Part: IP-23L-CU

Index Files

Offer Index 61

PANASONIC,
TOS,
ON,
INFINEON,
AVX,
IR,
FUJI,
MICRON,
LINEAR,
LATTICE,
SEMIKRON,
VISHAY,
BRIGHT,
模块,
FREESCALE,
MIT,
NVIDIA,
MOT,
SANYO,
NEC,
AMD,
BROADCOM,
ROHM,
STMICROELECTRONICS,
PHI,
DALLAS,
RENESAS,
YAGEO,
SHARP,
QUALCOMM,
HIT,
HARVATEK,
KEMET,
AVAGO,
COOPER,
INTERSIL,
MOLEX,
MICREL,
ISD/NUVOTON,
TDK,
ISSI,
AGILENT,
ATI,
HYNIX,
COILCRAFT,
BOURNS,
LITTELFUSE,
FUJITSU,
IDT,
SEIKO,
EUPEC,
TE,
ELPIDA,
TRACO,
CIRRUS,
SONY,
MPS,
EPCOS,
RECOM,
SST,
ASTEC,
CREE,
AUO,
IC,
SILICON,
ABB,
QFN,
EVERLIGHT,
CJ(CHINA),
SIPEX,
EPSON,
NXP/PHI,
DIODES,
BB,
AOS,
POWER,
ALLEGRO,
IXYS,
TI ,
FTDI,
VICOR,
JAE,
JRC,
JST,
MXIC,
TI,
AD,
ST,
ALTERA,
NS,
XILINX,
MAX,
ATMEL,
SAMSUNG,
NXP,
INTEL,
MICROCHIP,
CY,
FSC,
MURATA,
TOS,
PANASONIC,
ON,
INFINEON,
IR,
AVX,
LINEAR,
MICRON,
NVIDIA,
FUJI,
LATTICE,
VISHAY,
SEMIKRON,
FREESCALE,
MOT,
BRIGHT,
AMD,
模块,
NEC,
PHI,
BROADCOM,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
MIT,
SHARP,
YAGEO,
QUALCOMM,
HIT,
HARVATEK,
AVAGO,
KEMET,
INTERSIL,
COOPER,
MOLEX,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
FUJITSU,
AGILENT,
HYNIX,
ISSI,
IDT,
COILCRAFT,
EUPEC,
BOURNS,
LITTELFUSE,
SEIKO,
TE,
ELPIDA,
CIRRUS,
TRACO,
SONY,
EPCOS,
MPS,
SST,
RECOM,
LAMBDA,
BB,
CREE,
AUO,
IC,
SILICON,
EVERLIGHT,
QFN,
CJ(CHINA),
EPSON,
SIPEX,
DIODES,
IXYS,
NXP/PHI,
BB/TI,
ASTEC,
ALLEGRO,
SPANSION,
AOS,
POWER,
CONEXANT,
TI ,
FTDI,
MXIC,
VICOR,
TI,
AD,
ST,
ALTERA,
XILINX,
NS,
ATMEL,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
MURATA,
PANASONIC,
TOS,
ON,
AVX,
IR,
INFINEON,
VISHAY,
LINEAR,
NVIDIA,
FUJI,
LATTICE,
MICRON,
BRIGHT,
AMD,
FREESCALE,
MOT,
模块,
PHI,
BROADCOM,
NEC,
SEMIKRON,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
SHARP,
YAGEO,
QUALCOMM,
HIT,
MIT,
HARVATEK,
KEMET,
AVAGO,
COOPER,
MOLEX,
INTERSIL,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
ISSI,
BOURNS,
HYNIX,
COILCRAFT,
IDT,
LITTELFUSE,
FUJITSU,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
MPS,
SONY,
EPCOS,
RECOM,
SST,
LAMBDA,
EPSON,
AUO,
CREE,
IC,
BB,
SILICON,
EVERLIGHT,
QFN,
CJ(CHINA),
NXP/PHI,
DIODES,
SIPEX,
STACKPOLE TECHNOLOGY, INC.,
ASTEC,
BB/TI,
MXIC,
POWER,
AOS,
SPANSION,
TI ,
ALLEGRO,
FTDI,
IXYS,
REALTEK,
VICOR,
TI,
AD,
ST,
ALTERA,
ATMEL,
XILINX,
NS,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
IR,
AVX,
VISHAY,
INFINEON,
LINEAR,
FREESCALE,
NVIDIA,
FUJI,
MICRON,
LATTICE,
AMD,
BRIGHT,
MOT,
PHI,
NEC,
BROADCOM,
SANYO,
ROHM,
SEMIKRON,
STMICROELECTRONICS,
RENESAS,
DALLAS,
SHARP,
YAGEO,
INTERSIL,
QUALCOMM,
HIT,
MIT,
HARVATEK,
KEMET,
AVAGO,
MOLEX,
MICREL,
COOPER,
ATI,
ISD/NUVOTON,
TDK,
ISSI,
AGILENT,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
FUJITSU,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
CIRRUS,
TRACO,
MPS,
POWER,
AOS,
SST,
EPCOS,
SONY,
DIP,
EPSON,
SIPEX,
RECOM,
模块,
LAMBDA,
EUPEC,
AUO,
IC,
BB,
CREE,
QFN,
SILICON,
EVERLIGHT,
SPANSION,
CJ(CHINA),
DIODES,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
MXIC,
ASTEC,
BB/TI,
WINBOND,
ALLEGRO,
TI ,
FTDI,
TI,
ST,
AD,
ALTERA,
ATMEL,
XILINX,
NS,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
VISHAY,
INFINEON,
AVX,
FUJI,
IR,
MICRON,
LINEAR,
FREESCALE,
NVIDIA,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
AMD,
NEC,
PHI,
SANYO,
ROHM,
BROADCOM,
STMICROELECTRONICS,
RENESAS,
SHARP,
DALLAS,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
AVAGO,
HARVATEK,
KEMET,
MOLEX,
COOPER,
MICREL,
ATI,
ISD/NUVOTON,
ISSI,
TDK,
AGILENT,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
FUJITSU,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
CIRRUS,
TRACO,
MPS,
AOS,
EPCOS,
POWER,
DIP,
LAMBDA,
SIPEX,
RECOM,
模块,
EUPEC,
BB/TI,
SST,
AUO,
CREE,
IC,
EVERLIGHT,
QFN,
SILICON,
ABB,
RECTRON,
EPSON,
CJ(CHINA),
DIODES,
SONY,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
SPANSION,
ASTEC,
WINBOND,
ALLEGRO,
TI ,
CONEXANT,
TI,
ST,
AD,
ALTERA,
ATMEL,
XILINX,
NS,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
FSC,
CY,
TOS,
MURATA,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
IR,
FUJI,
MICRON,
LINEAR,
FREESCALE,
NVIDIA,
SEMIKRON,
LATTICE,
MOT,
NEC,
AMD,
BRIGHT,
PHI,
SANYO,
ROHM,
BROADCOM,
RENESAS,
STMICROELECTRONICS,
DALLAS,
SHARP,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
AVAGO,
KEMET,
HARVATEK,
MOLEX,
COOPER,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
FUJITSU,
ISSI,
AGILENT,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
SEIKO,
KOA KAOHSIUNG CORPORATION,
ELPIDA,
EPCOS,
TRACO,
CIRRUS,
MPS,
POWER,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
EVERLIGHT,
QFN,
ABB,
SONY,
EPSON,
RECTRON,
SIPEX,
DIODES,
CJ(CHINA),
SPANSION,
AOS,
ALLEGRO,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
WINBOND,
CONEXANT,
ASTEC,
MXIC,
TI,
ST,
AD,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
LINEAR,
FREESCALE,
NVIDIA,
SEMIKRON,
LATTICE,
MICRON,
MOT,
NEC,
AMD,
BRIGHT,
PHI,
BROADCOM,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
SHARP,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
AVAGO,
MIT,
KEMET,
HARVATEK,
MOLEX,
COOPER,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
ISSI,
AGILENT,
FUJITSU,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
POWER,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
EVERLIGHT,
ABB,
QFN,
SONY,
EPSON,
RECTRON,
SIPEX,
CJ(CHINA),
AOS,
ALLEGRO,
NXP/PHI,
SPANSION,
STACKPOLE TECHNOLOGY, INC.,
WINBOND,
CONEXANT,
ASTEC,
REALTEK,
TI ,
TI,
ST,
AD,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
LINEAR,
FREESCALE,
NVIDIA,
SEMIKRON,
LATTICE,
MICRON,
MOT,
NEC,
AMD,
BRIGHT,
PHI,
BROADCOM,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
SHARP,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
AVAGO,
MIT,
KEMET,
HARVATEK,
ISSI,
MOLEX,
COOPER,
MICREL,
NUVOTON,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
FUJITSU,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
POWER,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
WINBOND,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
BCD,
EVERLIGHT,
ABB,
QFN,
SONY,
EPSON,
RECTRON,
SIPEX,
CJ(CHINA),
AOS,
ALLEGRO,
NXP/PHI,
SPANSION,
STACKPOLE TECHNOLOGY, INC.,
CONEXANT,
ASTEC,
TI,
ST,
AD,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
FSC,
MURATA,
TOS,
PANASONIC,
ON,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
FREESCALE,
LINEAR,
NVIDIA,
SEMIKRON,
LATTICE,
MICRON,
MOT,
AMD,
BRIGHT,
NEC,
PHI,
BROADCOM,
ROHM,
STMICROELECTRONICS,
SANYO,
DALLAS,
SHARP,
RENESAS,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
KEMET,
AVAGO,
HARVATEK,
ISSI,
MOLEX,
COOPER,
MICREL,
NUVOTON,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
FUJITSU,
IDT,
HYNIX,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
WINBOND,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
BCD,
EVERLIGHT,
ABB,
QFN,
EPSON,
RECTRON,
POWER,
SONY,
CJ(CHINA),
AOS,
NXP/PHI,
SIPEX,
SPANSION,
STACKPOLE TECHNOLOGY, INC.,
ASTEC,
ALLEGRO,
TI ,
TI,
AD,
ST,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
MURATA,
TOS,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
FREESCALE,
LINEAR,
NVIDIA,
SEMIKRON,
MICRON,
LATTICE,
AMD,
MOT,
BRIGHT,
NEC,
PHI,
BROADCOM,
ROHM,
DALLAS,
STMICROELECTRONICS,
SANYO,
ALLEGRO,
SHARP,
RENESAS,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
KEMET,
AVAGO,
ISSI,
HARVATEK,
MOLEX,
MICREL,
COOPER,
NUVOTON,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
FUJITSU,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
INNOLUX,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
SST,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
WINBOND,
AUO,
BB/TI,
SILICON,
CREE,
IC,
BB,
BCD,
EVERLIGHT,
ABB,
POWER,
QFN,
EPSON,
RECTRON,
SPANSION,
SONY,
CJ(CHINA),
AOS,
NXP/PHI,
SIPEX,
STACKPOLE TECHNOLOGY, INC.,
TI,
AD,
ST,
MAX,
ALTERA,
ATMEL,
NXP,
NS,
XILINX,
INTEL,
MICROCHIP,
SAMSUNG,
CY,
FSC,
ON,
MURATA,
TOS,
PANASONIC,
INFINEON,
VISHAY,
IR,
AVX,
FREESCALE,
LINEAR,
NVIDIA,
LATTICE,
MICRON,
MOT,
SEMIKRON,
AMD,
NEC,
PHI,
BROADCOM,
ALLEGRO,
ROHM,
SANYO,
DALLAS,
FUJI,
SHARP,
STMICROELECTRONICS,
COILCRAFT,
RENESAS,
YAGEO,
INTERSIL,
AVAGO,
QUALCOMM,
HIT,
MIT,
KEMET,
ISSI,
HARVATEK,
SUMIDA,
MOLEX,
COOPER,
MICREL,
TDK,
NUVOTON,
ATI,
ISD/NUVOTON,
FUJITSU,
HYNIX,
AGILENT,
IDT,
BOURNS,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
TRACO,
SEIKO,
INNOLUX,
BB,
ELPIDA,
CIRRUS,
EPCOS,
MPS,
SST,
SILICON,
DIP,
EUPEC,
RECOM,
模块,
POWER,
WINBOND,
AUO,
BB/TI,
CREE,
IC,
EVERLIGHT,
BCD,
SPANSION,
EPSON,
SONY,
RECTRON,
AOS,
CJ(CHINA),
QFN,
SIPEX,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
COSEL,
MXIC,
TI,
AD,
ST,
MAX,
ALTERA,
ATMEL,
NXP,
NS,
XILINX,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
ON,
FSC,
MURATA,
TOS,
INFINEON,
PANASONIC,
VISHAY,
IR,
AVX,
FREESCALE,
LINEAR,
NVIDIA,
LATTICE,
MICRON,
MOT,
AMD,
SEMIKRON,
NEC,
PHI,
BROADCOM,
ALLEGRO,
ROHM,
SANYO,
DALLAS,
FUJI,
SHARP,
STMICROELECTRONICS,
COILCRAFT,
RENESAS,
YAGEO,
INTERSIL,
AVAGO,
HIT,
QUALCOMM,
MIT,
ISSI,
KEMET,
HARVATEK,
SUMIDA,
MOLEX,
COOPER,
MICREL,
TDK,
NUVOTON,
ATI,
ISD/NUVOTON,
FUJITSU,
AGILENT,
IDT,
BOURNS,
LITTELFUSE,
HYNIX,
KOA KAOHSIUNG CORPORATION,
TRACO,
BB,
SEIKO,
INNOLUX,
CIRRUS,
EPCOS,
MPS,
SST,
SILICON,
DIP,
EUPEC,
RECOM,
模块,
POWER,
WINBOND,
TE CONNECTIVITY ,
AUO,
BB/TI,
CREE,
IC,
EVERLIGHT,
BCD,
SPANSION,
SONY,
EPSON,
RECTRON,
DIODES,
AOS,
CJ(CHINA),
QFN,
SIPEX,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
COSEL,
TI,
AD,
MAX,
ALTERA,
ST,
ATMEL,
NXP,
NS,
MICROCHIP,
XILINX,
TOS,
CY,
ON,
INFINEON,
FSC,
INTEL,
MURATA,
PANASONIC,
IR,
VISHAY,
MICRON,
SAMSUNG,
AVX,
FREESCALE,
LINEAR,
LATTICE,
MOT,
SEMIKRON,
MIT,
NEC,
PHI,
BROADCOM,
ALLEGRO,
DALLAS,
COILCRAFT,
AMD,
ROHM,
RENESAS,
SHARP,
FUJI,
NVIDIA,
STMICROELECTRONICS,
YAGEO,
AVAGO,
INTERSIL,
HIT,
QUALCOMM,
KEMET,
HARVATEK,
ISSI,
SUMIDA,
MOLEX,
COOPER,
MICREL,
TDK,
NUVOTON,
SANYO,
ISD/NUVOTON,
AGILENT,
FUJITSU,
VICOR,
IDT,
BOURNS,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
TRACO,
BB,
SEIKO,
INNOLUX,
SONY,
CIRRUS,
EPCOS,
MPS,
SILICON,
DIP,
SST,
模块,
POWER,
TE CONNECTIVITY ,
BB/TI,
AUO,
WINBOND,
IC,
CREE,
EVERLIGHT,
ATI,
EUPEC,
BCD,
SPANSION,
EPSON,
DIODES,
AOS,
CJ(CHINA),
QFN,
NXP/PHI,
SIPEX,
STACKPOLE TECHNOLOGY, INC.,
MIC,
JST,
MXIC,
TI,
AD,
MAX,
ST,
ALTERA,
NS,
ATMEL,
NXP,
MICROCHIP,
XILINX,
TOS,
CY,
ON,
INFINEON,
INTEL,
FSC,
MURATA,
PANASONIC,
IR,
VISHAY,
MICRON,
SAMSUNG,
FREESCALE,
AVX,
LINEAR,
LATTICE,
MOT,
SEMIKRON,
PHI,
NEC,
RENESAS,
MIT,
BROADCOM,
ALLEGRO,
DALLAS,
NVIDIA,
ROHM,
COILCRAFT,
AMD,
SHARP,
FUJI,
STMICROELECTRONICS,
YAGEO,
HIT,
INTERSIL,
AVAGO,
QUALCOMM,
ISSI,
KEMET,
HARVATEK,
SUMIDA,
MOLEX,
MICREL,
COOPER,
SANYO,
TDK,
NUVOTON,
BB,
ISD/NUVOTON,
FUJITSU,
AGILENT,
VICOR,
IDT,
BOURNS,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SONY,
TRACO,
SEIKO,
INNOLUX,
CIRRUS,
MPS,
EPCOS,
SST,
SILICON,
DIP,
模块,
POWER,
TE CONNECTIVITY ,
BB/TI,
WINBOND,
AUO,
IC,
CREE,
EVERLIGHT,
ATI,
EUPEC,
BCD,
SPANSION,
MIC,
EPSON,
DIODES,
AOS,
CJ(CHINA),
QFN,
SIPEX,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
HYNIX,
MXIC,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
TOS,
ATMEL,
ON,
MICROCHIP,
INTEL,
XILINX,
INFINEON,
VISHAY,
CY,
FSC,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
LINEAR,
FREESCALE,
LATTICE,
MOT,
AMD,
PHI,
SEMIKRON,
NEC,
NVIDIA,
RENESAS,
BROADCOM,
ALLEGRO,
ROHM,
COILCRAFT,
DALLAS,
SHARP,
AVAGO,
YAGEO,
HIT,
INTERSIL,
KEMET,
HARVATEK,
ISSI,
MIT,
SANYO,
SUMIDA,
MOLEX,
COOPER,
MICREL,
QUALCOMM,
NUVOTON,
BB,
ATI,
ISD/NUVOTON,
TDK,
FUJI,
FUJITSU,
AGILENT,
VICOR,
BOURNS,
EUPEC,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
MCP,
TRACO,
IDT,
SEIKO,
SONY,
INNOLUX,
EPCOS,
MPS,
CIRRUS,
SST,
SILICON,
DIP,
RECOM,
模块,
POWER,
TE CONNECTIVITY ,
BB/TI,
AUO,
IC,
EVERLIGHT,
SPANSION,
WINBOND,
CREE,
MIC,
BCD,
DIODES,
AOS,
CJ(CHINA),
QFN,
NXP/PHI,
AT,
EPSON,
STACKPOLE TECHNOLOGY, INC.,
MXIC,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
TOS,
ATMEL,
FSC,
ON,
MICROCHIP,
INTEL,
XILINX,
INFINEON,
VISHAY,
CY,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
FREESCALE,
LINEAR,
AMD,
LATTICE,
MOT,
PHI,
SEMIKRON,
NEC,
NVIDIA,
RENESAS,
BROADCOM,
ALLEGRO,
ROHM,
COILCRAFT,
DALLAS,
SHARP,
AVAGO,
YAGEO,
FUJI,
HIT,
HARVATEK,
ISSI,
KEMET,
MIT,
SANYO,
INTERSIL,
MOLEX,
SUMIDA,
COOPER,
MICREL,
QUALCOMM,
NUVOTON,
BB,
ATI,
ISD/NUVOTON,
TDK,
FUJITSU,
AGILENT,
VICOR,
BOURNS,
EUPEC,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
MCP,
SONY,
TRACO,
IDT,
SEIKO,
INNOLUX,
EPCOS,
MPS,
CIRRUS,
SST,
SPANSION,
DIP,
SILICON,
RECOM,
模块,
TE CONNECTIVITY ,
WINBOND,
BB/TI,
AUO,
IC,
EVERLIGHT,
BCD,
CREE,
MIC,
POWER,
DIODES,
AOS,
HYNIX,
CJ(CHINA),
QFN,
NXP/PHI,
AT,
EPSON,
STACKPOLE TECHNOLOGY, INC.,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
ATMEL,
FSC,
MICROCHIP,
ON,
TOS,
INTEL,
XILINX,
INFINEON,
CY,
VISHAY,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
FREESCALE,
LINEAR,
MOT,
LATTICE,
AMD,
SEMIKRON,
PHI,
NEC,
IXYS,
BROADCOM,
ALLEGRO,
ROHM,
RENESAS,
COILCRAFT,
AVAGO,
DALLAS,
SHARP,
NVIDIA,
YAGEO,
FUJI,
HIT,
模块,
SANYO,
HARVATEK,
ISSI,
KEMET,
MIT,
INTERSIL,
MOLEX,
SUMIDA,
ATI,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
POWER,
TDK,
BB,
ISD/NUVOTON,
VICOR,
EUPEC,
IDT,
BOURNS,
LITTELFUSE,
FUJITSU,
SONY,
TRACO,
KOA KAOHSIUNG CORPORATION,
MCP,
SEIKO,
EPCOS,
MPS,
SST,
SPANSION,
SILICON,
RECOM,
MURATA PS,
WINBOND,
TE CONNECTIVITY ,
INNOLUX,
BB/TI,
EVERLIGHT,
IC,
BCD,
CREE,
MIC,
CIRRUS,
DIODES,
AT,
QFN,
AOS,
NXP/PHI,
EPSON,
STACKPOLE TECHNOLOGY, INC.,
JST,
REALTEK,
MXIC,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
ATMEL,
FSC,
MICROCHIP,
ON,
TOS,
INTEL,
XILINX,
INFINEON,
CY,
VISHAY,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
FREESCALE,
LINEAR,
MOT,
SEMIKRON,
LATTICE,
AMD,
PHI,
NEC,
IXYS,
BROADCOM,
ALLEGRO,
ROHM,
RENESAS,
AVAGO,
COILCRAFT,
DALLAS,
SHARP,
NVIDIA,
YAGEO,
FUJI,
HIT,
模块,
MIT,
SANYO,
HARVATEK,
ISSI,
KEMET,
INTERSIL,
MOLEX,
SUMIDA,
ATI,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
POWER,
TDK,
BB,
ISD/NUVOTON,
VICOR,
EUPEC,
IDT,
BOURNS,
FUJITSU,
LITTELFUSE,
SONY,
TRACO,
KOA KAOHSIUNG CORPORATION,
MCP,
SEIKO,
EPCOS,
MPS,
SST,
SPANSION,
SILICON,
RECOM,
MURATA PS,
WINBOND,
TE CONNECTIVITY ,
INNOLUX,
BB/TI,
EVERLIGHT,
IC,
BCD,
CREE,
MIC,
CIRRUS,
DIODES,
AT,
QFN,
AOS,
NXP/PHI,
EPSON,
STACKPOLE TECHNOLOGY, INC.,
JST,
REALTEK,
MXIC,
TI,
AD,
ST,
MAX,
NS,
NXP,
FSC,
MICROCHIP,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
INFINEON,
CY,
INTEL,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
IR,
FREESCALE,
LINEAR,
MOT,
NEC,
SEMIKRON,
LATTICE,
AMD,
ALLEGRO,
PHI,
BROADCOM,
HIT,
ROHM,
RENESAS,
AVAGO,
DALLAS,
SHARP,
YAGEO,
FUJI,
IXYS,
SUMIDA,
模块,
MIT,
HARVATEK,
SANYO,
KEMET,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
BB,
ISD/NUVOTON,
TDK,
NVIDIA,
VICOR,
INTERSIL,
EUPEC,
COILCRAFT,
BOURNS,
FUJITSU,
LITTELFUSE,
SONY,
TRACO,
MCP,
SEIKO,
IDT,
POWER,
EPCOS,
ATI,
ISSI,
MPS,
SILICON,
RECOM,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
WINBOND,
INNOLUX,
BB/TI,
EVERLIGHT,
IC,
SST,
CREE,
BCD,
MIC,
DIODES,
CIRRUS,
AT,
QFN,
AOS,
EPSON,
JST,
AUO,
HYNIX,
TI ,
JAE,
WCH,
TI,
AD,
ST,
MAX,
NS,
NXP,
FSC,
MICROCHIP,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
INFINEON,
CY,
INTEL,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
IR,
FREESCALE,
MOT,
LINEAR,
NEC,
SEMIKRON,
LATTICE,
AMD,
ALLEGRO,
PHI,
BROADCOM,
HIT,
ROHM,
RENESAS,
AVAGO,
DALLAS,
RECOM,
SHARP,
YAGEO,
FUJI,
IXYS,
SUMIDA,
模块,
MIT,
HARVATEK,
SANYO,
KEMET,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
BB,
ISD/NUVOTON,
TDK,
NVIDIA,
TRACO,
VICOR,
INTERSIL,
EUPEC,
COILCRAFT,
BOURNS,
FUJITSU,
LITTELFUSE,
SONY,
MCP,
SEIKO,
IDT,
POWER,
EPCOS,
ATI,
ISSI,
MPS,
SILICON,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
WINBOND,
INNOLUX,
BB/TI,
EVERLIGHT,
IC,
SST,
CREE,
BCD,
MIC,
DIODES,
CIRRUS,
AT,
QFN,
AOS,
EPSON,
JST,
AUO,
HYNIX,
TI ,
JAE,
WCH,
TI,
AD,
ST,
MAX,
NS,
NXP,
MICROCHIP,
FSC,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
CY,
INTEL,
INFINEON,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
FREESCALE,
IR,
LINEAR,
MOT,
LATTICE,
NEC,
AMD,
ALLEGRO,
PHI,
SEMIKRON,
HIT,
BROADCOM,
ROHM,
RENESAS,
DALLAS,
RECOM,
AVAGO,
SHARP,
YAGEO,
IXYS,
FUJI,
SUMIDA,
模块,
HARVATEK,
KEMET,
MIT,
SANYO,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
BB,
ISD/NUVOTON,
TDK,
NVIDIA,
TRACO,
VICOR,
COILCRAFT,
INTERSIL,
BOURNS,
LITTELFUSE,
SONY,
MCP,
EUPEC,
SEIKO,
POWER,
FUJITSU,
IDT,
ATI,
ISSI,
MPS,
EPCOS,
SILICON,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
INNOLUX,
BB/TI,
WINBOND,
IC,
CREE,
SST,
BCD,
DIODES,
EVERLIGHT,
AT,
QFN,
MIC,
AOS,
CIRRUS,
EPSON,
JST,
AUO,
TI ,
JAE,
WCH,
HYNIX,
TI,
AD,
ST,
MAX,
NS,
NXP,
MICROCHIP,
FSC,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
CY,
INTEL,
INFINEON,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
FREESCALE,
IR,
LINEAR,
MOT,
LATTICE,
NEC,
AMD,
ALLEGRO,
PHI,
SEMIKRON,
HIT,
BROADCOM,
ROHM,
RENESAS,
DALLAS,
RECOM,
AVAGO,
SHARP,
YAGEO,
IXYS,
FUJI,
SUMIDA,
模块,
HARVATEK,
KEMET,
MIT,
SANYO,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
BB,
ISD/NUVOTON,
TDK,
NVIDIA,
TRACO,
VICOR,
COILCRAFT,
INTERSIL,
BOURNS,
LITTELFUSE,
SONY,
MCP,
EUPEC,
SEIKO,
POWER,
FUJITSU,
IDT,
ATI,
ISSI,
MPS,
EPCOS,
SILICON,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
INNOLUX,
BB/TI,
WINBOND,
IC,
CREE,
SST,
BCD,
DIODES,
EVERLIGHT,
AT,
QFN,
MIC,
AOS,
CIRRUS,
EPSON,
JST,
AUO,
TI ,
JAE,
WCH,
HYNIX,
TI,
AD,
ST,
MAX,
NS,
NXP,
MICROCHIP,
FSC,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
CY,
INTEL,
INFINEON,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
FREESCALE,
IR,
LINEAR,
MOT,
LATTICE,
NEC,
AMD,
ALLEGRO,
PHI,
SEMIKRON,
HIT,
BROADCOM,
ROHM,
RENESAS,
DALLAS,
RECOM,
AVAGO,
SHARP,
YAGEO,
IXYS,
FUJI,
SUMIDA,
模块,
HARVATEK,
KEMET,
MIT,
SANYO,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
BB,
ISD/NUVOTON,
TDK,
NVIDIA,
TRACO,
VICOR,
COILCRAFT,
INTERSIL,
BOURNS,
LITTELFUSE,
SONY,
MCP,
EUPEC,
SEIKO,
POWER,
FUJITSU,
IDT,
ATI,
MPS,
EPCOS,
SILICON,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
INNOLUX,
BB/TI,
IC,
CREE,
SST,
DIODES,
EVERLIGHT,
AT,
QFN,
MIC,
AOS,
CIRRUS,
EPSON,
ISSI,
WINBOND,
JST,
AUO,
TI ,
JAE,
WCH,
HYNIX,
BOSCH,
EXAR(SIPEX),
TI,
AD,
ST,
MAX,
NS,
NXP,
MICROCHIP,
FSC,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
CY,
INTEL,
INFINEON,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
FREESCALE,
IR,
LINEAR,
MOT,
LATTICE,
NEC,
AMD,
PHI,
SEMIKRON,
HIT,
BROADCOM,
ROHM,
RENESAS,
RECOM,
AVAGO,
DALLAS,
SHARP,
YAGEO,
IXYS,
FUJI,
SUMIDA,
模块,
HARVATEK,
KEMET,
MIT,
SANYO,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
ISD/NUVOTON,
TDK,
NVIDIA,
TRACO,
VICOR,
COILCRAFT,
INTERSIL,
BOURNS,
LITTELFUSE,
BB,
SONY,
MCP,
EUPEC,
ALLEGRO,
SEIKO,
FUJITSU,
POWER,
IDT,
ATI,
MPS,
EPCOS,
SILICON,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
INNOLUX,
BB/TI,
IC,
CREE,
EVERLIGHT,
AT,
QFN,
MIC,
AOS,
DIODES,
CIRRUS,
SST,
EPSON,
WINBOND,
JST,
AUO,
ISSI,
TI ,
JAE,
WCH,
BOSCH,
HYNIX,
EXAR(SIPEX),
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
FSC,
MICROCHIP,
ATMEL,
XILINX,
ON,
TOS,
INTEL,
CY,
INFINEON,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
FREESCALE,
IR,
MOT,
LINEAR,
NEC,
LATTICE,
PHI,
IXYS,
AMD,
SEMIKRON,
ROHM,
BROADCOM,
RENESAS,
AVAGO,
RECOM,
DALLAS,
SHARP,
YAGEO,
FUJI,
HIT,
SUMIDA,
模块,
MIT,
HARVATEK,
SANYO,
KEMET,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
ISD/NUVOTON,
TDK,
NVIDIA,
TRACO,
ISSI,
VICOR,
INTERSIL,
COILCRAFT,
BOURNS,
LITTELFUSE,
FUJITSU,
BB,
SONY,
MCP,
EUPEC,
JRC,
SEIKO,
ALLEGRO,
POWER,
MPS,
ATI,
EPCOS,
IDT,
SILICON,
SST,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
INNOLUX,
BB/TI,
IC,
CREE,
DIODES,
EVERLIGHT,
AT,
QFN,
AOS,
CIRRUS,
MIC,
NXP/PHI,
WINBOND,
EPSON,
JST,
AUO,
TI ,
ASTEC,
HYNIX,
JAE,
TI,
AD,
ST,
NS,
MAX,
NXP,
FSC,
MICROCHIP,
ATMEL,
ALTERA,
XILINX,
TOS,
ON,
INTEL,
CY,
IR,
VISHAY,
MURATA,
MICRON,
INFINEON,
PANASONIC,
SAMSUNG,
FREESCALE,
LINEAR,
MOT,
NEC,
LATTICE,
PHI,
AMD,
ROHM,
SEMIKRON,
BROADCOM,
AVAGO,
RENESAS,
RECOM,
DALLAS,
HIT,
SHARP,
YAGEO,
AVX,
FUJI,
SUMIDA,
模块,
HARVATEK,
MIT,
SANYO,
COOPER,
QUALCOMM,
MICREL,
ISD/NUVOTON,
TDK,
NVIDIA,
VICOR,
TRACO,
ISSI,
INTERSIL,
BOURNS,
COILCRAFT,
KEMET,
FUJITSU,
LITTELFUSE,
MCP,
SEIKO,
SONY,
JRC,
ATI,
POWER,
MPS,
IDT,
MOLEX,
EPCOS,
ALLEGRO,
BB,
EVERLIGHT,
SILICON,
SST,
SPANSION,
VISHAY DALE,
INNOLUX,
BB/TI,
DIODES,
IC,
CREE,
AT,
QFN,
CIRRUS,
NXP/PHI,
MIC,
AOS,
AUO,
TI ,
ASTEC,
HYNIX,
WCH,
EUPEC,
IXYS,
EPSON,
BOSCH,
JAE,
REALTEK,
TI,
AD,
ST,
NS,
MAX,
NXP,
FSC,
ATMEL,
MICROCHIP,
ALTERA,
XILINX,
TOS,
ON,
INTEL,
INFINEON,
IR,
CY,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
FREESCALE,
MOT,
LINEAR,
NEC,
LATTICE,
PHI,
ROHM,
AMD,
SEMIKRON,
BROADCOM,
RENESAS,
AVAGO,
HIT,
RECOM,
SHARP,
DALLAS,
YAGEO,
FUJI,
SUMIDA,
MIT,
模块,
HARVATEK,
KEMET,
MICREL,
SANYO,
NVIDIA,
INTERSIL,
COOPER,
QUALCOMM,
POWER,
TDK,
ISD/NUVOTON,
VICOR,
TRACO,
ISSI,
BOURNS,
COILCRAFT,
FUJITSU,
LITTELFUSE,
MIC,
SONY,
MCP,
SEIKO,
STMICROELECTRONICS,
IDT,
JRC,
ATI,
MPS,
MOLEX,
EPCOS,
ALLEGRO,
EVERLIGHT,
BB,
SILICON,
SST,
SPANSION,
VISHAY DALE,
INNOLUX,
BB/TI,
DIODES,
IC,
CREE,
AT,
CIRRUS,
QFN,
NXP/PHI,
EPSON,
AOS,
HYNIX,
TI ,
IXYS,
REALTEK,
WCH,
ASTEC,
EUPEC,
AUO,
BOSCH,
TI,
ST,
AD,
MAX,
NS,
NXP,
XILINX,
FSC,
IR,
ATMEL,
ALTERA,
TOS,
MICROCHIP,
ON,
INTEL,
MURATA,
INFINEON,
CY,
VISHAY,
MICRON,
SAMSUNG,
PANASONIC,
AVX,
MOT,
LINEAR,
FREESCALE,
NEC,
LATTICE,
PHI,
AMD,
ROHM,
SEMIKRON,
BROADCOM,
AVAGO,
HIT,
DALLAS,
RECOM,
SHARP,
YAGEO,
FUJI,
RENESAS,
SUMIDA,
模块,
MIT,
HARVATEK,
KEMET,
MICREL,
NVIDIA,
SANYO,
COOPER,
INTERSIL,
QUALCOMM,
ISD/NUVOTON,
TDK,
TRACO,
ISSI,
BOURNS,
COILCRAFT,
FUJITSU,
LITTELFUSE,
MCP,
SEIKO,
SONY,
MIC,
SILICON,
IDT,
JRC,
ATI,
MPS,
MOLEX,
ALLEGRO,
EPCOS,
VICOR,
IXYS,
EVERLIGHT,
VISHAY DALE,
INNOLUX,
SST,
BB/TI,
DIODES,
SPANSION,
IC,
CREE,
REALTEK,
STMICROELECTRONICS,
AT,
POWER,
CIRRUS,
QFN,
NXP/PHI,
BOSCH,
EPSON,
AOS,
HYNIX,
TI ,
WCH,
ASTEC,
BB,
EUPEC,
AUO,
TI,
ST,
AD,
NXP,
MAX,
FSC,
NS,
XILINX,
ATMEL,
ALTERA,
IR,
ON,
MICROCHIP,
TOS,
INTEL

 
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Product Summary
IP-23L-CU
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: IP-23L-CU.


Available from: BeiJing Jietuozijing Science and Technology Co., Ltd.
Condition: in excellent condition
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Fri Apr 26 01:12:00 UTC 2013IP-23L-CU (from standard server 2)800BeiJing Jietuozijing Science and Technology Co., Ltd.
Fri Apr 26 01:12:00 UTC 2013IP-23L-CU (from parts server 2)800BeiJing Jietuozijing Science and Technology Co., Ltd.
Fri Apr 26 01:12:00 UTC 2013IP-23L-CU (from hkin.com 2)800BeiJing Jietuozijing Science and Technology Co., Ltd.
Fri Apr 26 01:12:00 UTC 2013IP-23L-CU (from hkin.com 2)800BeiJing Jietuozijing Science and Technology Co., Ltd.
Fri Apr 26 01:12:00 UTC 2013IP-23L-CU01 (from standard server 2)VICOR700BeiJing Jietuozijing Science and Technology Co., Ltd.
Fri Apr 26 01:12:00 UTC 2013IP-23L-CU01 (from parts server 2)VICOR700BeiJing Jietuozijing Science and Technology Co., Ltd.
Fri Apr 26 01:12:00 UTC 2013IP-23L-CU01 (from hkin.com 2)VICOR700BeiJing Jietuozijing Science and Technology Co., Ltd.
Fri Apr 26 01:12:00 UTC 2013IP-23L-CU01 (from hkin.com 2)VICOR700BeiJing Jietuozijing Science and Technology Co., Ltd.
Fri Apr 26 01:12:00 UTC 2013IP-23L-CU-01 (from standard server 2)IP654BeiJing Jietuozijing Science and Technology Co., Ltd.
Fri Apr 26 01:12:00 UTC 2013IP-23L-CU-01 (from parts server 2)IP654BeiJing Jietuozijing Science and Technology Co., Ltd.
Fri Apr 26 01:12:00 UTC 2013IP-23L-CU-01 (from hkin.com 2)IP654BeiJing Jietuozijing Science and Technology Co., Ltd.
Fri Apr 26 01:12:00 UTC 2013IP-23L-CU-01 (from hkin.com 2)IP654BeiJing Jietuozijing Science and Technology Co., Ltd.

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Last record MAX3097ECEE:

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IP-23L-CU,IP-23L-CU,Comments from user about IP-23L-CU: Increasingly these products have become based on digital technologies, and have largely merged with the computer industry in what is increasingly referred to as the consumerization of information technology. A logic gate consists of up to about twenty transistors whereas an advanced microprocessor, as of 2011, can use as many as 3 billion transistors (MOSFETs). The first bipolar transistors devices with substantial power handling capabilities were introduced in the 1960s. Many more microprocessors are part of embedded systems, providing digital control of a myriad of objects from appliances to automobiles to cellular phones and industrial process control. Its basic function is to detect a fault condition and, by interrupting continuity, to immediately discontinue electrical flow. In principle, a single microarchitecture could execute several different ISAs with only minor changes to the microcode. It is a multipurpose, programmable device that accepts digital data as input, processes it according to instructions stored in its memory, and provides results as output. Light-emitting diodes are used in applications as diverse as replacements for aviation lighting, automotive lighting (particularly brake lamps, turn signals and indicators) as well as in traffic signals. Anything related to :IP-23L-CU, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: IP-23L-CU, search hkinventory: IP-23L-CU, The large number of discrete logic gates used more electrical powerXand therefore, produced more heatXthan a more integrated design with fewer ICs. However, its excellent performance in low voltage make it the device of choice (actually the only choice) for applications below 200 V. This indicates the variety of filter (see above) and the center or corner frequencies. Most power semiconductor devices are only used in commutation mode (i.e they are either on or off), and are therefore optimized for this. Datasheet Dir, DataSheet Archive
This is driven by gains in manufacturing efficiency and automation, lower labor costs as manufacturing has moved to lower-wage countries, and improvements in semiconductor design. Additional features were added to the processor architecture; more on-chip registers speeded up programs, and complex instructions could be used to make more compact programs. An integrated circuit or monolithic integrated circuit (also referred to as IC, chip, and microchip) is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material. Sometimes it may be difficult to differentiate between analog and digital circuits as they have elements of both linear and non-linear operation. Techniques such as branch prediction and speculative execution are used to lessen these branch penalties. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using electronic components. An electric field can increase the number of free electrons and holes in a semiconductor, thereby changing its conductivity. VHDL also allows arrays to be indexed in either ascending or descending direction; both conventions are used in hardware, whereas in Ada and most programming languages only ascending indexing is available.
any passive component and active component such as:1N4148, or 6502 Semiconductor devices have replaced thermionic devices (vacuum tubes) in most applications. Although the MOSFET is named in part for its "metal" gate, in modern devices polysilicon is typically used instead. Some common power devices are the power diode, thyristor, power MOSFET and IGBT. In 2008, Accellera released VHDL 4. For example driver circuit
IP-23L-CU,IP-23L-CU,Comments from user about IP-23L-CU: For quantities that vary exponentially with temperature, such as the rate of a chemical reaction, any temperature coefficient would be valid only over a very small temperature range. The pipelined architecture allows multiple instructions to overlap in execution, much like an assembly line. Execution units are also essential to microarchitecture. In electronics, a flip-flop or latch is a circuit that has two stable states and can be used to store state information. Furthermore, much less material is used to construct a packaged IC die than to construct a discrete circuit. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. An integrated circuit or monolithic integrated circuit (also referred to as IC, chip, and microchip) is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material.hn, which are optimized for distribution of HD content between CE devices in a home. Anything related to :IP-23L-CU, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: IP-23L-CUSee also: