Part: XC3S400-5FG256C

Index Files

Offer Index 52

EPSON,
SIMCOM,
SIEMENS,
KEC,
AVX,
SPANSION,
BCD,
JRC,
LG,
VIA,
ISD/NUVOTON,
PERICOM,
SIPEX,
COSEL,
BOSCH,
SW,
DS,
TI,
ST,
NS,
AD,
MAX,
INFINEON,
ON,
XILINX,
ALTERA,
TOS,
ATMEL,
FSC,
NXP,
IR,
CY,
SAMSUNG,
MURATA,
MIC,
INTEL,
MICROCHIP,
FREESCALE,
NEC,
MOT,
DALLAS,
ROHM,
PHI,
POWER,
TDK,
VISHAY,
MICRON,
ALLEGRO,
LINEAR,
WINSTAR,
RENESAS,
AMD,
BROADCOM,
BB,
YAGEO,
MPS,
FUJI,
PANASONIC,
ISSI,
MIT,
HYNIX,
BOURNS,
ATI,
SANYO,
IXYS,
MICREL,
SHARP,
VICOR,
AVAGO,
AGILENT,
EUPEC,
HIT,
NIPPON CHEMI-CON,
INTERSIL,
QFN,
COOPER,
NAIS,
SKYWORKS,
SILICON,
LUCENT,
LAMBDA,
MOLEX,
NUVOTON,
SK,
NICHICON,
LITTELFUSE,
FUJITSU,
MURATAPS,
NVIDIA,
WINBOND,
JST,
SST,
REALTEK,
EPCOS,
IDT,
OSRAM,
COILCRAFT,
IMP,
LATTICE,
EPSON,
MURATA PS,
SIMCOM,
ISD/NUVOTON,
SIEMENS,
AVX,
KEC,
SPANSION,
JRC,
BCD,
LG,
VIA,
SIPEX,
PERICOM,
COSEL,
BOSCH,
SW,
DS,
TI,
ST,
NS,
AD,
MAX,
INFINEON,
ON,
XILINX,
ALTERA,
TOS,
ATMEL,
FSC,
NXP,
IR,
CY,
SAMSUNG,
MURATA,
MIC,
INTEL,
MICROCHIP,
FREESCALE,
NEC,
MOT,
DALLAS,
PHI,
ROHM,
POWER,
TDK,
VISHAY,
MICRON,
ALLEGRO,
LINEAR,
WINSTAR,
RENESAS,
AMD,
BROADCOM,
BB,
YAGEO,
MPS,
FUJI,
PANASONIC,
ISSI,
MIT,
HYNIX,
BOURNS,
SANYO,
ATI,
IXYS,
MICREL,
AVAGO,
SHARP,
VICOR,
AGILENT,
EUPEC,
HIT,
INTERSIL,
NIPPON CHEMI-CON,
QFN,
COOPER,
NAIS,
SKYWORKS,
SILICON,
LUCENT,
LAMBDA,
MOLEX,
NUVOTON,
SK,
NICHICON,
LITTELFUSE,
FUJITSU,
MURATAPS,
NVIDIA,
WINBOND,
JST,
SST,
REALTEK,
EPCOS,
IDT,
OSRAM,
COILCRAFT,
IMP,
LATTICE,
EPSON,
MURATA PS,
SIMCOM,
ISD/NUVOTON,
SIEMENS,
AVX,
KEC,
SPANSION,
JRC,
BCD,
LG,
VIA,
SIPEX,
PERICOM,
COSEL,
BOSCH,
SW,
DS,
TI,
ST,
NS,
AD,
MAX,
INFINEON,
ON,
XILINX,
ALTERA,
TOS,
ATMEL,
FSC,
NXP,
IR,
CY,
SAMSUNG,
MURATA,
MIC,
INTEL,
MICROCHIP,
FREESCALE,
NEC,
MOT,
DALLAS,
PHI,
ROHM,
POWER,
TDK,
VISHAY,
MICRON,
ALLEGRO,
LINEAR,
WINSTAR,
RENESAS,
AMD,
BROADCOM,
BB,
YAGEO,
MPS,
FUJI,
PANASONIC,
ISSI,
MIT,
HYNIX,
BOURNS,
SANYO,
ATI,
IXYS,
MICREL,
AVAGO,
SHARP,
VICOR,
AGILENT,
EUPEC,
HIT,
INTERSIL,
NIPPON CHEMI-CON,
QFN,
COOPER,
NAIS,
SKYWORKS,
SILICON,
LUCENT,
LAMBDA,
MOLEX,
NUVOTON,
SK,
NICHICON,
LITTELFUSE,
FUJITSU,
MURATAPS,
NVIDIA,
WINBOND,
JST,
SST,
REALTEK,
EPCOS,
IDT,
OSRAM,
COILCRAFT,
IMP,
LATTICE,
EPSON,
MURATA PS,
SIMCOM,
ISD/NUVOTON,
SIEMENS,
AVX,
KEC,
SPANSION,
JRC,
BCD,
LG,
VIA,
SIPEX,
PERICOM,
COSEL,
BOSCH,
SW,
DS,
TI,
ST,
NS,
AD,
MAX,
INFINEON,
ON,
XILINX,
ALTERA,
TOS,
ATMEL,
FSC,
NXP,
IR,
CY,
SAMSUNG,
MURATA,
MIC,
INTEL,
MICROCHIP,
FREESCALE,
NEC,
MOT,
DALLAS,
PHI,
ROHM,
POWER,
TDK,
VISHAY,
MICRON,
ALLEGRO,
LINEAR,
WINSTAR,
RENESAS,
AMD,
BROADCOM,
BB,
YAGEO,
MPS,
FUJI,
PANASONIC,
ISSI,
MIT,
HYNIX,
BOURNS,
SANYO,
ATI,
IXYS,
MICREL,
AVAGO,
SHARP,
VICOR,
AGILENT,
EUPEC,
HIT,
INTERSIL,
NIPPON CHEMI-CON,
QFN,
COOPER,
NAIS,
SKYWORKS,
SILICON,
LUCENT,
LAMBDA,
MOLEX,
NUVOTON,
SK,
NICHICON,
LITTELFUSE,
FUJITSU,
MURATAPS,
NVIDIA,
WINBOND,
JST,
SST,
REALTEK,
EPCOS,
IDT,
OSRAM,
COILCRAFT,
IMP,
LATTICE,
EPSON

 
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Product Summary
XILINX XC3S400-5FG256C
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: XC3S400-5FG256C.


Available from: Shenzhen Chuangxinda Electronic-Tech Co.,Ltd
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:ISD17210SYI, DSEI2X30-10B, AP1703DWL, LQW15AN5N6C10D, CAT24WC64J-TE13, MSP430F1232, 27213MTD, XC9572-10PC44C, 16R1A80, VP40506A2, NDS352P/APSOT23, AD694AR, BQ24023DRCR, LNK408EG, B9329, CAT809TTBI-GT3

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: XC3S400-5FG256C":

Post DatePart NumberBrandD/CDescQtyCompany
Fri Mar 23 08:02:00 UTC 2012XC3S400-5FG256C (from standard server 2)XILINX05+BGA456332Shenzhen Chuangxinda Electronic-Tech Co.,Ltd
Fri Mar 23 08:02:00 UTC 2012XC3S400-5FG256C (from parts server 2)XILINX05+BGA456332Shenzhen Chuangxinda Electronic-Tech Co.,Ltd
Fri Mar 23 08:02:00 UTC 2012XC3S400-5FG256C (from hkin.com 2)XILINX05+BGA456332Shenzhen Chuangxinda Electronic-Tech Co.,Ltd
Fri Mar 23 08:02:00 UTC 2012XC3S400-5FG256C (from hkin.com 2)XILINX05+BGA456332Shenzhen Chuangxinda Electronic-Tech Co.,Ltd

Last record CAT809TTBI-GT3:

Post DatePart NumberBrandD/CDescQtyCompany

Last record B9329:

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Last record LNK408EG:

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vid:offerengine20120325 Part Number Prefix

XC3S400-5FG256C,XC3S400-5FG256C,Comments from user about XC3S400-5FG256C: Occasionally the physical limitations of integrated circuits made such practices as a bit slice approach necessary. This effect is called electroluminescence and the color of the light (corresponding to the energy of the photon) is determined by the energy gap of the semiconductor. Introduced as a practical electronic component in 1962, early LEDs emitted low-intensity red light, but modern versions are available across the visible, ultraviolet and infrared wavelengths, with very high brightness. A minimal hypothetical microprocessor might only include an arithmetic logic unit (ALU) and a control logic section. Execution units are also essential to microarchitecture. The pipeline includes several different stages which are fundamental in microarchitecture designs. VHDL is commonly used to write text models that describe a logic circuit. This effectively multiplies the processor's potential performance by the number of cores (as long as the operating system and software is designed to take advantage of more than one processor core). Anything related to :XC3S400-5FG256C, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: XC3S400-5FG256C, search hkinventory: XC3S400-5FG256C, Most of them should not be used in linear operation. Microprocessors operate on numbers and symbols represented in the binary numeral system. The first bipolar transistors devices with substantial power handling capabilities were introduced in the 1960s. From the time that the processor's instruction decoder has figured out that it has encountered a conditional branch instruction to the time that the deciding register value can be read out, the pipeline needs to be stalled for several cycles, or if it's not and the branch is taken, the pipeline needs to be flushed. Datasheet Dir, DataSheet Archive
Some components, such as bus interface and second level cache, may be shared between cores. When there is a potential difference (voltage) across the conductors, a static electric field develops across the dielectric, causing positive charge to collect on one plate and negative charge on the other plate. Although the MOSFET is named in part for its "metal" gate, in modern devices polysilicon is typically used instead. For instance, a resonant series LC circuit will have unbounded voltage output for a bounded voltage input, but will be stable in the sense of Lyapunov, and given bounded energy input will have bounded energy output.6 defines a subset of the language that is considered the official synthesis subset. Heat generated by electronic circuitry must be dissipated to prevent immediate failure and improve long term reliability. This can be seen in figure 2. This indicates the variety of filter (see above) and the center or corner frequencies.
any passive component and active component such as:Diode, On average, every fifth instruction executed is a branch, so without any intervention, that's a high amount of stalling. Compared to the MOSFET, the operating frequency of the IGBT is relatively low (few devices are rated over 50 kHz), mainly because of a so-called 'current-tail' problem during turn-off. The number of different analog circuits so far devised is huge, especially because a 'circuit' can be defined as anything from a single component, to systems containing thousands of components.1 (known as VHDL-AMS) provided analog and mixed-signal circuit design extensions. For example driver circuit
XC3S400-5FG256C,XC3S400-5FG256C,Comments from user about XC3S400-5FG256C: Once a fault is detected, contacts within the circuit breaker must open to interrupt the circuit; some mechanically-stored energy (using something such as springs or compressed air) contained within the breaker is used to separate the contacts, although some of the energy required may be obtained from the fault current itself. Each logic gate is in turn represented by a circuit diagram describing the connections of the transistors used to implement it in some particular logic family. It has already completely replaced the bipolar transistor in power applications, and the availability of power modules (in which several IGBT dice are connected in parallel) makes it attractive for power levels up to several megawatts, pushing further the limit where thyristors and GTOs become the only option. Another type of transistor, the field effect transistor operates on the principle that semiconductor conductivity can be increased or decreased by the presence of an electric field. IEEE standard 1076. Graphics processing units may have no, limited, or general programming facilities. Different features can be implemented in different models of a product line at negligible production cost. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using electronic components. Anything related to :XC3S400-5FG256C, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: XC3S400-5FG256CSee also: