Part: ADSP2185MBSTZ-266

Index Files

Offer Index 38

MPS,
BB,
HYNIX,
ISSI,
SANYO,
BOURNS,
ATI,
AVAGO,
TDK,
MICREL,
IXYS,
VICOR,
SHARP,
INTERSIL,
AGILENT,
HIT,
NIPPON CHEMI-CON,
QFN,
MIT,
COOPER,
NAIS,
SILICON,
NUVOTON,
SKYWORKS,
IDT,
LAMBDA,
REALTEK,
LATTICE,
MOLEX,
LITTELFUSE,
NICHICON,
WINBOND,
ISD/NUVOTON,
FUJITSU,
NVIDIA,
MURATAPS,
SST,
JST,
OSRAM,
IMP,
COILCRAFT,
EPCOS,
EPSON,
MURATA PS,
SIMCOM,
KEC,
SIPEX,
LUCENT,
SPANSION,
AVX,
BCD,
LG,
PERICOM,
BOSCH,
DS,
TRACOPOWE,
JRC,
MITSUBI,
QFP,
RAMTRON,
SANKEN,
SIEMENS,
TI,
AD,
NS,
ST,
MAX,
ON,
INFINEON,
XILINX,
ATMEL,
ALTERA,
MURATA,
TOS,
IR,
CY,
FSC,
NXP,
SAMSUNG,
MIC,
INTEL,
MOT,
FREESCALE,
PHI,
MICROCHIP,
DALLAS,
MICRON,
NEC,
ROHM,
POWER,
VISHAY,
LINEAR,
PANASONIC,
AMD,
WINSTAR,
RENESAS,
ALLEGRO,
BROADCOM,
FUJI,
YAGEO,
MPS,
BB,
HYNIX,
ISSI,
SANYO,
BOURNS,
ATI,
AVAGO,
TDK,
MICREL,
IXYS,
VICOR,
SHARP,
INTERSIL,
AGILENT,
HIT,
NIPPON CHEMI-CON,
QFN,
MIT,
COOPER,
NAIS,
SILICON,
NUVOTON,
SKYWORKS,
IDT,
LAMBDA,
REALTEK,
LATTICE,
MOLEX,
LITTELFUSE,
NICHICON,
WINBOND,
ISD/NUVOTON,
FUJITSU,
NVIDIA,
MURATAPS,
SST,
JST,
OSRAM,
IMP,
COILCRAFT,
EPCOS,
EPSON,
MURATA PS,
SIMCOM,
KEC,
SIPEX,
LUCENT,
SPANSION,
AVX,
BCD,
LG,
PERICOM,
BOSCH,
DS,
TRACOPOWE,
JRC,
MITSUBI,
QFP,
RAMTRON,
SANKEN,
SIEMENS,
TI,
AD,
NS,
ST,
MAX,
INFINEON,
XILINX,
ON,
ATMEL,
ALTERA,
MURATA,
TOS,
CY,
IR,
FSC,
NXP,
SAMSUNG,
INTEL,
MOT,
FREESCALE,
PHI,
MICROCHIP,
DALLAS,
MICRON,
MIC,
ROHM,
NEC,
POWER,
VISHAY,
LINEAR,
PANASONIC,
AMD,
WINSTAR,
RENESAS,
ALLEGRO,
BROADCOM,
FUJI,
YAGEO,
MPS,
BB,
HYNIX,
SANYO,
ISSI,
BOURNS,
ATI,
AVAGO,
TDK,
MICREL,
IXYS,
VICOR,
SHARP,
INTERSIL,
AGILENT,
NIPPON CHEMI-CON,
HIT,
QFN,
COOPER,
NAIS,
MIT,
SILICON,
NUVOTON,
SKYWORKS,
LAMBDA,
REALTEK,
LATTICE,
IDT,
MOLEX,
LITTELFUSE,
NICHICON,
WINBOND,
ISD/NUVOTON,
FUJITSU,
MURATAPS,
NVIDIA,
JST,
SST,
OSRAM,
COILCRAFT,
IMP,
EPCOS,
MURATA PS,
EPSON,
SIPEX,
KEC,
LUCENT,
SIMCOM,
SPANSION,
AVX,
BCD,
LG,
PERICOM,
BOSCH,
TRACOPOWE,
DS,
MITSUBI,
QFP,
SIEMENS,
JRC,
MXIC,
PANJIT,
TI,
NS,
AD,
ST,
MAX,
INFINEON,
ON,
XILINX,
ATMEL,
ALTERA,
MURATA,
TOS,
FSC,
CY,
IR,
SAMSUNG,
NXP,
INTEL,
MOT,
ROHM,
FREESCALE,
PHI,
MICROCHIP,
DALLAS,
MICRON,
MIC,
NEC,
POWER,
VISHAY,
LINEAR,
AMD,
PANASONIC,
WINSTAR,
RENESAS,
ALLEGRO,
BROADCOM,
FUJI,
HYNIX,
YAGEO,
MPS,
BB,
ISSI,
SANYO,
BOURNS,
ATI,
AVAGO,
TDK,
MICREL,
IXYS,
VICOR,
SHARP,
INTERSIL,
AGILENT,
NIPPON CHEMI-CON,
HIT,
QFN,
COOPER,
NAIS,
MIT,
SILICON,
NUVOTON,
SKYWORKS,
LAMBDA,
REALTEK,
LATTICE,
IDT,
MOLEX,
LITTELFUSE,
NICHICON,
WINBOND,
ISD/NUVOTON,
FUJITSU,
MURATAPS,
NVIDIA,
JST,
SST,
OSRAM,
COILCRAFT,
IMP,
EPCOS,
MURATA PS,
EPSON,
SIPEX,
KEC,
LUCENT,
SIMCOM,
SPANSION,
AVX,
BCD,
LG,
PERICOM,
BOSCH,
SW,
JRC,
TRACOPOWE,
DS,
MITSUBI,
QFP,
SIEMENS,
MXIC,
TI,
NS,
AD,
ST,
MAX,
INFINEON,
ON,
XILINX,
ATMEL,
ALTERA,
MURATA,
TOS,
FSC,
CY,
IR,
SAMSUNG,
NXP,
INTEL,
MOT,
ROHM,
FREESCALE,
PHI,
MICROCHIP,
DALLAS,
MICRON,
MIC,
NEC,
POWER,
VISHAY,
LINEAR,
AMD,
PANASONIC,
WINSTAR,
RENESAS,
ALLEGRO,
BROADCOM,
FUJI,
HYNIX

 
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Product Summary
AD ADSP2185MBSTZ-266
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: ADSP2185MBSTZ-266.


Available from: Shenzhen Chuangxinda Electronic-Tech Co.,Ltd
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:NC7SB3157, TEA1506P, UPC1378H, MAX4610CSD, LM78L12ACM, TL750L12CLP, TMS320C32PCM50, ATMEGA162, AZ1117H-3.3, 2SC9015, XC5VFX70T-2FF1136CES, AM 26C32, EKY-350ETD561MJ25S, ELXY250ETD181MJC5S, TDA1308, 18122C223MAT2A

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: ADSP2185MBSTZ-266":

Post DatePart NumberBrandD/CDescQtyCompany
Tue Feb 28 11:41:00 UTC 2012ADSP2185MBSTZ-266 (from standard server 2)AD08+QFP100825Shenzhen Chuangxinda Electronic-Tech Co.,Ltd
Tue Feb 28 11:41:00 UTC 2012ADSP2185MBSTZ-266 (from parts server 2)AD08+QFP100825Shenzhen Chuangxinda Electronic-Tech Co.,Ltd
Tue Feb 28 11:41:00 UTC 2012ADSP2185MBSTZ-266 (from hkin.com 2)AD08+QFP100825Shenzhen Chuangxinda Electronic-Tech Co.,Ltd
Tue Feb 28 11:41:00 UTC 2012ADSP2185MBSTZ-266 (from hkin.com 2)AD08+QFP100825Shenzhen Chuangxinda Electronic-Tech Co.,Ltd

Last record 18122C223MAT2A:

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Last record TDA1308:

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Last record ELXY250ETD181MJC5S:

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vid:offerengine20120325 Part Number Prefix

ADSP2185MBSTZ-266,ADSP2185MBSTZ-266,Comments from user about ADSP2185MBSTZ-266: In June 2006, the VHDL Technical Committee of Accellera (delegated by IEEE to work on the next update of the standard) approved so called Draft 3. A passive component, depending on field, may be either a component that consumes (but does not produce) energy (thermodynamic passivity), or a component that is incapable of power gain (incremental passivity). Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. Low-pass filters ?attenuation of frequencies above their cut-off points. The large number of discrete logic gates used more electrical powerXand therefore, produced more heatXthan a more integrated design with fewer ICs. Such a model is processed by a synthesis program, only if it is part of the logic design. Unlike a fuse, which operates once and then has to be replaced, a circuit breaker can be reset (either manually or automatically) to resume normal operation. Many products include Internet connectivity using technologies such as Wi-Fi, Bluetooth or Ethernet. Anything related to :ADSP2185MBSTZ-266, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: ADSP2185MBSTZ-266, search hkinventory: ADSP2185MBSTZ-266, The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to precisely control the location and concentration of p- and n-type dopants. On average, every fifth instruction executed is a branch, so without any intervention, that's a high amount of stalling. The updated IEEE 1076, in 1993, made the syntax more consistent, allowed more flexibility in naming, extended the character type to allow ISO-8859-1 printable characters, added the xnor operator, etc. This equation is linear with respect to temperature. Datasheet Dir, DataSheet Archive
VHDL project is multipurpose. It was made of Germanium and had a voltage capability of 200 volts and a current rating of 35 amperes. The advent of low-cost computers on integrated circuits has transformed modern society. Several specialized processing devices have followed from the technology. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. This is driven by gains in manufacturing efficiency and automation, lower labor costs as manufacturing has moved to lower-wage countries, and improvements in semiconductor design. Microprocessors make it possible to put a computer into thousands of items that were traditionally not computer-related. They are commonly used in speaker crossover design (due to the moderately large voltages and currents, and the lack of easy access to power), filters in power distribution networks (due to the large voltages and currents), power supply bypassing (due to low cost, and in some cases, power requirements), as well as a variety of discrete and home brew circuits (for low-cost and simplicity).
any passive component and active component such as:Diode, In 2005, the first personal computer dual-core processors were announced. The range of desired frequencies (the passband) together with the shape of the frequency response. With AMD's introduction of a 64-bit architecture backwards-compatible with x86, x86-64 (also called AMD64), in September 2003, followed by Intel's near fully compatible 64-bit extensions (first called IA-32e or EM64T, later renamed Intel 64), the 64-bit desktop era began. Keeping up with Moore's Law is becoming increasingly challenging as chip-making technologies approach their physical limits. For example driver circuit
ADSP2185MBSTZ-266,ADSP2185MBSTZ-266,Comments from user about ADSP2185MBSTZ-266: The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements. Cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time. For high-pass and low-pass (as well as band-pass filters far from the center frequency), the required rejection may determine the slope of attenuation needed, and thus the "order" of the filter. Circuit breakers for large currents or high voltages are usually arranged with pilot devices to sense a fault current and to operate the trip opening mechanism. Although the MOSFET is named in part for its "metal" gate, in modern devices polysilicon is typically used instead. While this required extra logic to handle, for example, carry and overflow within each slice, the result was a system that could handle, say, 32-bit words using integrated circuits with a capacity for only 4 bits each. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using electronic components. From the time that the processor's instruction decoder has figured out that it has encountered a conditional branch instruction to the time that the deciding register value can be read out, the pipeline needs to be stalled for several cycles, or if it's not and the branch is taken, the pipeline needs to be flushed. Anything related to :ADSP2185MBSTZ-266, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: ADSP2185MBSTZ-266See also: