Part: XCV405E-8BG560C

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Product Summary
XILINX XCV405E-8BG560C
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: XCV405E-8BG560C.


Available from: Deko Technology Limited.
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:CP2110-F01-GM, BD9323EFJ-E2, FM20L08-60-TG, TQM763013, XC4VLX25-10FF676C, 24AA02, NDY2405C, AM1L-0505S-NZ, AT28C256-15PC, E13003-126, MSP430F2131IRGER, MSP430F2232TRHAR, MSP430F4783IPZR, LM70280FB, mt48lc8m32b2tg6, XC2S15

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: XCV405E-8BG560C":

Post DatePart NumberBrandD/CDescQtyCompany
Mon Jan 9 01:49:00 UTC 2012XCV405E-8BG560C (from hkin.com)XILINX0405+3400Deko Technology Limited.
Mon Jan 9 01:49:00 UTC 2012XCV405E-8BG560C (from standard server 2)XILINX0405+3400Deko Technology Limited.
Mon Jan 9 01:49:00 UTC 2012XCV405E-8BG560C (from parts server 2)XILINX0405+3400Deko Technology Limited.
Mon Jan 9 01:49:00 UTC 2012XCV405E-8BG560C (from hkin.com 2)XILINX0405+3400Deko Technology Limited.
Mon Jan 9 01:49:00 UTC 2012XCV405E-8BG560C (from hkin.com 2)XILINX0405+3400Deko Technology Limited.

Last record XC2S15:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Dec 26 01:31:00 UTC 2011XC2S150E-6FG456C (from hkin.com)XILINX10+500Forseen Technology (Hongkong) Limited
Fri Jan 13 08:53:00 UTC 2012XC2S150FG456C (from hkin.com)XILNX4Shenzhen Sounet Electronic Technologies Co.,Ltd
Mon Jan 16 06:04:00 UTC 2012XC2S150-5PQG208C (from hkin.com)XILINX2007+PQFP417Homsun Technology (H.K.) Limited
Sat Jan 14 06:11:00 UTC 2012XC2S150-6FG456C (from hkin.com)Xilinx05/1Brosong Electronics Limited
Mon Jan 9 01:49:00 UTC 2012XC2S15-6TQ144C (from hkin.com)XILINX2004+5400Deko Technology Limited.
Tue Jan 17 07:41:00 UTC 2012XC2S150-6FG456C (from hkin.com)XILINX06+BGA456720Chip Source Co.,Limited
Tue Jan 17 07:41:00 UTC 2012XC2S150-6FGG456C (from hkin.com)XILINX10+BGA456840Chip Source Co.,Limited
Mon Dec 19 07:55:00 UTC 2011XC2S150E-6FT256C (from hkin.com)XILINH0831+BGA480Shenzhen Feida Global Electronics Co.,Ltd
Fri Jan 13 01:52:00 UTC 2012XC2S15-5VQ100C (from hkin.com)XILINX04+TQFP20Telesky International Limited
Tue Jan 10 17:14:00 UTC 2012XC2S150-5FG256C (from hkin.com)XILINX03+BGA120Hongkong xumei electronics co.,ltd
Tue Jan 10 17:14:00 UTC 2012XC2S150-5PQ208C (from hkin.com)XILINX03+QFP200Hongkong xumei electronics co.,ltd
Tue Jan 10 17:14:00 UTC 2012XC2S150-6FG456C (from hkin.com)XILINX03+BGA200Hongkong xumei electronics co.,ltd
Tue Jan 10 17:14:00 UTC 2012XC2S150-6FT256C (from hkin.com)XILINX03+BGA200Hongkong xumei electronics co.,ltd
Tue Jan 10 17:14:00 UTC 2012XC2S150E-6FG456C (from hkin.com)XILINX03+BGA200Hongkong xumei electronics co.,ltd
Tue Jan 10 17:14:00 UTC 2012XC2S150E-6FT256C (from hkin.com)XILINX03+BGA200Hongkong xumei electronics co.,ltd
Tue Jan 10 17:14:00 UTC 2012XC2S15-5TQ144C (from hkin.com)XILINX03+QFP257Hongkong xumei electronics co.,ltd
Tue Jan 10 17:14:00 UTC 2012XC2S15-5VQ100C (from hkin.com)XILINX03+QFP135Hongkong xumei electronics co.,ltd
Mon Jan 9 08:02:00 UTC 2012XC2S15-5VQG100C (from hkin.com)XILINX0645+TQFP1008974AC Export Co.,Ltd
Mon Jan 16 02:47:00 UTC 2012XC2S150FG456 (from hkin.com)XILINX10+BGA3230E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S15-2TQ144 (from hkin.com)XILINX10+QFP3562E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S15-5CS144C (from hkin.com)xilinx10+43E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S15-5CS144CES (from hkin.com)xilinx10+16E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S15-5CS144I (from hkin.com)xilinx10+52E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S15-5TQ144C (from hkin.com)xilinx10+231E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S15-5TQ144CES (from hkin.com)xilinx10+153E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S15-5TQ144I (from hkin.com)xilinx10+104E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S15-5VQ100C (from hkin.com)xilinx10+20E-Core Electronics Co.
Mon Jan 16 03:46:00 UTC 2012XC2S1505PQ208I (from hkin.com)XILINX05+QFP-208330Toyota (H.K) Co., Limited
Mon Jan 16 03:46:00 UTC 2012XC2S150-5FGG256C (from hkin.com)XILINX08+BGA-2563004Toyota (H.K) Co., Limited
Fri Jan 13 00:54:00 UTC 2012XC2S150-5PQ208C (from hkin.com)XILINX0049+QFP39EkeLive Technology (Hongkong) Limited
Wed Dec 21 03:43:00 UTC 2011XC2S150-5PQ2080I (from hkin.com)XILINX500JetLi Electronic (HK) Limited
Mon Jan 16 02:47:00 UTC 2012XC2S150-2FG256 (from hkin.com)XILINX10+BGA3355E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-5BG256C (from hkin.com)xilinx10+278E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-5FG256C (from hkin.com)xilinx10+275E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-5FG256CES (from hkin.com)xilinx10+135E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-5FG256I (from hkin.com)xilinx10+950E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-5FG456C (from hkin.com)xilinx10+344E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-5FG456CES (from hkin.com)xilinx10+250E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-5FG456I (from hkin.com)xilinx10+236E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-5PQ208 (from hkin.com)XILINX10+QFP3351E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-5PQ208C (from hkin.com)xilinx10+2374E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-5PQ208CES (from hkin.com)xilinx10+133E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-5PQ208I (from hkin.com)xilinx10+864E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-6FG256C (from hkin.com)xilinx10+372E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-6FG256CES (from hkin.com)xilinx10+154E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-6FG456C (from hkin.com)xilinx10+201E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-6FG456CES (from hkin.com)xilinx10+130E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-6PQ208C (from hkin.com)xilinx10+2317E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-6PQ208CES (from hkin.com)xilinx10+103E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150-6PQ208I (from hkin.com)xilinx10+426E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150E-2FGG456 (from hkin.com)XILINX10+BGA3987E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150E-2FT256 (from hkin.com)XILINX10+BGA3230E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150E-6FG456C (from hkin.com)xilinx10+243E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150E-6FG456I (from hkin.com)xilinx10+155E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150E-6FT256C (from hkin.com)xilinx10+245E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150E-6FT256I (from hkin.com)xilinx10+376E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150E-6PQ208C (from hkin.com)xilinx10+100E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150E-6PQ208I (from hkin.com)xilinx10+52E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150E-7FG456C (from hkin.com)xilinx10+169E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150E-7FT256C (from hkin.com)xilinx10+126E-Core Electronics Co.
Mon Jan 16 02:47:00 UTC 2012XC2S150E-7PQ208C (from hkin.com)xilinx10+75E-Core Electronics Co.
Sun Jan 15 05:48:00 UTC 2012XC2S15TQ144AMS (from hkin.com)XZLINX09+TQFP1800Ho-Sky(HK) Electronics Technology Co.,Limited
Fri Jan 13 08:51:00 UTC 2012XC2S150FG456C (from hkin.com)XILNXBGA4Hong Kong Elsung Electronics Limited
Fri Jan 13 08:56:00 UTC 2012XC2S150FG456C (from hkin.com)XILNXBGA4Hongkong Jeanway Technologies Limited

Last record mt48lc8m32b2tg6:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Jan 9 01:49:00 UTC 2012mt48lc8m32b2tg6 (from hkin.com)..04+5400Deko Technology Limited.

Last record LM70280FB:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Jan 17 01:30:00 UTC 2012LM70280FB (from hkin.com)NSC09+/DCSOP-87300Shenzhen HuaJun Commmunication Tech Co., Ltd

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XCV405E-8BG560C,XCV405E-8BG560C,Comments from user about XCV405E-8BG560C: Each logic gate is in turn represented by a circuit diagram describing the connections of the transistors used to implement it in some particular logic family. LEDs are used as indicator lamps in many devices and are increasingly used for other lighting. One particular pitfall is the accidental production of transparent latches rather than D-type flip-flops as storage elements The initial version of VHDL, designed to IEEE standard 1076-1987, included a wide range of data types, including numerical (integer and real), logical (bit and boolean), character and time, plus arrays of bit called bit_vector and of character called string.[citation needed] The R3000 made the design truly practical, and the R4000 introduced the world's first commercially available 64-bit RISC microprocessor. Occasionally the physical limitations of integrated circuits made such practices as a bit slice approach necessary. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. The integration of a whole CPU onto a single chip or on a few chips greatly reduced the cost of processing power. While different synthesis tools have different capabilities, there exists a common synthesizable subset of VHDL that defines what language constructs and idioms map into common hardware for many synthesis tools. Anything related to :XCV405E-8BG560C, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: XCV405E-8BG560C, search hkinventory: XCV405E-8BG560C, In 2005, the first personal computer dual-core processors were announced. Produced at Fairchild Semiconductor, it was made of silicon, whereas Kilby's chip was made of germanium. The choice of the number of execution units, their latency and throughput is a central microarchitectural design task. The gate electrode is charged to produce an electric field that controls the conductivity of a "channel" between two terminals, called the source and drain. Datasheet Dir, DataSheet Archive
Unlike what happened when IA-32 was extended to x86-64, no new general purpose registers were added in 64-bit PowerPC, so any performance gained when using the 64-bit mode for applications making no use of the larger address space is minimal. Consumer electronics are manufactured throughout the world, although there is a particularly high concentration of headquarters, factories, research and development activity in East Asia, especially in Japan. Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies, made possible by the low cost of production of integrated circuits. Integrated circuits are used in virtually all electronic equipment today and have revolutionized the world of electronics. Semiconductor conductivity can be controlled by introduction of an electric or magnetic field, by exposure to light or heat, or by mechanical deformation of a doped monocrystalline grid; thus, semiconductors can make excellent sensors. In addition, passive circuits will not necessarily be stable under all stability criteria. In electronics, a flip-flop or latch is a circuit that has two stable states and can be used to store state information. This is driven by gains in manufacturing efficiency and automation, lower labor costs as manufacturing has moved to lower-wage countries, and improvements in semiconductor design.
any passive component and active component such as:Diode, For quantities that vary polynomially or logarithmically with temperature, it may be possible to calculate a temperature coefficient that is a useful approximation for a certain range of temperatures. A capacitor (formerly known as condenser) is a device for storing electric charge.6 defines a subset of the language that is considered the official synthesis subset. Style, price, specification and performance are all relevant. For example driver circuit
XCV405E-8BG560C,XCV405E-8BG560C,Comments from user about XCV405E-8BG560C: Common-emitter amplifiers are also used in radio frequency circuits, for example to amplify faint signals received by an antenna. Alternatively, additional logic can be added to a simple transparent latch to make it non-transparent or opaque when another input (an "enable" input) is not asserted. Key changes include incorporation of child standards (1164, 1076.2, 1076.3) into the main 1076 standard, an extended set of operators, more flexible syntax of case and generate statements, incorporation of VHPI (interface to C/C++ languages) and a subset of PSL (Property Specification Language). Semiconductor devices are manufactured both as single discrete devices and as integrated circuits (ICs), which consist of a numberfrom a few (as low as two) to billionsof devices manufactured and interconnected on a single semiconductor substrate. This can yield better performance when the guess is good, with the risk of a huge penalty when the guess is bad because instructions need to be undone. On average, every fifth instruction executed is a branch, so without any intervention, that's a high amount of stalling. High-end Intel Xeon processors that are on the LGA771 socket are DP (dual processor) capable, as well as the Intel Core 2 Extreme QX9775 also used in the Mac Pro by Apple and the Intel Skulltrail motherboard. Circuit breakers for large currents or high voltages are usually arranged with pilot devices to sense a fault current and to operate the trip opening mechanism. Anything related to :XCV405E-8BG560C, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: XCV405E-8BG560CSee also: