Part: ES1373

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Product Summary
QFP ES1373
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: ES1373.


Available from: Minki Technology (HK) Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:2SA2151 2SC6011, 2SC4685, 2SC4774, 2SC4926YD, 2SC5084, 2SD2394F, 2SJ325, 2SK3065T100, 50105C, 53856-5070, 6706-037, 6MBI100J-060B, 74ACT08SCX, 74AHC1G32GW, 74HC138PW, 74HC373

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: ES1373":

Post DatePart NumberBrandD/CDescQtyCompany
Fri Dec 9 15:18:00 UTC 2011ES1373 (from hkin.com)QFP00+CREATIVE186Minki Technology (HK) Limited
Fri Dec 9 15:18:00 UTC 2011ES1373 (from standard server 2)QFP00+CREATIVE186Minki Technology (HK) Limited
Fri Dec 9 15:18:00 UTC 2011ES1373 (from parts server 2)QFP00+CREATIVE186Minki Technology (HK) Limited
Fri Dec 9 15:18:00 UTC 2011ES1373 (from hkin.com 2)QFP00+CREATIVE186Minki Technology (HK) Limited
Fri Dec 9 15:18:00 UTC 2011ES1373 (from hkin.com 2)QFP00+CREATIVE186Minki Technology (HK) Limited

Last record 74HC373:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Dec 30 13:17:00 UTC 201174HC373PWR (from hkin.com)NXP10+TSSOP2010000MCN International Trading Co.,Limited
Wed Dec 7 07:31:00 UTC 201174HC373D (from hkin.com)NXP11+SOP-203470Winsome Holding Group Company Limited
Wed Dec 7 07:31:00 UTC 201174HC373PW (from hkin.com)NXP11+TSSOP-2024087Winsome Holding Group Company Limited
Wed Dec 7 07:13:00 UTC 201174HC373 (from hkin.com)786Yun-Hi International (Hong Kong) Limited
Fri Dec 30 01:27:00 UTC 201174HC373N (from hkin.com)PHI8809+DIP360HK Guangsheng International Co.,Limited
Mon Dec 26 07:53:00 UTC 201174HC373(SN74HC373N) (from hkin.com)TI10+DIP500Shenzhen Dahe Electronics Co., Ltd.

Last record 74HC138PW:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Dec 7 07:31:00 UTC 201174HC138PW (from hkin.com)NXP11+TSSOP-16704Winsome Holding Group Company Limited
Fri Dec 30 03:04:00 UTC 201174HC138PW (from hkin.com)NXP0948+TSSOP10000Snow Electronics (HK) Limited

Last record 74AHC1G32GW:

Post DatePart NumberBrandD/CDescQtyCompany
Thu Dec 29 07:48:00 UTC 201174AHC1G32GW,125 (from hkin.com)NXP11+Guarantee have goods,new and original.1816Sea-Shawn Electronic Limited

If you want to find more about ES1373, please visit us on HKin


vid:offerengine20120101

ES1373,ES1373,Comments from user about ES1373: Flip-flops and latches are used as data storage elements. This is the ratio of the electric charge on each conductor to the potential difference between them. Circuit breakers are made in varying sizes, from small devices that protect an individual household appliance up to large switchgear designed to protect high voltage circuits feeding an entire city. However, most designers leave this job to the simulator. Generally, processor speed has increased more rapidly than external memory speed, so cache memory is necessary if the processor is not to be delayed by slower external memory. For quantities that vary exponentially with temperature, such as the rate of a chemical reaction, any temperature coefficient would be valid only over a very small temperature range. In electronics, a flip-flop or latch is a circuit that has two stable states and can be used to store state information. Computers, electronic clocks, and programmable logic controllers (used to control industrial processes) are constructed of digital circuits. Anything related to :ES1373, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: ES1373, search hkinventory: ES1373, With the transition to the LGA1366 and LGA1156 socket and the Intel i7 and i5 chips, quad core is now considered mainstream, but with the release of the i7-980x, six core processors are now well within reach. This required IEEE standard 1164, which defined the 9-value logic types: scalar std_ulogic and its vector version std_ulogic_vector. IEEE standard 1076. Generally, in datasheets, turn-off energy is mentioned as a measured parameter and one has to multiply that number with the switching frequency of the intended application to estimate the turn-off loss. Datasheet Dir, DataSheet Archive
The pipelined datapath is the most commonly used datapath design in microarchitecture today.2 added better handling of real and complex data types. Continued increases in microprocessor capacity have rendered other forms of computers almost completely obsolete (see history of computing hardware), with one or more microprocessors used in everything from the smallest embedded systems and handheld devices to the largest mainframes and supercomputers. This problem is caused by the slow decay of the conduction current during turn-off resulting from slow recombination of large number of carriers, which flood the thick 'drift' region of the IGBT during conduction. System-level design decisions such as whether or not to include peripherals, such as memory controllers, can be considered part of the microarchitectural design process. This is driven by gains in manufacturing efficiency and automation, lower labor costs as manufacturing has moved to lower-wage countries, and improvements in semiconductor design. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using electronic components. These techniques use convection, conduction, & radiation of heat energy.
any passive component and active component such as:Diode, Passive filters are still found, however, in hybrid integrated circuits. Thyristors are able to withstand very high reverse breakdown voltage and are also capable of carrying high current. This CPU cache has the advantage of faster access than off-chip memory, and increses the processing speed of the system for many applications. Each operation of the ALU sets one or more flags in a status register, which indicate the results of the last operation (zero value, negative number, overflow. or others). For example driver circuit
ES1373,ES1373,Comments from user about ES1373: The internal arrangement of a microprocessor varies depending on the age of the design and the intended purposes of the processor. A passive component, depending on field, may be either a component that consumes (but does not produce) energy (thermodynamic passivity), or a component that is incapable of power gain (incremental passivity). A different approach to improving a computer's performance is to add extra processors, as in symmetric multiprocessing designs, which have been popular in servers and workstations since the early 1990s. The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer.Most analog electronic appliances, such as radio receivers, are constructed from combinations of a few types of basic circuits. Basically, an IGBT is a bipolar transistor driven by a power MOSFET: it has the advantages of being a minority carrier device (good performance in on-state, even for high voltage devices), with the high input impedance of a MOSFET (it can be driven on or off with a very low amount of power). With the vertical structure, the current rating of the device is proportional to its area, and the voltage blocking capability is achieved in the height of the die. Integrated circuits are used in virtually all electronic equipment today and have revolutionized the world of electronics. Anything related to :ES1373, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: ES1373See also: