Part: MAX172BCWG

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Offer Index 54

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Product Summary
MAXIM MAX172BCWG
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: MAX172BCWG.


Available from: Yee Hing Electronic Trading Co.
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:SAB-C163-LF-CU, SAB-C165-LF3V, SAF-C151C-8EM, ATSAM3U4EA-AU, ELXV6R3ELL562MM20S, ELXY100ETD152MJ30S, ELXZ250ELL272MK40S, ERWE451LGC222MD96M, CED61A3 PB, CEM4416, 74AHC74D, PC957L0NSZ0F, RTL8100BLLF, IRFR3710Z, IRG4PC30F, IRG4PSC71K

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: MAX172BCWG":

Post DatePart NumberBrandD/CDescQtyCompany
Wed Nov 23 07:17:00 UTC 2011MAX172BCWG (from hkin.com)MAXIM5000Yee Hing Electronic Trading Co.
Wed Nov 23 07:17:00 UTC 2011MAX172BCWG (from standard server 2)MAXIM5000Yee Hing Electronic Trading Co.
Wed Nov 23 07:17:00 UTC 2011MAX172BCWG (from parts server 2)MAXIM5000Yee Hing Electronic Trading Co.
Wed Nov 23 07:17:00 UTC 2011MAX172BCWG (from hkin.com 2)MAXIM5000Yee Hing Electronic Trading Co.
Wed Nov 23 07:17:00 UTC 2011MAX172BCWG (from hkin.com 2)MAXIM5000Yee Hing Electronic Trading Co.

Last record IRG4PSC71K:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Dec 12 06:37:00 UTC 2011IRG4PSC71KD (from hkin.com)IR05+SUPER24710000Kingstar Electronics Technology Co., Limited
Mon Dec 12 06:37:00 UTC 2011IRG4PSC71K (from hkin.com)IR05+SUPER24710000Kingstar Electronics Technology Co., Limited

Last record IRG4PC30F:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Dec 12 06:37:00 UTC 2011IRG4PC30FD (from hkin.com)IR05+TO-24710000Kingstar Electronics Technology Co., Limited
Mon Dec 12 06:37:00 UTC 2011IRG4PC30F (from hkin.com)IR05+TO-24710000Kingstar Electronics Technology Co., Limited

Last record IRFR3710Z:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Dec 20 10:08:00 UTC 2011IRFR3710ZTRLPBF (from hkin.com)IR10+SOT-25210000Kingstar Electronics Technology Co., Limited
Tue Dec 20 10:08:00 UTC 2011IRFR3710Z (from hkin.com)IR07+SOT-25210000Kingstar Electronics Technology Co., Limited

If you want to find more about MAX172BCWG, please visit us on HKin


vid:offerengine20111223

MAX172BCWG,MAX172BCWG,Comments from user about MAX172BCWG: This is driven by gains in manufacturing efficiency and automation, lower labor costs as manufacturing has moved to lower-wage countries, and improvements in semiconductor design. The capacitance is greatest when there is a narrow separation between large areas of conductor, hence capacitor conductors are often called "plates," referring to an early means of construction. Synthesis is a process where a VHDL is compiled and mapped into an implementation technology such as an FPGA or an ASIC. A component that is not passive is called an active component. There are some VHDL compilers which build executable binaries. The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer. However, because of high switching losses, typical operating frequency up to 500 Hz. Typically this will be a vacuum tube, or solid-state (transistor or operational amplifier). Anything related to :MAX172BCWG, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: MAX172BCWG, search hkinventory: MAX172BCWG, One rarely finds modern circuits that are entirely analog. A light-emitting diode (LED) is a semiconductor light source.The second region, at reverse biases more positive than the PIV, has only a very small reverse saturation current. The trip solenoid that releases the latch is usually energized by a separate battery, although some high-voltage circuit breakers are self-contained with current transformers, protection relays, and an internal control power source. Datasheet Dir, DataSheet Archive
The vast majority of the discrete (i.e non integrated) power devices are built using a vertical structure, whereas small-signal devices employ a lateral structure. A simulation program is used to test the logic design using simulation models to represent the logic circuits that interface to the design. For notch filters, the degree to which unwanted signals at the notch frequency must be rejected determines the accuracy of the components, but not the Q, which is governed by desired steepness of the notch, i. A capacitor is a passive electronic component consisting of a pair of conductors separated by a dielectric (insulator). Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies, made possible by the low cost of production of integrated circuits. With the vertical structure, the current rating of the device is proportional to its area, and the voltage blocking capability is achieved in the height of the die. In addition, passive circuits will not necessarily be stable under all stability criteria. For each computer built, all of these had to be placed and soldered onto printed circuit boards, and often multiple boards would have to be interconnected in a chassis.
any passive component and active component such as:Diode, In case of large forward bias (current in the direction of the arrow), the diode exhibits a voltage drop due to its junction built-in voltage and internal resistance. The distance that signals had to travel between ICs on the boards limited the speed at which a computer could operate., followed soon after. Microprocessors make it possible to put a computer into thousands of items that were traditionally not computer-related. For example driver circuit
MAX172BCWG,MAX172BCWG,Comments from user about MAX172BCWG: Furthermore, much less material is used to construct a packaged IC die than to construct a discrete circuit. The move to 64 bits is more than just an increase in register size from the IA-32 as it also doubles the number of general-purpose registers. Semiconductor devices are electronic components that exploit the electronic properties of semiconductor materials, principally silicon, germanium, and gallium arsenide, as well as organic semiconductors. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. Execution units include arithmetic logic units (ALU), floating point units (FPU), load/store units, branch prediction, and SIMD. This may be done to limit the bandwidth to a narrow band centered around the intended operating frequency. High-end Intel Xeon processors that are on the LGA771 socket are DP (dual processor) capable, as well as the Intel Core 2 Extreme QX9775 also used in the Mac Pro by Apple and the Intel Skulltrail motherboard. With this structure, one of the connections of the device is located on the bottom of the semiconductor die. Anything related to :MAX172BCWG, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: MAX172BCWGSee also: