Part: ISPGDX160VA-3B208-5I

Index Files

Offer Index 51

EPSON,
MICRON,
COOPER,
EUPEC,
NUVOTON,
LITTELFUSE,
EPCOS,
SILICON,
MURATAPS,
COILCRAFT,
HYNIX,
AVX,
ISD/NUVOTON,
MURATA PS,
SEMIKRON,
BROADCOM,
WINBOND,
COSEL,
SST,
OSRAM,
LATTICE,
BSI,
LG,
KEC,
BCD,
LUCENT,
IDT,
JST,
SIPEX,
LGD,
TRACOPOWE,
KEMET,
FUJITSU,
HIROSE,
NA,
NUMONYX,
SPANSION,
AUO,
FMD,
NATIONAL

 
Google Search

Product Summary
LATTICE ISPGDX160VA-3B208-5I
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: ISPGDX160VA-3B208-5I.


Available from: CYX Technology Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:IMP705EPA, IMP706CSA, IP175A-LF, IRF7726TR, IRF7842TRPBF, IRF8010, IRFH7932TRPBF, IRFU220NPBF, IRG4BH20K-LPBF, IRKL162-16, IRLML0030TRPBF, IS61WV102416BLL-10T, ISD1750SY, ISD2560G, IR21362S, ISP1504ABS

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: ISPGDX160VA-3B208-5I":

Post DatePart NumberBrandD/CDescQtyCompany
Sat Jan 14 07:47:00 UTC 2012ISPGDX160VA-3B208-5I (from hkin.com)LATTICE09+new&original215CYX Technology Limited
Sat Jan 14 07:47:00 UTC 2012ISPGDX160VA-3B208-5I (from standard server 2)LATTICE09+new&original215CYX Technology Limited
Sat Jan 14 07:47:00 UTC 2012ISPGDX160VA-3B208-5I (from parts server 2)LATTICE09+new&original215CYX Technology Limited
Sat Jan 14 07:47:00 UTC 2012ISPGDX160VA-3B208-5I (from hkin.com 2)LATTICE09+new&original215CYX Technology Limited
Sat Jan 14 07:47:00 UTC 2012ISPGDX160VA-3B208-5I (from hkin.com 2)LATTICE09+new&original215CYX Technology Limited

Last record ISP1504ABS:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Jan 17 02:06:00 UTC 2012ISP1504ABS (from hkin.com)NXP0715+QFN2039BC Semicon

Last record IR21362S:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 4 02:26:00 UTC 2012IR21362STRPBF (from hkin.com)IR07+08+SOP286000Eca Electronic Technology Co.,Limited
Tue Jan 10 07:46:00 UTC 2012IR21362SPBF (from hkin.com)IR0504+DIP367EkeLive Technology (Hongkong) Limited

Last record ISD2560G:

Post DatePart NumberBrandD/CDescQtyCompany
Sun Jan 15 05:48:00 UTC 2012ISD2560G (from hkin.com)ISD09+SOP2870Ho-Sky(HK) Electronics Technology Co.,Limited

If you want to find more about ISPGDX160VA-3B208-5I, please visit us on HKin


vid:offerengine20120117

ISPGDX160VA-3B208-5I,ISPGDX160VA-3B208-5I,Comments from user about ISPGDX160VA-3B208-5I: For each computer built, all of these had to be placed and soldered onto printed circuit boards, and often multiple boards would have to be interconnected in a chassis.0 also informally known as VHDL 2008, which addressed more than 90 issues discovered during the trial period for version 3. The thyristor appeared in 1957. The updated IEEE 1076, in 1993, made the syntax more consistent, allowed more flexibility in naming, extended the character type to allow ISO-8859-1 printable characters, added the xnor operator, etc. Once a fault is detected, contacts within the circuit breaker must open to interrupt the circuit; some mechanically-stored energy (using something such as springs or compressed air) contained within the breaker is used to separate the contacts, although some of the energy required may be obtained from the fault current itself. Generally, in datasheets, turn-off energy is mentioned as a measured parameter and one has to multiply that number with the switching frequency of the intended application to estimate the turn-off loss. The design of pipelines is one of the central microarchitectural tasks. This problem is caused by the slow decay of the conduction current during turn-off resulting from slow recombination of large number of carriers, which flood the thick 'drift' region of the IGBT during conduction. Anything related to :ISPGDX160VA-3B208-5I, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: ISPGDX160VA-3B208-5I, search hkinventory: ISPGDX160VA-3B208-5I, Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage.0 also informally known as VHDL 2008, which addressed more than 90 issues discovered during the trial period for version 3. The large contact area and short distance reduces both the inductance and resistance of the connection. These diagrams generally separate the datapath (where data is placed) and the control path (which can be said to steer the data). Datasheet Dir, DataSheet Archive
In the reverse bias region for a normal P-N rectifier diode, the current through the device is very low (in the gA range). A multi-core processor is simply a single chip containing more than one microprocessor core. Several specialized processing devices have followed from the technology. This may be done to limit the bandwidth to a narrow band centered around the intended operating frequency. RISC microprocessors were initially used in special-purpose machines and Unix workstations, but then gained wide acceptance in other roles. It is a multipurpose, programmable device that accepts digital data as input, processes it according to instructions stored in its memory, and provides results as output. In response, microprocessor manufacturers look for other ways to improve performance in order to hold on to the momentum of constant upgrades in the market. The trip solenoid that releases the latch is usually energized by a separate battery, although some high-voltage circuit breakers are self-contained with current transformers, protection relays, and an internal control power source.
any passive component and active component such as:Diode,Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. The circuit breaker must detect a fault condition; in low-voltage circuit breakers this is usually done within the breaker enclosure. The thyristor appeared in 1957. Some components, such as bus interface and second level cache, may be shared between cores. For example driver circuit
ISPGDX160VA-3B208-5I,ISPGDX160VA-3B208-5I,Comments from user about ISPGDX160VA-3B208-5I: The junctions which form where n-type and p-type semiconductors join together are called p-n junctions. The MOSFET is particularly suited to this configuration because its positive thermal coefficient of resistance tends to balance current between individual devices. Similarly, an overdriven transistor amplifier can take on the characteristics of a controlled switch having essentially two levels of output. The amount of the voltage drop depends on the semiconductor material and the doping concentrations. VHDL project is portable. As integrated circuit technology advanced, it was feasible to manufacture more and more complex processors on a single chip. The circuit breaker must detect a fault condition; in low-voltage circuit breakers this is usually done within the breaker enclosure. Microcontrollers integrate a microprocessor with periphal devices for control of embedded system. Anything related to :ISPGDX160VA-3B208-5I, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: ISPGDX160VA-3B208-5ISee also: