Part: SN74LVC245APW

Index Files

Offer Index 60

MOT,
BRIGHT,
EVERLIGHT,
模块,
PHI,
NEC,
ROHM,
MIT,
AVAGO,
NVIDIA,
COILCRAFT,
BROADCOM,
DALLAS,
ALLEGRO,
YAGEO,
QUALCOMM,
INTERSIL,
RENESAS,
AMD,
HARVATEK,
KEMET,
MICREL,
SANYO,
SUMIDA,
HIT,
MOLEX,
ISD/NUVOTON,
TDK,
JRC,
HYNIX,
STMICROELECTRONICS,
IDT,
BOURNS,
FUJITSU,
LITTELFUSE,
REALTEK,
SEIKO,
POWER,
SHARP,
MIC,
ATI,
SILICON,
TE,
ELPIDA,
ABB,
TRACO,
COOPER,
MPS,
BB,
RECOM,
EPCOS,
EUPEC,
IC,
CREE,
SIPEX,
VICOR,
CIRRUS,
QFN,
DIODES,
HVCA,
SST,
CJ(CHINA),
EPSON,
SPANSION,
SONY,
BB/TI,
CONEXANT,
AOS,
TI ,
ISSI,
BOSCH,
EXAR(SIPEX),
TI,
ST,
AD,
MAX,
XILINX,
NS,
ATMEL,
ALTERA,
NXP,
SAMSUNG,
MICROCHIP,
INTEL,
FSC,
CY,
ON,
TOS,
MURATA,
PANASONIC,
INFINEON,
AVX,
VISHAY,
FREESCALE,
MICRON,
IR,
LINEAR,
LATTICE,
SEMIKRON,
BRIGHT,
MOT,
EVERLIGHT,
模块,
FUJI,
MIT,
PHI,
NEC,
ROHM,
NVIDIA,
AVAGO,
AMD,
COILCRAFT,
BROADCOM,
DALLAS,
ALLEGRO,
YAGEO,
QUALCOMM,
INTERSIL,
RENESAS,
HARVATEK,
KEMET,
MICREL,
SANYO,
SUMIDA,
HIT,
MOLEX,
TDK,
ISD/NUVOTON,
JRC,
HYNIX,
STMICROELECTRONICS,
IDT,
BOURNS,
FUJITSU,
LITTELFUSE,
POWER,
REALTEK,
SEIKO,
MIC,
SHARP,
ATI,
SILICON,
TE,
ELPIDA,
TRACO,
COOPER,
MPS,
VICOR,
BB,
RECOM,
EPCOS,
EUPEC,
CREE,
IC,
SIPEX,
CIRRUS,
QFN,
DIODES,
HVCA,
CJ(CHINA),
SST,
EPSON,
SONY,
SPANSION,
BB/TI,
AOS,
CONEXANT,
TI ,
ISSI,
BOSCH,
EXAR(SIPEX),
AT,
TI,
ST,
AD,
NS,
MAX,
XILINX,
ATMEL,
ALTERA,
SAMSUNG,
NXP,
MICROCHIP,
FSC,
INTEL,
TOS,
CY,
ON,
MURATA,
FUJI,
PANASONIC,
INFINEON,
AVX,
VISHAY,
IR,
MICRON,
FREESCALE,
MIT,
LINEAR,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
NVIDIA,
EVERLIGHT,
模块,
PHI,
NEC,
ROHM,
SANYO,
AMD,
BROADCOM,
AVAGO,
COILCRAFT,
DALLAS,
ALLEGRO,
YAGEO,
QUALCOMM,
SHARP,
RENESAS,
INTERSIL,
MICREL,
HARVATEK,
KEMET,
HIT,
MOLEX,
SUMIDA,
ATI,
COOPER,
TDK,
ISD/NUVOTON,
HYNIX,
JRC,
STMICROELECTRONICS,
ISSI,
REALTEK,
IDT,
FUJITSU,
BOURNS,
LITTELFUSE,
POWER,
SEIKO,
MIC,
SILICON,
ELPIDA,
TE,
SONY,
TRACO,
EPCOS,
MPS,
BB,
EUPEC,
SST,
RECOM,
COSEL,
CREE,
IC,
DIODES,
SIPEX,
CIRRUS,
QFN,
HVCA,
CJ(CHINA),
EPSON,
SPANSION,
NXP/PHI,
CONEXANT,
BB/TI,
ASTEC,
AOS,
TI ,
JAE,
TI,
AD,
ST,
XILINX,
MAX,
NS,
ATMEL,
ALTERA,
SAMSUNG,
NXP,
MICROCHIP,
INTEL,
FSC,
CY,
TOS,
MURATA,
FUJI,
PANASONIC,
ON,
INFINEON,
AVX,
IR,
MICRON,
MIT,
LINEAR,
SEMIKRON,
VISHAY,
LATTICE,
BRIGHT,
模块,
MOT,
FREESCALE,
NVIDIA,
NEC,
ROHM,
SANYO,
PHI,
BROADCOM,
AMD,
DALLAS,
YAGEO,
QUALCOMM,
SHARP,
INTERSIL,
RENESAS,
HARVATEK,
AVAGO,
KEMET,
HIT,
COOPER,
MICREL,
MOLEX,
ISD/NUVOTON,
TDK,
JRC,
ISSI,
HYNIX,
ATI,
IDT,
COILCRAFT,
FUJITSU,
BOURNS,
LITTELFUSE,
SEIKO,
TE,
ELPIDA,
TRACO,
SONY,
POWER,
EPCOS,
MPS,
RECOM,
EUPEC,
SST,
COSEL,
CREE,
IC,
EVERLIGHT,
SILICON,
QFN,
CIRRUS,
CJ(CHINA),
SIPEX,
BB,
NXP/PHI,
EPSON,
DIODES,
ASTEC,
AOS,
TI ,
SPANSION,
JAE,
JST,
CONEXANT,
MXIC,
AUO,
EXAR(SIPEX),
MIC,
REALTEK,
AT,
TI,
AD,
ST,
ALTERA,
MAX,
XILINX,
NS,
ATMEL,
NXP,
SAMSUNG,
MICROCHIP,
INTEL,
CY,
FSC,
TOS,
MURATA,
PANASONIC,
ON,
INFINEON,
AVX,
FUJI,
IR,
SEMIKRON,
MICRON,
LINEAR,
VISHAY,
LATTICE,
MIT,
BRIGHT,
模块,
FREESCALE,
NEC,
MOT,
NVIDIA,
ROHM,
SANYO,
BROADCOM,
AMD,
PHI,
QUALCOMM,
STMICROELECTRONICS,
DALLAS,
RENESAS,
YAGEO,
SHARP,
INTERSIL,
HIT,
AVAGO,
HARVATEK,
KEMET,
COOPER,
MICREL,
MOLEX,
ISD/NUVOTON,
TDK,
JRC,
ISSI,
HYNIX,
ATI,
IDT,
FUJITSU,
COILCRAFT,
BOURNS,
LITTELFUSE,
SEIKO,
EUPEC,
TE,
ELPIDA,
SONY,
TRACO,
MPS,
POWER,
EPCOS,
SST,
RECOM,
ASTEC,
CREE,
SILICON,
IC,
EVERLIGHT,
CIRRUS,
ABB,
QFN,
BB,
CJ(CHINA),
EPSON,
SIPEX,
NXP/PHI,
DIODES,
ALLEGRO,
AOS,
IXYS,
TI ,
FTDI,
SPANSION,
VICOR,
JAE,
JST,
MXIC,
CONEXANT,
TI,
AD,
ST,
ALTERA,
XILINX,
NS,
MAX,
ATMEL,
NXP,
SAMSUNG,
MICROCHIP,
INTEL,
CY,
MURATA,
FSC,
PANASONIC,
TOS,
ON,
INFINEON,
AVX,
IR,
FUJI,
MICRON,
LINEAR,
LATTICE,
SEMIKRON,
VISHAY,
BRIGHT,
模块,
FREESCALE,
MIT,
NVIDIA,
MOT,
SANYO,
NEC,
AMD,
BROADCOM,
ROHM,
STMICROELECTRONICS,
PHI,
DALLAS,
RENESAS,
YAGEO,
SHARP,
QUALCOMM,
HIT,
HARVATEK,
KEMET,
AVAGO,
COOPER,
INTERSIL,
MOLEX,
MICREL,
ISD/NUVOTON,
TDK,
ISSI,
AGILENT,
ATI,
HYNIX,
COILCRAFT,
BOURNS,
LITTELFUSE,
FUJITSU,
IDT,
SEIKO,
EUPEC,
TE,
ELPIDA,
TRACO,
CIRRUS,
SONY,
MPS,
EPCOS,
RECOM,
SST,
ASTEC,
CREE,
AUO,
IC,
SILICON,
ABB,
QFN,
EVERLIGHT,
CJ(CHINA),
SIPEX,
EPSON,
NXP/PHI,
DIODES,
BB,
AOS,
POWER,
ALLEGRO,
IXYS,
TI ,
FTDI,
VICOR,
JAE,
JRC,
JST,
MXIC,
TI,
AD,
ST,
ALTERA,
NS,
XILINX,
MAX,
ATMEL,
SAMSUNG,
NXP,
INTEL,
MICROCHIP,
CY,
FSC,
MURATA,
TOS,
PANASONIC,
ON,
INFINEON,
IR,
AVX,
LINEAR,
MICRON,
NVIDIA,
FUJI,
LATTICE,
VISHAY,
SEMIKRON,
FREESCALE,
MOT,
BRIGHT,
AMD,
模块,
NEC,
PHI,
BROADCOM,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
MIT,
SHARP,
YAGEO,
QUALCOMM,
HIT,
HARVATEK,
AVAGO,
KEMET,
INTERSIL,
COOPER,
MOLEX,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
FUJITSU,
AGILENT,
HYNIX,
ISSI,
IDT,
COILCRAFT,
EUPEC,
BOURNS,
LITTELFUSE,
SEIKO,
TE,
ELPIDA,
CIRRUS,
TRACO,
SONY,
EPCOS,
MPS,
SST,
RECOM,
LAMBDA,
BB,
CREE,
AUO,
IC,
SILICON,
EVERLIGHT,
QFN,
CJ(CHINA),
EPSON,
SIPEX,
DIODES,
IXYS,
NXP/PHI,
BB/TI,
ASTEC,
ALLEGRO,
SPANSION,
AOS,
POWER,
CONEXANT,
TI ,
FTDI,
MXIC,
VICOR,
TI,
AD,
ST,
ALTERA,
XILINX,
NS,
ATMEL,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
MURATA,
PANASONIC,
TOS,
ON,
AVX,
IR,
INFINEON,
VISHAY,
LINEAR,
NVIDIA,
FUJI,
LATTICE,
MICRON,
BRIGHT,
AMD,
FREESCALE,
MOT,
模块,
PHI,
BROADCOM,
NEC,
SEMIKRON,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
SHARP,
YAGEO,
QUALCOMM,
HIT,
MIT,
HARVATEK,
KEMET,
AVAGO,
COOPER,
MOLEX,
INTERSIL,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
ISSI,
BOURNS,
HYNIX,
COILCRAFT,
IDT,
LITTELFUSE,
FUJITSU,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
MPS,
SONY,
EPCOS,
RECOM,
SST,
LAMBDA,
EPSON,
AUO,
CREE,
IC,
BB,
SILICON,
EVERLIGHT,
QFN,
CJ(CHINA),
NXP/PHI,
DIODES,
SIPEX,
STACKPOLE TECHNOLOGY, INC.,
ASTEC,
BB/TI,
MXIC,
POWER,
AOS,
SPANSION,
TI ,
ALLEGRO,
FTDI,
IXYS,
REALTEK,
VICOR,
TI,
AD,
ST,
ALTERA,
ATMEL,
XILINX,
NS,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
IR,
AVX,
VISHAY,
INFINEON,
LINEAR,
FREESCALE,
NVIDIA,
FUJI,
MICRON,
LATTICE,
AMD,
BRIGHT,
MOT,
PHI,
NEC,
BROADCOM,
SANYO,
ROHM,
SEMIKRON,
STMICROELECTRONICS,
RENESAS,
DALLAS,
SHARP,
YAGEO,
INTERSIL,
QUALCOMM,
HIT,
MIT,
HARVATEK,
KEMET,
AVAGO,
MOLEX,
MICREL,
COOPER,
ATI,
ISD/NUVOTON,
TDK,
ISSI,
AGILENT,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
FUJITSU,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
CIRRUS,
TRACO,
MPS,
POWER,
AOS,
SST,
EPCOS,
SONY,
DIP,
EPSON,
SIPEX,
RECOM,
模块,
LAMBDA,
EUPEC,
AUO,
IC,
BB,
CREE,
QFN,
SILICON,
EVERLIGHT,
SPANSION,
CJ(CHINA),
DIODES,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
MXIC,
ASTEC,
BB/TI,
WINBOND,
ALLEGRO,
TI ,
FTDI,
TI,
ST,
AD,
ALTERA,
ATMEL,
XILINX,
NS,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
VISHAY,
INFINEON,
AVX,
FUJI,
IR,
MICRON,
LINEAR,
FREESCALE,
NVIDIA,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
AMD,
NEC,
PHI,
SANYO,
ROHM,
BROADCOM,
STMICROELECTRONICS,
RENESAS,
SHARP,
DALLAS,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
AVAGO,
HARVATEK,
KEMET,
MOLEX,
COOPER,
MICREL,
ATI,
ISD/NUVOTON,
ISSI,
TDK,
AGILENT,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
FUJITSU,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
CIRRUS,
TRACO,
MPS,
AOS,
EPCOS,
POWER,
DIP,
LAMBDA,
SIPEX,
RECOM,
模块,
EUPEC,
BB/TI,
SST,
AUO,
CREE,
IC,
EVERLIGHT,
QFN,
SILICON,
ABB,
RECTRON,
EPSON,
CJ(CHINA),
DIODES,
SONY,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
SPANSION,
ASTEC,
WINBOND,
ALLEGRO,
TI ,
CONEXANT,
TI,
ST,
AD,
ALTERA,
ATMEL,
XILINX,
NS,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
FSC,
CY,
TOS,
MURATA,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
IR,
FUJI,
MICRON,
LINEAR,
FREESCALE,
NVIDIA,
SEMIKRON,
LATTICE,
MOT,
NEC,
AMD,
BRIGHT,
PHI,
SANYO,
ROHM,
BROADCOM,
RENESAS,
STMICROELECTRONICS,
DALLAS,
SHARP,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
AVAGO,
KEMET,
HARVATEK,
MOLEX,
COOPER,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
FUJITSU,
ISSI,
AGILENT,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
SEIKO,
KOA KAOHSIUNG CORPORATION,
ELPIDA,
EPCOS,
TRACO,
CIRRUS,
MPS,
POWER,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
EVERLIGHT,
QFN,
ABB,
SONY,
EPSON,
RECTRON,
SIPEX,
DIODES,
CJ(CHINA),
SPANSION,
AOS,
ALLEGRO,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
WINBOND,
CONEXANT,
ASTEC,
MXIC,
TI,
ST,
AD,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
LINEAR,
FREESCALE,
NVIDIA,
SEMIKRON,
LATTICE,
MICRON,
MOT,
NEC,
AMD,
BRIGHT,
PHI,
BROADCOM,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
SHARP,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
AVAGO,
MIT,
KEMET,
HARVATEK,
MOLEX,
COOPER,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
ISSI,
AGILENT,
FUJITSU,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
POWER,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
EVERLIGHT,
ABB,
QFN,
SONY,
EPSON,
RECTRON,
SIPEX,
CJ(CHINA),
AOS,
ALLEGRO,
NXP/PHI,
SPANSION,
STACKPOLE TECHNOLOGY, INC.,
WINBOND,
CONEXANT,
ASTEC,
REALTEK,
TI ,
TI,
ST,
AD,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
LINEAR,
FREESCALE,
NVIDIA,
SEMIKRON,
LATTICE,
MICRON,
MOT,
NEC,
AMD,
BRIGHT,
PHI,
BROADCOM,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
SHARP,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
AVAGO,
MIT,
KEMET,
HARVATEK,
ISSI,
MOLEX,
COOPER,
MICREL,
NUVOTON,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
FUJITSU,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
POWER,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
WINBOND,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
BCD,
EVERLIGHT,
ABB,
QFN,
SONY,
EPSON,
RECTRON,
SIPEX,
CJ(CHINA),
AOS,
ALLEGRO,
NXP/PHI,
SPANSION,
STACKPOLE TECHNOLOGY, INC.,
CONEXANT,
ASTEC,
TI,
ST,
AD,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
FSC,
MURATA,
TOS,
PANASONIC,
ON,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
FREESCALE,
LINEAR,
NVIDIA,
SEMIKRON,
LATTICE,
MICRON,
MOT,
AMD,
BRIGHT,
NEC,
PHI,
BROADCOM,
ROHM,
STMICROELECTRONICS,
SANYO,
DALLAS,
SHARP,
RENESAS,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
KEMET,
AVAGO,
HARVATEK,
ISSI,
MOLEX,
COOPER,
MICREL,
NUVOTON,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
FUJITSU,
IDT,
HYNIX,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
WINBOND,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
BCD,
EVERLIGHT,
ABB,
QFN,
EPSON,
RECTRON,
POWER,
SONY,
CJ(CHINA),
AOS,
NXP/PHI,
SIPEX,
SPANSION,
STACKPOLE TECHNOLOGY, INC.,
ASTEC,
ALLEGRO,
TI ,
TI,
AD,
ST,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
MURATA,
TOS,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
FREESCALE,
LINEAR,
NVIDIA,
SEMIKRON,
MICRON,
LATTICE,
AMD,
MOT,
BRIGHT,
NEC,
PHI,
BROADCOM,
ROHM,
DALLAS,
STMICROELECTRONICS,
SANYO,
ALLEGRO,
SHARP,
RENESAS,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
KEMET,
AVAGO,
ISSI,
HARVATEK,
MOLEX,
MICREL,
COOPER,
NUVOTON,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
FUJITSU,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
INNOLUX,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
SST,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
WINBOND,
AUO,
BB/TI,
SILICON,
CREE,
IC,
BB,
BCD,
EVERLIGHT,
ABB,
POWER,
QFN,
EPSON,
RECTRON,
SPANSION,
SONY,
CJ(CHINA),
AOS,
NXP/PHI,
SIPEX,
STACKPOLE TECHNOLOGY, INC.,
TI,
AD,
ST,
MAX,
ALTERA,
ATMEL,
NXP,
NS,
XILINX,
INTEL,
MICROCHIP,
SAMSUNG,
CY,
FSC,
ON,
MURATA,
TOS,
PANASONIC,
INFINEON,
VISHAY,
IR,
AVX,
FREESCALE,
LINEAR,
NVIDIA,
LATTICE,
MICRON,
MOT,
SEMIKRON,
AMD,
NEC,
PHI,
BROADCOM,
ALLEGRO,
ROHM,
SANYO,
DALLAS,
FUJI,
SHARP,
STMICROELECTRONICS,
COILCRAFT,
RENESAS,
YAGEO,
INTERSIL,
AVAGO,
QUALCOMM,
HIT,
MIT,
KEMET,
ISSI,
HARVATEK,
SUMIDA,
MOLEX,
COOPER,
MICREL,
TDK,
NUVOTON,
ATI,
ISD/NUVOTON,
FUJITSU,
HYNIX,
AGILENT,
IDT,
BOURNS,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
TRACO,
SEIKO,
INNOLUX,
BB,
ELPIDA,
CIRRUS,
EPCOS,
MPS,
SST,
SILICON,
DIP,
EUPEC,
RECOM,
模块,
POWER,
WINBOND,
AUO,
BB/TI,
CREE,
IC,
EVERLIGHT,
BCD,
SPANSION,
EPSON,
SONY,
RECTRON,
AOS,
CJ(CHINA),
QFN,
SIPEX,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
COSEL,
MXIC,
TI,
AD,
ST,
MAX,
ALTERA,
ATMEL,
NXP,
NS,
XILINX,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
ON,
FSC,
MURATA,
TOS,
INFINEON,
PANASONIC,
VISHAY,
IR,
AVX,
FREESCALE,
LINEAR,
NVIDIA,
LATTICE,
MICRON,
MOT,
AMD,
SEMIKRON,
NEC,
PHI,
BROADCOM,
ALLEGRO,
ROHM,
SANYO,
DALLAS,
FUJI,
SHARP,
STMICROELECTRONICS,
COILCRAFT,
RENESAS,
YAGEO,
INTERSIL,
AVAGO,
HIT,
QUALCOMM,
MIT,
ISSI,
KEMET,
HARVATEK,
SUMIDA,
MOLEX,
COOPER,
MICREL,
TDK,
NUVOTON,
ATI,
ISD/NUVOTON,
FUJITSU,
AGILENT,
IDT,
BOURNS,
LITTELFUSE,
HYNIX,
KOA KAOHSIUNG CORPORATION,
TRACO,
BB,
SEIKO,
INNOLUX,
CIRRUS,
EPCOS,
MPS,
SST,
SILICON,
DIP,
EUPEC,
RECOM,
模块,
POWER,
WINBOND,
TE CONNECTIVITY ,
AUO,
BB/TI,
CREE,
IC,
EVERLIGHT,
BCD,
SPANSION,
SONY,
EPSON,
RECTRON,
DIODES,
AOS,
CJ(CHINA),
QFN,
SIPEX,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
COSEL,
TI,
AD,
MAX,
ALTERA,
ST,
ATMEL,
NXP,
NS,
MICROCHIP,
XILINX,
TOS,
CY,
ON,
INFINEON,
FSC,
INTEL,
MURATA,
PANASONIC,
IR,
VISHAY,
MICRON,
SAMSUNG,
AVX,
FREESCALE,
LINEAR,
LATTICE,
MOT,
SEMIKRON,
MIT,
NEC,
PHI,
BROADCOM,
ALLEGRO,
DALLAS,
COILCRAFT,
AMD,
ROHM,
RENESAS,
SHARP,
FUJI,
NVIDIA,
STMICROELECTRONICS,
YAGEO,
AVAGO,
INTERSIL,
HIT,
QUALCOMM,
KEMET,
HARVATEK,
ISSI,
SUMIDA,
MOLEX,
COOPER,
MICREL,
TDK,
NUVOTON,
SANYO,
ISD/NUVOTON,
AGILENT,
FUJITSU,
VICOR,
IDT,
BOURNS,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
TRACO,
BB,
SEIKO,
INNOLUX,
SONY,
CIRRUS,
EPCOS,
MPS,
SILICON,
DIP,
SST,
模块,
POWER,
TE CONNECTIVITY ,
BB/TI,
AUO,
WINBOND,
IC,
CREE,
EVERLIGHT,
ATI,
EUPEC,
BCD,
SPANSION,
EPSON,
DIODES,
AOS,
CJ(CHINA),
QFN,
NXP/PHI,
SIPEX,
STACKPOLE TECHNOLOGY, INC.,
MIC,
JST,
MXIC,
TI,
AD,
MAX,
ST,
ALTERA,
NS,
ATMEL,
NXP,
MICROCHIP,
XILINX,
TOS,
CY,
ON,
INFINEON,
INTEL,
FSC,
MURATA,
PANASONIC,
IR,
VISHAY,
MICRON,
SAMSUNG,
FREESCALE,
AVX,
LINEAR,
LATTICE,
MOT,
SEMIKRON,
PHI,
NEC,
RENESAS,
MIT,
BROADCOM,
ALLEGRO,
DALLAS,
NVIDIA,
ROHM,
COILCRAFT,
AMD,
SHARP,
FUJI,
STMICROELECTRONICS,
YAGEO,
HIT,
INTERSIL,
AVAGO,
QUALCOMM,
ISSI,
KEMET,
HARVATEK,
SUMIDA,
MOLEX,
MICREL,
COOPER,
SANYO,
TDK,
NUVOTON,
BB,
ISD/NUVOTON,
FUJITSU,
AGILENT,
VICOR,
IDT,
BOURNS,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SONY,
TRACO,
SEIKO,
INNOLUX,
CIRRUS,
MPS,
EPCOS,
SST,
SILICON,
DIP,
模块,
POWER,
TE CONNECTIVITY ,
BB/TI,
WINBOND,
AUO,
IC,
CREE,
EVERLIGHT,
ATI,
EUPEC,
BCD,
SPANSION,
MIC,
EPSON,
DIODES,
AOS,
CJ(CHINA),
QFN,
SIPEX,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
HYNIX,
MXIC,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
TOS,
ATMEL,
ON,
MICROCHIP,
INTEL,
XILINX,
INFINEON,
VISHAY,
CY,
FSC,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
LINEAR,
FREESCALE,
LATTICE,
MOT,
AMD,
PHI,
SEMIKRON,
NEC,
NVIDIA,
RENESAS,
BROADCOM,
ALLEGRO,
ROHM,
COILCRAFT,
DALLAS,
SHARP,
AVAGO,
YAGEO,
HIT,
INTERSIL,
KEMET,
HARVATEK,
ISSI,
MIT,
SANYO,
SUMIDA,
MOLEX,
COOPER,
MICREL,
QUALCOMM,
NUVOTON,
BB,
ATI,
ISD/NUVOTON,
TDK,
FUJI,
FUJITSU,
AGILENT,
VICOR,
BOURNS,
EUPEC,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
MCP,
TRACO,
IDT,
SEIKO,
SONY,
INNOLUX,
EPCOS,
MPS,
CIRRUS,
SST,
SILICON,
DIP,
RECOM,
模块,
POWER,
TE CONNECTIVITY ,
BB/TI,
AUO,
IC,
EVERLIGHT,
SPANSION,
WINBOND,
CREE,
MIC,
BCD,
DIODES,
AOS,
CJ(CHINA),
QFN,
NXP/PHI,
AT,
EPSON,
STACKPOLE TECHNOLOGY, INC.,
MXIC,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
TOS,
ATMEL,
FSC,
ON,
MICROCHIP,
INTEL,
XILINX,
INFINEON,
VISHAY,
CY,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
FREESCALE,
LINEAR,
AMD,
LATTICE,
MOT,
PHI,
SEMIKRON,
NEC,
NVIDIA,
RENESAS,
BROADCOM,
ALLEGRO,
ROHM,
COILCRAFT,
DALLAS,
SHARP,
AVAGO,
YAGEO,
FUJI,
HIT,
HARVATEK,
ISSI,
KEMET,
MIT,
SANYO,
INTERSIL,
MOLEX,
SUMIDA,
COOPER,
MICREL,
QUALCOMM,
NUVOTON,
BB,
ATI,
ISD/NUVOTON,
TDK,
FUJITSU,
AGILENT,
VICOR,
BOURNS,
EUPEC,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
MCP,
SONY,
TRACO,
IDT,
SEIKO,
INNOLUX,
EPCOS,
MPS,
CIRRUS,
SST,
SPANSION,
DIP,
SILICON,
RECOM,
模块,
TE CONNECTIVITY ,
WINBOND,
BB/TI,
AUO,
IC,
EVERLIGHT,
BCD,
CREE,
MIC,
POWER,
DIODES,
AOS,
HYNIX,
CJ(CHINA),
QFN,
NXP/PHI,
AT,
EPSON,
STACKPOLE TECHNOLOGY, INC.,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
ATMEL,
FSC,
MICROCHIP,
ON,
TOS,
INTEL,
XILINX,
INFINEON,
CY,
VISHAY,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
FREESCALE,
LINEAR,
MOT,
LATTICE,
AMD,
SEMIKRON,
PHI,
NEC,
IXYS,
BROADCOM,
ALLEGRO,
ROHM,
RENESAS,
COILCRAFT,
AVAGO,
DALLAS,
SHARP,
NVIDIA,
YAGEO,
FUJI,
HIT,
模块,
SANYO,
HARVATEK,
ISSI,
KEMET,
MIT,
INTERSIL,
MOLEX,
SUMIDA,
ATI,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
POWER,
TDK,
BB,
ISD/NUVOTON,
VICOR,
EUPEC,
IDT,
BOURNS,
LITTELFUSE,
FUJITSU,
SONY,
TRACO,
KOA KAOHSIUNG CORPORATION,
MCP,
SEIKO,
EPCOS,
MPS,
SST,
SPANSION,
SILICON,
RECOM,
MURATA PS,
WINBOND,
TE CONNECTIVITY ,
INNOLUX,
BB/TI,
EVERLIGHT,
IC,
BCD,
CREE,
MIC,
CIRRUS,
DIODES,
AT,
QFN,
AOS,
NXP/PHI,
EPSON,
STACKPOLE TECHNOLOGY, INC.,
JST,
REALTEK,
MXIC,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
ATMEL,
FSC,
MICROCHIP,
ON,
TOS,
INTEL,
XILINX,
INFINEON,
CY,
VISHAY,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
FREESCALE,
LINEAR,
MOT,
SEMIKRON,
LATTICE,
AMD,
PHI,
NEC,
IXYS,
BROADCOM,
ALLEGRO,
ROHM,
RENESAS,
AVAGO,
COILCRAFT,
DALLAS,
SHARP,
NVIDIA,
YAGEO,
FUJI,
HIT,
模块,
MIT,
SANYO,
HARVATEK,
ISSI,
KEMET,
INTERSIL,
MOLEX,
SUMIDA,
ATI,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
POWER,
TDK,
BB,
ISD/NUVOTON,
VICOR,
EUPEC,
IDT,
BOURNS,
FUJITSU,
LITTELFUSE,
SONY,
TRACO,
KOA KAOHSIUNG CORPORATION,
MCP,
SEIKO,
EPCOS,
MPS,
SST,
SPANSION,
SILICON,
RECOM,
MURATA PS,
WINBOND,
TE CONNECTIVITY ,
INNOLUX,
BB/TI,
EVERLIGHT,
IC,
BCD,
CREE,
MIC,
CIRRUS,
DIODES,
AT,
QFN,
AOS,
NXP/PHI,
EPSON,
STACKPOLE TECHNOLOGY, INC.,
JST,
REALTEK,
MXIC,
TI,
AD,
ST,
MAX,
NS,
NXP,
FSC,
MICROCHIP,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
INFINEON,
CY,
INTEL,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
IR,
FREESCALE,
LINEAR,
MOT,
NEC,
SEMIKRON,
LATTICE,
AMD,
ALLEGRO,
PHI,
BROADCOM,
HIT,
ROHM,
RENESAS,
AVAGO,
DALLAS,
SHARP,
YAGEO,
FUJI,
IXYS,
SUMIDA,
模块,
MIT,
HARVATEK,
SANYO,
KEMET,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
BB,
ISD/NUVOTON,
TDK,
NVIDIA,
VICOR,
INTERSIL,
EUPEC,
COILCRAFT,
BOURNS,
FUJITSU,
LITTELFUSE,
SONY,
TRACO,
MCP,
SEIKO,
IDT,
POWER,
EPCOS,
ATI,
ISSI,
MPS,
SILICON,
RECOM,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
WINBOND,
INNOLUX,
BB/TI,
EVERLIGHT,
IC,
SST,
CREE,
BCD,
MIC,
DIODES,
CIRRUS,
AT,
QFN,
AOS,
EPSON,
JST,
AUO,
HYNIX,
TI ,
JAE,
WCH,
TI,
AD,
ST,
MAX,
NS,
NXP,
FSC,
MICROCHIP,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
INFINEON,
CY,
INTEL,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
IR,
FREESCALE,
MOT,
LINEAR,
NEC,
SEMIKRON,
LATTICE,
AMD,
ALLEGRO,
PHI,
BROADCOM,
HIT,
ROHM,
RENESAS,
AVAGO,
DALLAS,
RECOM,
SHARP,
YAGEO,
FUJI,
IXYS,
SUMIDA,
模块,
MIT,
HARVATEK,
SANYO,
KEMET,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
BB,
ISD/NUVOTON,
TDK,
NVIDIA,
TRACO,
VICOR,
INTERSIL,
EUPEC,
COILCRAFT,
BOURNS,
FUJITSU,
LITTELFUSE,
SONY,
MCP,
SEIKO,
IDT,
POWER,
EPCOS,
ATI,
ISSI,
MPS,
SILICON,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
WINBOND,
INNOLUX,
BB/TI,
EVERLIGHT,
IC,
SST,
CREE,
BCD,
MIC,
DIODES,
CIRRUS,
AT,
QFN,
AOS,
EPSON,
JST,
AUO,
HYNIX,
TI ,
JAE,
WCH,
TI,
AD,
ST,
MAX,
NS,
NXP,
MICROCHIP,
FSC,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
CY,
INTEL,
INFINEON,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
FREESCALE,
IR,
LINEAR,
MOT,
LATTICE,
NEC,
AMD,
ALLEGRO,
PHI,
SEMIKRON,
HIT,
BROADCOM,
ROHM,
RENESAS,
DALLAS,
RECOM,
AVAGO,
SHARP,
YAGEO,
IXYS,
FUJI,
SUMIDA,
模块,
HARVATEK,
KEMET,
MIT,
SANYO,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
BB,
ISD/NUVOTON,
TDK,
NVIDIA,
TRACO,
VICOR,
COILCRAFT,
INTERSIL,
BOURNS,
LITTELFUSE,
SONY,
MCP,
EUPEC,
SEIKO,
POWER,
FUJITSU,
IDT,
ATI,
ISSI,
MPS,
EPCOS,
SILICON,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
INNOLUX,
BB/TI,
WINBOND,
IC,
CREE,
SST,
BCD,
DIODES,
EVERLIGHT,
AT,
QFN,
MIC,
AOS,
CIRRUS,
EPSON,
JST,
AUO,
TI ,
JAE,
WCH,
HYNIX,
TI,
AD,
ST,
MAX,
NS,
NXP,
MICROCHIP,
FSC,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
CY,
INTEL,
INFINEON,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
FREESCALE,
IR,
LINEAR,
MOT,
LATTICE,
NEC,
AMD,
ALLEGRO,
PHI,
SEMIKRON,
HIT,
BROADCOM,
ROHM,
RENESAS,
DALLAS,
RECOM,
AVAGO,
SHARP,
YAGEO,
IXYS,
FUJI,
SUMIDA,
模块,
HARVATEK,
KEMET,
MIT,
SANYO,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
BB,
ISD/NUVOTON,
TDK,
NVIDIA,
TRACO,
VICOR,
COILCRAFT,
INTERSIL,
BOURNS,
LITTELFUSE,
SONY,
MCP,
EUPEC,
SEIKO,
POWER,
FUJITSU,
IDT,
ATI,
ISSI,
MPS,
EPCOS,
SILICON,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
INNOLUX,
BB/TI,
WINBOND,
IC,
CREE,
SST,
BCD,
DIODES,
EVERLIGHT,
AT,
QFN,
MIC,
AOS,
CIRRUS,
EPSON,
JST,
AUO,
TI ,
JAE,
WCH,
HYNIX,
TI,
AD,
ST,
MAX,
NS,
NXP,
MICROCHIP,
FSC,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
CY,
INTEL,
INFINEON,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
FREESCALE,
IR,
LINEAR,
MOT,
LATTICE,
NEC,
AMD,
ALLEGRO,
PHI,
SEMIKRON,
HIT,
BROADCOM,
ROHM,
RENESAS,
DALLAS,
RECOM,
AVAGO,
SHARP,
YAGEO,
IXYS,
FUJI,
SUMIDA,
模块,
HARVATEK,
KEMET,
MIT,
SANYO,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
BB,
ISD/NUVOTON,
TDK,
NVIDIA,
TRACO,
VICOR,
COILCRAFT,
INTERSIL,
BOURNS,
LITTELFUSE,
SONY,
MCP,
EUPEC,
SEIKO,
POWER,
FUJITSU,
IDT,
ATI,
MPS,
EPCOS,
SILICON,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
INNOLUX,
BB/TI,
IC,
CREE,
SST,
DIODES,
EVERLIGHT,
AT,
QFN,
MIC,
AOS,
CIRRUS,
EPSON,
ISSI,
WINBOND,
JST,
AUO,
TI ,
JAE,
WCH,
HYNIX,
BOSCH,
EXAR(SIPEX),
TI,
AD,
ST,
MAX,
NS,
NXP,
MICROCHIP,
FSC,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
CY,
INTEL,
INFINEON,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
FREESCALE,
IR,
LINEAR,
MOT,
LATTICE,
NEC,
AMD,
PHI,
SEMIKRON,
HIT,
BROADCOM,
ROHM,
RENESAS,
RECOM,
AVAGO,
DALLAS,
SHARP,
YAGEO,
IXYS,
FUJI,
SUMIDA,
模块,
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Product Summary
SN74LVC245APW
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: SN74LVC245APW.


Available from: S&L Technology Development Co. ,Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:MAX3243, MAX604CSA, MAX8743EEI, MB90F548G, MCC122-16io8B, MRF240A, MRF5175, MRF894, MT29F64G08CFABA, PCR-SIN15V48F00, PIC12F675-I/SN, RT9372-MGPQW, SESD0201C-006-058, SI1304BDL-T1-E3, SKKT162/12E, SN74LVC1G132DCKR

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: SN74LVC245APW":

Post DatePart NumberBrandD/CDescQtyCompany
Mon Apr 8 07:22:00 UTC 2013SN74LVC245APWR (from standard server 2)8000S&L Technology Development Co. ,Limited
Mon Apr 8 07:22:00 UTC 2013SN74LVC245APWR (from parts server 2)8000S&L Technology Development Co. ,Limited
Mon Apr 8 07:22:00 UTC 2013SN74LVC245APWR (from hkin.com 2)8000S&L Technology Development Co. ,Limited
Mon Apr 8 07:22:00 UTC 2013SN74LVC245APWR (from hkin.com 2)8000S&L Technology Development Co. ,Limited

Last record SN74LVC1G132DCKR:

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Last record SKKT162/12E:

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Last record SI1304BDL-T1-E3:

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vid:offerengine20130509 Part Number Prefix

SN74LVC245APW,SN74LVC245APW,Comments from user about SN74LVC245APW: hn, which are optimized for distribution of HD content between CE devices in a home. Semiconductor conductivity can be controlled by introduction of an electric or magnetic field, by exposure to light or heat, or by mechanical deformation of a doped monocrystalline grid; thus, semiconductors can make excellent sensors. Cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time.Solid-state electronics are those circuits or devices built entirely from solid materials and in which the electrons, or other charge carriers, are confined entirely within the solid material. Consumer electronics are electronic equipment intended for everyday use, most often in entertainment, communications and office productivity. The pipeline includes several different stages which are fundamental in microarchitecture designs. It is an example of sequential digital logic, as it has internal memory. Used without qualifier, the term passive is ambiguous. Anything related to :SN74LVC245APW, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: SN74LVC245APW, search hkinventory: SN74LVC245APW, Each operation of the ALU sets one or more flags in a status register, which indicate the results of the last operation (zero value, negative number, overflow. or others). The key advantage of VHDL, when used for systems design, is that it allows the behavior of the required system to be described (modeled) and verified (simulated) before synthesis tools translate the design into real hardware (gates and wires). A passive component, depending on field, may be either a component that consumes (but does not produce) energy (thermodynamic passivity), or a component that is incapable of power gain (incremental passivity). These diagrams generally separate the datapath (where data is placed) and the control path (which can be said to steer the data). Datasheet Dir, DataSheet Archive
The transistor's low cost, flexibility, and reliability have made it a ubiquitous device. Single-chip processors increase reliability as there were many fewer electrical connections to fail. Bipolar junction transistors are formed from two p-n junctions, in either n-p-n or p-n-p configuration. The forms of practical capacitors vary widely, but all contain at least two conductors separated by a non-conductor. One disadvantage of the thyristor for switching circuits is that once it is 'latched-on' in the conducting state it cannot be turned off by external control. The MOSFET is particularly suited to this configuration because its positive thermal coefficient of resistance tends to balance current between individual devices. The gate electrode is charged to produce an electric field that controls the conductivity of a "channel" between two terminals, called the source and drain. The choice of the number of execution units, their latency and throughput is a central microarchitectural design task.
any passive component and active component such as:1N4148, or 6502 Branch prediction is where the hardware makes educated guesses on whether a particular branch will be taken. Advancing technology makes more complex and powerful chips feasible to manufacture. Band-pass filters ?attenuation of frequencies both above and below those they allow to pass. The key advantage of VHDL, when used for systems design, is that it allows the behavior of the required system to be described (modeled) and verified (simulated) before synthesis tools translate the design into real hardware (gates and wires). For example driver circuit
SN74LVC245APW,SN74LVC245APW,Comments from user about SN74LVC245APW: The pipelined datapath is the most commonly used datapath design in microarchitecture today. Later products include personal computers, telephones, MP3 players, audio equipment, televisions, calculators, GPS automotive electronics, digital cameras and players and recorders using video media such as DVDs, VCRs or camcorders. While this required extra logic to handle, for example, carry and overflow within each slice, the result was a system that could handle, say, 32-bit words using integrated circuits with a capacity for only 4 bits each. VHDL has constructs to handle the parallelism inherent in hardware designs, but these constructs (processes) differ in syntax from the parallel constructs in Ada (tasks). The design of pipelines is one of the central microarchitectural tasks. For example, an engine control system in an automobile can adjust ignition timing based on engine speed, load on the engine, ambient temperature, and any observed tendency for knocking - allowing an automobile to operate on a range of fuel grades. With this structure, one of the connections of the device is located on the bottom of the semiconductor die. A minimal hypothetical microprocessor might only include an arithmetic logic unit (ALU) and a control logic section. Anything related to :SN74LVC245APW, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: SN74LVC245APWSee also: