Part: BUW11AP

Index Files

Offer Index 57

MOLEX,
FUJITSU,
WINBOND,
REALTEK,
COSEL,
COILCRAFT,
MURATA PS,
BSI,
EPSON,
SST,
UTC,
LATTICE,
MITSUBI,
BCD,
SIPEX,
EUPEC,
VIA,
IMP,
KEC,
SPANSION,
IDT,
JRC,
LG,
BOSCH,
TRACOPOWE,
OSRAM,
RAMTRON,
DS,
LUCENT,
TI,
AD,
ST,
NS,
ON,
IR,
INFINEON,
XILINX,
MAX,
MURATA,
ATMEL,
TOS,
ALTERA,
CY,
NXP,
FSC,
INTEL,
VISHAY,
SAMSUNG,
ROHM,
MICROCHIP,
FREESCALE,
NEC,
POWER,
DALLAS,
PHI,
MOT,
LINEAR,
AMD,
RENESAS,
WINSTAR,
MIT,
MIC,
ALLEGRO,
KEMET,
ATI,
YAGEO,
PANASONIC,
MPS,
BROADCOM,
BB,
IXYS,
TDK,
MICRON,
BOURNS,
ISSI,
LAMBDA,
ERICSSON,
AVAGO,
HIT,
AGILENT,
VICOR,
SHARP,
PERICOM,
FUJI,
NIPPON CHEMI-CON,
INTERSIL,
AVX,
FUJITSU,
HYNIX,
MICREL,
SKYWORKS,
SIEMENS,
SANYO,
LITTELFUSE,
NUVOTON,
SK,
NVIDIA,
NICHICON,
COOPER,
EPCOS,
COILCRAFT,
MURATAPS,
SILICON,
MOLEX,
WINBOND,
REALTEK,
COSEL,
EPSON,
MURATA PS,
BSI,
SST,
UTC,
LATTICE,
MITSUBI,
BCD,
SIPEX,
EUPEC,
KEC,
VIA,
IMP,
JRC,
SPANSION,
IDT,
LG,
BOSCH,
LUCENT,
TRACOPOWE,
OSRAM,
RAMTRON,
TI,
AD,
ST,
NS,
ON,
IR,
INFINEON,
XILINX,
MAX,
MURATA,
ATMEL,
TOS,
ALTERA,
CY,
NXP,
FSC,
INTEL,
VISHAY,
SAMSUNG,
ROHM,
MICROCHIP,
NEC,
FREESCALE,
DALLAS,
POWER,
PHI,
MOT,
ALLEGRO,
LINEAR,
AMD,
RENESAS,
MIT,
WINSTAR,
MIC,
KEMET,
ATI,
YAGEO,
PANASONIC,
MPS,
BROADCOM,
BB,
TDK,
IXYS,
MICRON,
VICOR,
ISSI,
BOURNS,
FUJI,
LAMBDA,
ERICSSON,
AVAGO,
PERICOM,
HIT,
AGILENT,
SHARP,
INTERSIL,
NIPPON CHEMI-CON,
AVX,
FUJITSU,
HYNIX,
MICREL,
SKYWORKS,
SIEMENS,
SANYO,
LITTELFUSE,
NUVOTON,
SK,
NVIDIA,
NICHICON,
EPCOS,
WINBOND,
COOPER,
SILICON,
COILCRAFT,
MURATAPS,
REALTEK,
MOLEX,
COSEL,
EPSON,
SST,
BSI,
MURATA PS,
UTC,
LATTICE,
MITSUBI,
SIPEX,
BCD,
EUPEC,
KEC,
VIA,
JRC,
SPANSION,
LG,
IMP,
IDT,
ZARLINK,
BOSCH,
LUCENT,
TRACOPOWE,
OSRAM,
TI,
AD,
ST,
NS,
ON,
IR,
INFINEON,
XILINX,
MAX,
MURATA,
ATMEL,
TOS,
ALTERA,
CY,
NXP,
FSC,
INTEL,
VISHAY,
SAMSUNG,
ROHM,
MICROCHIP,
NEC,
DALLAS,
FREESCALE,
PHI,
POWER,
MOT,
ALLEGRO,
LINEAR,
AMD,
RENESAS,
MIT,
WINSTAR,
MIC,
KEMET,
ATI,
YAGEO,
PANASONIC,
MPS,
BROADCOM,
BB,
TDK,
IXYS,
MICRON,
VICOR,
ISSI,
BOURNS,
FUJI,
LAMBDA,
ERICSSON,
AVAGO,
PERICOM,
HIT,
AGILENT,
SHARP,
INTERSIL,
NIPPON CHEMI-CON,
AVX,
FUJITSU,
HYNIX,
MICREL,
SKYWORKS,
SIEMENS,
SANYO,
LITTELFUSE,
NUVOTON,
SK,
NVIDIA,
NICHICON,
EPCOS,
WINBOND,
COOPER,
SILICON,
COILCRAFT,
MURATAPS,
REALTEK,
MOLEX,
COSEL,
EPSON,
SST,
BSI,
KEC,
MURATA PS,
UTC,
LATTICE,
MITSUBI,
SIPEX,
BCD,
EUPEC,
VIA,
JRC,
SPANSION,
IMP,
LG,
IDT,
ZARLINK,
BOSCH,
LUCENT,
TRACOPOWE,
OSRAM,
TI,
AD,
ST,
NS,
ON,
IR,
INFINEON,
XILINX,
MAX,
MURATA,
ATMEL,
TOS,
ALTERA,
CY,
NXP,
FSC,
INTEL,
VISHAY,
SAMSUNG,
ROHM,
MICROCHIP,
NEC,
DALLAS,
FREESCALE,
PHI,
POWER,
MOT,
ALLEGRO,
LINEAR,
AMD,
RENESAS,
MIT,
WINSTAR,
MIC,
KEMET,
ATI,
YAGEO,
PANASONIC,
MPS,
BROADCOM,
BB,
TDK,
IXYS,
MICRON,
VICOR,
ISSI,
BOURNS,
FUJI,
LAMBDA,
ERICSSON,
AVAGO

 
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Product Summary
PH  BUW11AP
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: BUW11AP.


Available from: Tongyou (HK) Electronics Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:TDUHC122-0F0C-01, TDA7056, TDA8143, TDA9381PS/N3/2/1831, BB837, 74HC393, S-80820CLNB-B6F-T2, TPSC227K006R0125, CD4051BPWR, T72956EL, MC33164, A4986SLPT, K9F1G08UOC, BXA10-48S05, MC33375ST-2.5T3G, XPC860ENZP50D4

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: BUW11AP":

Post DatePart NumberBrandD/CDescQtyCompany
Wed Feb 1 06:02:00 UTC 2012BUW11AP (from hkin.com)PH 04+7749Tongyou (HK) Electronics Limited
Wed Feb 1 06:02:00 UTC 2012BUW11AP (from standard server 2)PH 04+7749Tongyou (HK) Electronics Limited
Wed Feb 1 06:02:00 UTC 2012BUW11AP (from parts server 2)PH 04+7749Tongyou (HK) Electronics Limited
Wed Feb 1 06:02:00 UTC 2012BUW11AP (from hkin.com 2)PH 04+7749Tongyou (HK) Electronics Limited
Wed Feb 1 06:02:00 UTC 2012BUW11AP (from hkin.com 2)PH 04+7749Tongyou (HK) Electronics Limited

Last record XPC860ENZP50D4:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Feb 28 11:45:00 UTC 2012XPC860ENZP50D4 (from hkin.com)FREESCALE08+BGA500Shenzhen Chuangxinda Electronic-Tech Co.,Ltd

Last record MC33375ST-2.5T3G:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Feb 29 01:32:00 UTC 2012MC33375ST-2.5T3G (from hkin.com)ON2010+SOT-223250000Atom (Hong Kong) Electronics Co., Limited

Last record BXA10-48S05:

Post DatePart NumberBrandD/CDescQtyCompany
Thu Mar 1 02:20:00 UTC 2012BXA10-48S05-SI (from hkin.com)ARTESYNN/ADC/DC: 48V-5V-10W794Howake Electronics H.K Co.,Ltd

If you want to find more about BUW11AP, please visit us on HKin


vid:offerengine20120303 Part Number Prefix

BUW11AP,BUW11AP,Comments from user about BUW11AP: Used without qualifier, the term passive is ambiguous. As it is a physical limit, no improvement is expected from silicon MOSFETs concerning their maximum voltage ratings.0 to the IEEE for balloting for inclusion in IEEE 1076-2008. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements. VHDL has file input and output capabilities, and can be used as a general-purpose language for text processing, but files are more commonly used by a simulation testbench for stimulus or verification data. A microprocessor is a general purpose system. The updated IEEE 1076, in 1993, made the syntax more consistent, allowed more flexibility in naming, extended the character type to allow ISO-8859-1 printable characters, added the xnor operator, etc. The forms of practical capacitors vary widely, but all contain at least two conductors separated by a non-conductor. Anything related to :BUW11AP, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: BUW11AP, search hkinventory: BUW11AP, A component that is not passive is called an active component. Normally, whether a conditional branch will be taken isn't known until late in the pipeline as conditional branches depend on results coming from a register. From the time that the processor's instruction decoder has figured out that it has encountered a conditional branch instruction to the time that the deciding register value can be read out, the pipeline needs to be stalled for several cycles, or if it's not and the branch is taken, the pipeline needs to be flushed. The MOSFET is particularly suited to this configuration because its positive thermal coefficient of resistance tends to balance current between individual devices. Datasheet Dir, DataSheet Archive
Noyce also came up with his own idea of an integrated circuit half a year later than Kilby. Alternatively, additional logic can be added to a simple transparent latch to make it non-transparent or opaque when another input (an "enable" input) is not asserted. In electronics, a common-emitter amplifier is one of three basic single-stage bipolar-junction-transistor (BJT) amplifier topologies, typically used as a voltage amplifier.[3] Some of these stages include instruction fetch, instruction decode, execute, and write back. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. This can yield better performance when the guess is good, with the risk of a huge penalty when the guess is bad because instructions need to be undone. This can yield better performance when the guess is good, with the risk of a huge penalty when the guess is bad because instructions need to be undone. The range of desired frequencies (the passband) together with the shape of the frequency response.
any passive component and active component such as:Diode,0 and includes enhanced generic types. Integrated circuits are used in virtually all electronic equipment today and have revolutionized the world of electronics. Compared to the MOSFET, the operating frequency of the IGBT is relatively low (few devices are rated over 50 kHz), mainly because of a so-called 'current-tail' problem during turn-off. The junctions which form where n-type and p-type semiconductors join together are called p-n junctions. For example driver circuit
BUW11AP,BUW11AP,Comments from user about BUW11AP: The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer. As of 2009, dual-core and quad-core processors are widely used in servers, workstations and PCs while six and eight-core processors will be available for high-end applications in both the home and professional environments. VHDL project is multipurpose. It is a multipurpose, programmable device that accepts digital data as input, processes it according to instructions stored in its memory, and provides results as output. Current conduction in a semiconductor occurs via mobile or "free" electrons and holes, collectively known as charge carriers. Passivity, in most cases, can be used to demonstrate that passive circuits will be stable under specific criteria. In response, microprocessor manufacturers look for other ways to improve performance in order to hold on to the momentum of constant upgrades in the market. An example is the comparator which takes in a continuous range of voltage but only outputs one of two levels as in a digital circuit. Anything related to :BUW11AP, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: BUW11APSee also: