Part: EP10K50EFC256-3

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ALTERA EP10K50EFC256-3
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: EP10K50EFC256-3.


Available from: Jieshunda Electronics International Co.,Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:DTA114YKAT146, DTC323TKT146, DV-28E, E5800, ECQV1H103JL, ECQV1H684JL, ECRKN003A61X, EGXE800ELL470MJC5S, EKLJ201ELL820MK25S, EKME351ELL1R0MJC5S, EKME351ELL470MLP1S, EKMF100ELL222MK20S, El5174ISZ, ELJRF18NJF, EM639165TS-6G, EP10K100EFI256-2

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: EP10K50EFC256-3":

Post DatePart NumberBrandD/CDescQtyCompany
Tue Oct 11 02:22:00 UTC 2011EP10K50EFC256-3 (from hkin.com)ALTERA08+BGA101Jieshunda Electronics International Co.,Limited
Tue Oct 11 02:22:00 UTC 2011EP10K50EFC256-3 (from standard server 2)ALTERA08+BGA101Jieshunda Electronics International Co.,Limited
Tue Oct 11 02:22:00 UTC 2011EP10K50EFC256-3 (from parts server 2)ALTERA08+BGA101Jieshunda Electronics International Co.,Limited
Tue Oct 11 02:22:00 UTC 2011EP10K50EFC256-3 (from hkin.com 2)ALTERA08+BGA101Jieshunda Electronics International Co.,Limited
Tue Oct 11 02:22:00 UTC 2011EP10K50EFC256-3 (from hkin.com 2)ALTERA08+BGA101Jieshunda Electronics International Co.,Limited

Last record EP10K100EFI256-2:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Oct 11 02:22:00 UTC 2011EP10K100EFI256-2 (from hkin.com)ALTERA08+BGA35Jieshunda Electronics International Co.,Limited

Last record EM639165TS-6G:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Nov 4 02:43:00 UTC 2011EM639165TS-6G (from hkin.com)ETRON2009+TSOP1069TRK (HK) Electronics Limited
Thu Nov 10 02:30:00 UTC 2011EM639165TS-6G (from hkin.com)MAXIM2009+ORIGINAL1069Glory Venture Chips Company

Last record ELJRF18NJF:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Nov 7 03:39:00 UTC 2011ELJRF18NJF (from hkin.com)Pasanonic07+20000Huiyuan Electronic (Asia) Limited

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EP10K50EFC256-3,EP10K50EFC256-3,Comments from user about EP10K50EFC256-3: Many products include Internet connectivity using technologies such as Wi-Fi, Bluetooth or Ethernet. This collection of simulation models is commonly called a testbench. In June 2006, the VHDL Technical Committee of Accellera (delegated by IEEE to work on the next update of the standard) approved so called Draft 3. Because the cores are physically very close to each other, they can communicate with each other much faster than separate processors in a multiprocessor system, which improves overall system performance. The logic section retrieves instruction operation codes from memory, and iniates whatever sequence of operations of the ALU required to carry out the instruction.6 defines a subset of the language that is considered the official synthesis subset. While 64-bit microprocessor designs have been in use in several markets since the early 1990s, the early 2000s saw the introduction of 64-bit microprocessors targeted at the PC market. Style, price, specification and performance are all relevant. Anything related to :EP10K50EFC256-3, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: EP10K50EFC256-3, search hkinventory: EP10K50EFC256-3, In 1986, HP released its first system with a PA-RISC CPU. Produced at Fairchild Semiconductor, it was made of silicon, whereas Kilby's chip was made of germanium. A small current injected through the junction between the base and the emitter changes the properties of the base-collector junction so that it can conduct current even though it is reverse biased. The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to precisely control the location and concentration of p- and n-type dopants. Datasheet Dir, DataSheet Archive
The vast majority of the discrete (i.e non integrated) power devices are built using a vertical structure, whereas small-signal devices employ a lateral structure. Many products include Internet connectivity using technologies such as Wi-Fi, Bluetooth or Ethernet. It has already completely replaced the bipolar transistor in power applications, and the availability of power modules (in which several IGBT dice are connected in parallel) makes it attractive for power levels up to several megawatts, pushing further the limit where thyristors and GTOs become the only option. It was made of Germanium and had a voltage capability of 200 volts and a current rating of 35 amperes. This collection of simulation models is commonly called a testbench. Most of them should not be used in linear operation. the bandwidth around the notch before attenuation becomes small. In practice the dielectric between the plates passes a small amount of leakage current and also has an electric field strength limit, resulting in a breakdown voltage, while the conductors and leads introduce an undesired inductance and resistance.
any passive component and active component such as:Diode, In the mid-1980s to early-1990s, a crop of new high-performance Reduced Instruction Set Computer (RISC) microprocessors appeared, influenced by discrete RISC-like CPU designs such as the IBM 801 and others. Typically, analog designers use this term to refer to incrementally passive components and systems, while control systems engineers will use this to refer to thermodynamically passive ones.VHDL is frequently used for two different goals: simulation of electronic designs and synthesis of such designs. The other regions, and their associated terminals, are known as the emitter and the collector. For example driver circuit
EP10K50EFC256-3,EP10K50EFC256-3,Comments from user about EP10K50EFC256-3: The capacitance is greatest when there is a narrow separation between large areas of conductor, hence capacitor conductors are often called "plates," referring to an early means of construction. Cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time. They are commonly used in speaker crossover design (due to the moderately large voltages and currents, and the lack of easy access to power), filters in power distribution networks (due to the large voltages and currents), power supply bypassing (due to low cost, and in some cases, power requirements), as well as a variety of discrete and home brew circuits (for low-cost and simplicity). This can be seen in figure 2. VHDL also allows arrays to be indexed in either ascending or descending direction; both conventions are used in hardware, whereas in Ada and most programming languages only ascending indexing is available. In 1986, HP released its first system with a PA-RISC CPU. The MOSFET is particularly suited to this configuration because its positive thermal coefficient of resistance tends to balance current between individual devices. An integrated circuit or monolithic integrated circuit (also referred to as IC, chip, and microchip) is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material. Anything related to :EP10K50EFC256-3, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: EP10K50EFC256-3See also: