Part: HDSP-A801

Index Files

Offer Index 41

EPSON,
SANYO,
COOPER,
EUPEC,
MICRON,
NUVOTON,
LITTELFUSE,
SILICON,
EPCOS,
MURATAPS,
COILCRAFT,
HYNIX,
AVX,
ISD/NUVOTON,
MURATA PS,
SEMIKRON,
BROADCOM,
WINBOND,
COSEL,
SST,
OSRAM,
LATTICE,
BSI,
LG,
KEC,
BCD,
LUCENT,
IDT,
JST,
SIPEX,
LGD,
TRACOPOWE,
KEMET,
FUJITSU,
NA,
AGILENT,
NUMONYX,
AUO,
FMD,
RAMTRON

 
Google Search

Product Summary
AGLIENT HDSP-A801
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: HDSP-A801.


Available from: Hongkong Hwadin Technology Co., Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:FQP13N50, FQPF8N60, FWIXP420AB, FZ900R12KF5C, G6D-1A-ASI-DC12V, GD75232DWR, GEFORCE 6200TC LEB, GLS29SF020-55-4C-NHE, GRM1557U1H5R0CZ01D, GRM155R71C822KA01D, H27UAG8T2BTR-BC, H5813D20A, H5TQ1G83DFR-H9C, H5TQ2G63BFR-11C, HC1-1R0, HD6477034F20

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: HDSP-A801":

Post DatePart NumberBrandD/CDescQtyCompany
Mon Jan 16 05:27:00 UTC 2012HDSP-A801 (from hkin.com)AGLIENT1999DIP648Hongkong Hwadin Technology Co., Limited
Mon Jan 16 05:27:00 UTC 2012HDSP-A801 (from standard server 2)AGLIENT1999DIP648Hongkong Hwadin Technology Co., Limited
Mon Jan 16 05:27:00 UTC 2012HDSP-A801 (from parts server 2)AGLIENT1999DIP648Hongkong Hwadin Technology Co., Limited
Mon Jan 16 05:27:00 UTC 2012HDSP-A801 (from hkin.com 2)AGLIENT1999DIP648Hongkong Hwadin Technology Co., Limited
Mon Jan 16 05:27:00 UTC 2012HDSP-A801 (from hkin.com 2)AGLIENT1999DIP648Hongkong Hwadin Technology Co., Limited

Last record HD6477034F20:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Jan 16 02:05:00 UTC 2012HD6477034F20 (from hkin.com)03+QFPHITACHI1860Aoxiang Technology Electronic International Limited

Last record HC1-1R0:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Jan 13 04:46:00 UTC 2012HC1-1R0-R (from hkin.com)COOPER250P/R7250Bright Spot Technology Development Co., Ltd.
Fri Jan 13 04:46:00 UTC 2012HC1-1R0 (from hkin.com)COOPER250P/R250Bright Spot Technology Development Co., Ltd.
Fri Jan 13 04:46:00 UTC 2012HC1-1R0-R (from hkin.com)COOPER250P/R250Bright Spot Technology Development Co., Ltd.

Last record H5TQ2G63BFR-11C:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Jan 14 01:12:00 UTC 2012H5TQ2G63BFR-11C (from hkin.com)Hynix10+10000HK IC-World Electronic Inter,Corp

If you want to find more about HDSP-A801, please visit us on HKin


vid:offerengine20120117

HDSP-A801,HDSP-A801,Comments from user about HDSP-A801: In case of large forward bias (current in the direction of the arrow), the diode exhibits a voltage drop due to its junction built-in voltage and internal resistance. The transistor's low cost, flexibility, and reliability have made it a ubiquitous device. The design of pipelines is one of the central microarchitectural tasks. Small circuit breakers may be manually operated; larger units have solenoids to trip the mechanism, and electric motors to restore energy to the springs. In this case, it might be possible to use VHDL to write a testbench to verify the functionality of the design using files on the host computer to define stimuli, to interact with the user, and to compare results with those expected. Digital Signal Processors are another example. Instead of processing all of a long word on one integrated circuit, multiple circuits in parallel processed subsets of each data word. In 2008, Accellera released VHDL 4. Anything related to :HDSP-A801, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: HDSP-A801, search hkinventory: HDSP-A801, These limit the circuit topologies available; for example, most, but not all active filter topologies provide a buffered (low impedance) output. Semiconductor devices are electronic components that exploit the electronic properties of semiconductor materials, principally silicon, germanium, and gallium arsenide, as well as organic semiconductors. Although several companies each produce over a billion individually packaged (known as discrete) transistors every year, the vast majority of transistors now produced are in integrated circuits (often shortened to IC, microchips or simply chips), along with diodes, resistors, capacitors and other electronic components, to produce complete electronic circuits. This can yield better performance when the guess is good, with the risk of a huge penalty when the guess is bad because instructions need to be undone. Datasheet Dir, DataSheet Archive
Some components, such as bus interface and second level cache, may be shared between cores. Latches are designed to be transparent. This includes decisions on the performance-level and connectivity of these peripherals. Ternary (with three states) logic has been studied, and some prototype computers made. Many more microprocessors are part of embedded systems, providing digital control of a myriad of objects from appliances to automobiles to cellular phones and industrial process control. Competing projects would result in the IBM POWER and Sun SPARC architectures. LEDs powerful enough for room lighting are relatively expensive and require more precise current and heat management than compact fluorescent lamp sources of comparable output. The trade-off between voltage, current and frequency ratings also exists for the switches.
any passive component and active component such as:Diode, It is a multipurpose, programmable device that accepts digital data as input, processes it according to instructions stored in its memory, and provides results as output., followed soon after. In the case of narrow-band bandpass filters, the Q determines the -3dB bandwidth but also the degree of rejection of frequencies far removed from the center frequency; if these two requirements are in conflict then a staggered-tuning bandpass filter may be needed. Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage. For example driver circuit
HDSP-A801,HDSP-A801,Comments from user about HDSP-A801: When the reverse bias breakdown voltage is exceeded, a conventional diode is subject to high current due to avalanche breakdown. Generally, processor speed has increased more rapidly than external memory speed, so cache memory is necessary if the processor is not to be delayed by slower external memory. The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to precisely control the location and concentration of p- and n-type dopants. A microprocessor control program can be easily tailored to different needs of a product line, allowing upgrades in performance with minimal redesign of the product., followed soon after. Flip-flops and latches are used as data storage elements.Different temperature coefficients are specified for various applications, including nuclear, electrical and magnetic. Digital circuits are electric circuits based on a number of discrete voltage levels. Anything related to :HDSP-A801, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: HDSP-A801See also: