Part: TPSC157K006R0200

Index Files

Offer Index 38

TDK,
MICREL,
IXYS,
VICOR,
SHARP,
INTERSIL,
AGILENT,
NIPPON CHEMI-CON,
HIT,
QFN,
COOPER,
NAIS,
MIT,
SILICON,
NUVOTON,
SKYWORKS,
LAMBDA,
REALTEK,
LATTICE,
IDT,
MOLEX,
LITTELFUSE,
NICHICON,
WINBOND,
ISD/NUVOTON,
FUJITSU,
MURATAPS,
NVIDIA,
JST,
SST,
OSRAM,
COILCRAFT,
IMP,
EPCOS,
MURATA PS,
EPSON,
SIPEX,
KEC,
LUCENT,
SIMCOM,
SPANSION,
AVX,
BCD,
LG,
PERICOM,
BOSCH,
SW,
JRC,
TRACOPOWE,
DS,
MITSUBI,
QFP,
SIEMENS,
MXIC,
TI,
NS,
AD,
ST,
MAX,
INFINEON,
ON,
XILINX,
ATMEL,
ALTERA,
MURATA,
TOS,
FSC,
CY,
IR,
SAMSUNG,
NXP,
INTEL,
MOT,
ROHM,
FREESCALE,
PHI,
MICROCHIP,
DALLAS,
MICRON,
MIC,
NEC,
POWER,
VISHAY,
LINEAR,
AMD,
PANASONIC,
WINSTAR,
RENESAS,
ALLEGRO,
BROADCOM,
FUJI,
HYNIX,
YAGEO,
MPS,
BB,
ISSI,
SANYO,
BOURNS,
ATI,
AVAGO,
TDK,
MICREL,
IXYS,
VICOR,
SHARP,
INTERSIL,
AGILENT,
NIPPON CHEMI-CON,
HIT,
QFN,
COOPER,
NAIS,
MIT,
SILICON,
NUVOTON,
SKYWORKS,
LAMBDA,
REALTEK,
LATTICE,
IDT,
MOLEX,
LITTELFUSE,
NICHICON,
WINBOND,
ISD/NUVOTON,
FUJITSU,
MURATAPS,
NVIDIA,
JST,
SST,
OSRAM,
COILCRAFT,
IMP,
EPCOS,
MURATA PS,
EPSON,
SIPEX,
LUCENT,
KEC,
SIMCOM,
SPANSION,
AVX,
BCD,
LG,
PERICOM,
BOSCH,
SW,
JRC,
TRACOPOWE,
DS,
MITSUBI,
QFP,
SIEMENS,
MXIC,
TI,
NS,
AD,
ST,
MAX,
INFINEON,
ON,
XILINX,
ATMEL,
ALTERA,
MURATA,
TOS,
FSC,
CY,
IR,
SAMSUNG,
NXP,
INTEL,
MOT,
ROHM,
FREESCALE,
PHI,
MICROCHIP,
DALLAS,
MICRON,
MIC,
NEC,
POWER,
VISHAY,
LINEAR,
AMD,
PANASONIC,
WINSTAR,
RENESAS,
ALLEGRO,
BROADCOM,
FUJI,
HYNIX,
YAGEO,
MPS,
BB,
ISSI,
SANYO,
BOURNS,
ATI,
AVAGO,
TDK,
MICREL,
IXYS,
VICOR,
SHARP,
INTERSIL,
AGILENT,
NIPPON CHEMI-CON,
HIT,
QFN,
COOPER,
NAIS,
MIT,
SILICON,
NUVOTON,
SKYWORKS,
LAMBDA,
REALTEK,
LATTICE,
IDT,
MOLEX,
LITTELFUSE,
NICHICON,
WINBOND,
ISD/NUVOTON,
FUJITSU,
MURATAPS,
NVIDIA,
JST,
SST,
OSRAM,
COILCRAFT,
IMP,
EPCOS,
MURATA PS,
EPSON,
SIPEX,
LUCENT,
KEC,
SIMCOM,
SPANSION,
AVX,
BCD,
LG,
PERICOM,
BOSCH,
SW,
JRC,
TRACOPOWE,
DS,
MITSUBI,
QFP,
SIEMENS,
MXIC,
TI,
NS,
AD,
ST,
MAX,
INFINEON,
ON,
XILINX,
ATMEL,
ALTERA,
MURATA,
TOS,
FSC,
CY,
IR,
SAMSUNG,
NXP,
INTEL,
MOT,
ROHM,
FREESCALE,
PHI,
MICROCHIP,
DALLAS,
MICRON,
MIC,
NEC,
POWER,
VISHAY,
LINEAR,
AMD,
PANASONIC,
WINSTAR,
RENESAS,
ALLEGRO,
BROADCOM,
FUJI,
HYNIX,
YAGEO,
MPS,
BB,
ISSI,
SANYO,
BOURNS,
ATI,
AVAGO,
TDK,
MICREL,
IXYS,
VICOR,
SHARP,
INTERSIL,
AGILENT,
NIPPON CHEMI-CON,
HIT,
QFN,
COOPER,
NAIS,
MIT,
SILICON,
NUVOTON,
SKYWORKS,
LAMBDA,
REALTEK,
LATTICE,
IDT,
MOLEX,
LITTELFUSE,
NICHICON,
WINBOND,
ISD/NUVOTON,
FUJITSU,
MURATAPS,
NVIDIA,
JST,
SST,
OSRAM,
COILCRAFT,
IMP,
EPCOS,
MURATA PS,
EPSON,
SIPEX,
LUCENT,
KEC,
SIMCOM,
SPANSION,
AVX,
BCD,
LG,
PERICOM,
BOSCH,
SW,
JRC,
TRACOPOWE,
DS,
MITSUBI,
QFP,
SIEMENS,
MXIC,
TI,
NS,
AD,
ST,
MAX,
INFINEON

 
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Product Summary
KEMET TPSC157K006R0200
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: TPSC157K006R0200.


Available from: Aric Electronics Technology (HK) Co., Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:MMBZ5222BLT1G, CATTEN-0200, APBA3210SURKCGKC-F01, ISD4004-12MPY, MC145572FN, LA6569, IRF9Z34NSTRLPBF, N79E366ADG, RB701D, S25FL128P0XMFI001, L7251 2.2, TPS78225DDCR, C1608X5R1C105KT000N, K9LBG08UOE-SCBO, T495D336K020AS, T495T106K016AS

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: TPSC157K006R0200":

Post DatePart NumberBrandD/CDescQtyCompany
Wed Feb 22 04:26:00 UTC 2012TPSC157K006R0200 (from standard server 2)KEMET11+SOP10000Aric Electronics Technology (HK) Co., Limited
Wed Feb 22 04:26:00 UTC 2012TPSC157K006R0200 (from parts server 2)KEMET11+SOP10000Aric Electronics Technology (HK) Co., Limited
Wed Feb 22 04:26:00 UTC 2012TPSC157K006R0200 (from hkin.com 2)KEMET11+SOP10000Aric Electronics Technology (HK) Co., Limited
Wed Feb 22 04:26:00 UTC 2012TPSC157K006R0200 (from hkin.com 2)KEMET11+SOP10000Aric Electronics Technology (HK) Co., Limited

Last record T495T106K016AS:

Post DatePart NumberBrandD/CDescQtyCompany

Last record T495D336K020AS:

Post DatePart NumberBrandD/CDescQtyCompany

Last record K9LBG08UOE-SCBO:

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vid:offerengine20120324 Part Number Prefix

TPSC157K006R0200,TPSC157K006R0200,Comments from user about TPSC157K006R0200: The forms of practical capacitors vary widely, but all contain at least two conductors separated by a non-conductor. The pipelined datapath is the most commonly used datapath design in microarchitecture today. In practice the dielectric between the plates passes a small amount of leakage current and also has an electric field strength limit, resulting in a breakdown voltage, while the conductors and leads introduce an undesired inductance and resistance. This creates a much larger current between the collector and emitter, controlled by the base-emitter current. Often logic "0" will be a lower voltage and referred to as "Low" while logic "1" is referred to as "High". Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. For example, an engine control system in an automobile can adjust ignition timing based on engine speed, load on the engine, ambient temperature, and any observed tendency for knocking - allowing an automobile to operate on a range of fuel grades.0 of VHDL-2006. Anything related to :TPSC157K006R0200, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: TPSC157K006R0200, search hkinventory: TPSC157K006R0200, Its importance in today's society rests on its ability to be mass produced using a highly automated process (semiconductor device fabrication) that achieves astonishingly low per-transistor costs.Solid-state electronics are those circuits or devices built entirely from solid materials and in which the electrons, or other charge carriers, are confined entirely within the solid material. An ideal capacitor is characterized by a single constant value, capacitance, measured in farads.[3] Some of these stages include instruction fetch, instruction decode, execute, and write back. Datasheet Dir, DataSheet Archive
An electric field can increase the number of free electrons and holes in a semiconductor, thereby changing its conductivity. This includes decisions on the performance-level and connectivity of these peripherals. Its importance in today's society rests on its ability to be mass produced using a highly automated process (semiconductor device fabrication) that achieves astonishingly low per-transistor costs. Floating-point arithmetic, for example, was often not available on 8-bit microprocessors, but had to be carried out in software. Note that this only works if only one of the above definitions of passivity is used ?if components from the two are mixed, the systems may be unstable under any criteria. Not all constructs in VHDL are suitable for synthesis. With the vertical structure, the current rating of the device is proportional to its area, and the voltage blocking capability is achieved in the height of the die. This problem is caused by the slow decay of the conduction current during turn-off resulting from slow recombination of large number of carriers, which flood the thick 'drift' region of the IGBT during conduction.
any passive component and active component such as:Diode, As it is a physical limit, no improvement is expected from silicon MOSFETs concerning their maximum voltage ratings. The complexity of an integrated circuit is bounded by physical limitations of the number of transistors that can be put onto one chip, the number of package terminations that can connect the processor to other parts of the system, the number of interconnections it is possible to make on the chip, and the heat that the chip can dissipate.0 of VHDL-2006. The design of pipelines is one of the central microarchitectural tasks. For example driver circuit
TPSC157K006R0200,TPSC157K006R0200,Comments from user about TPSC157K006R0200: voltage amplifiers or buffer amplifiers. The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer. In principle, a single microarchitecture could execute several different ISAs with only minor changes to the microcode. A simulation program is used to test the logic design using simulation models to represent the logic circuits that interface to the design. Increasingly these products have become based on digital technologies, and have largely merged with the computer industry in what is increasingly referred to as the consumerization of information technology. Sun Microsystems has released the Niagara and Niagara 2 chips, both of which feature an eight-core design. It is a multipurpose, programmable device that accepts digital data as input, processes it according to instructions stored in its memory, and provides results as output.2 added better handling of real and complex data types. Anything related to :TPSC157K006R0200, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: TPSC157K006R0200See also: