 05:50:00 UTC 2012M27C256B-12F6 (from hkin.com)ST07+/08+DIP2600Hongkong Booyi Technology Limited
Mon Jan 16 08:37:00 UTC 2012M27C256B-12F6 (from hkin.com)ST2008+DIP800Hengguang (HK) Electronics Trading Limited

Last record M27C1001-80XF6:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Jan 16 05:50:00 UTC 2012M27C1001-80XF6 (from hkin.com)ST07+/08+DIP2400Hongkong Booyi Technology Limited

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For quantities that vary polynomially or logarithmically with temperature, it may be possible to calculate a temperature coefficient that is a useful approximation for a certain range of temperatures. For each computer built, all of these had to be placed and soldered onto printed circuit boards, and often multiple boards would have to be interconnected in a chassis. The thyristor appeared in 1957. These techniques use convection, conduction, & radiation of heat energy. Consumer electronics are manufactured throughout the world, although there is a particularly high concentration of headquarters, factories, research and development activity in East Asia, especially in Japan. This may be done to limit the bandwidth to a narrow band centered around the intended operating frequency. Synthesis is a process where a VHDL is compiled and mapped into an implementation technology such as an FPGA or an ASIC. Microprocessors make it possible to put a computer into thousands of items that were traditionally not computer-related.
any passive component and active component such as:Diode, Circuit designers will sometimes refer to this class of components as dissipative, or thermodynamically passive. A minimal hypothetical microprocessor might only include an arithmetic logic unit (ALU) and a control logic section. With this structure, one of the connections of the device is located on the bottom of the semiconductor die.1 (known as VHDL-AMS) provided analog and mixed-signal circuit design extensions. For example driver circuit
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