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Product Summary
ST M27C256B-80XF6 This is an offer provided by HKin.com member. In stock! Order now! Category: Electronic Components. Product #: M27C256B-80XF6. Available from: Hongkong Booyi Technology Limited Condition: in excellent condition In stock! Order now!

Part Numbers

Previous Parts:LM1875, LM1881, LM2575SX-5.0, LM261-04, LM2678S-12, LM317T, LM75CIMX-5, LQW15AN2N7C00D, LTC1735EGN, LTST-C150JRKT, LVC16244A, LX128EV-32F208C, LY61L256, M220Z1-L10, M25PE20-VMN6TP, M27C1001

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: M27C256B-80XF6":

Post Date Part Number Brand D/C Desc Qty Company

Mon Jan 16 05:50:00 UTC 2012 M27C256B-80XF6 (from hkin.com) ST 07+/08+ DIP 1560 Hongkong Booyi Technology Limited

Mon Jan 16 05:50:00 UTC 2012 M27C256B-80XF6 (from standard server 2) ST 07+/08+ DIP 1560 Hongkong Booyi Technology Limited

Mon Jan 16 05:50:00 UTC 2012 M27C256B-80XF6 (from parts server 2) ST 07+/08+ DIP 1560 Hongkong Booyi Technology Limited

Mon Jan 16 05:50:00 UTC 2012 M27C256B-80XF6 (from hkin.com 2) ST 07+/08+ DIP 1560 Hongkong Booyi Technology Limited

Mon Jan 16 05:50:00 UTC 2012 M27C256B-80XF6 (from hkin.com 2) ST 07+/08+ DIP 1560 Hongkong Booyi Technology Limited

Last record M27C1001:

Post Date	Part Number	Brand	D/C	Desc	Qty	Company
Mon Jan 16 05:50:00 UTC 2012	M27C1001-35F1 (from hkin.com)	ST	07+/08+	DIP	2400	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-45F1 (from hkin.com)	ST	07+/08+	DIP	2400	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-60F1 (from hkin.com)	ST	07+/08+	DIP	2400	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-70F1 (from hkin.com)	ST	07+/08+	DIP	2400	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-80F1 (from hkin.com)	ST	07+/08+	DIP	2400	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-90F1 (from hkin.com)	ST	07+/08+	DIP	2400	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-10F1 (from hkin.com)	ST	07+/08+	DIP	7200	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-12F1 (from hkin.com)	ST	07+/08+	DIP	7200	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-15F1 (from hkin.com)	ST	07+/08+	DIP	7200	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-20F1 (from hkin.com)	ST	07+/08+	DIP	7200	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-25F1 (from hkin.com)	ST	07+/08+	DIP	7200	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-45XF1 (from hkin.com)	ST	07+/08+	DIP	2400	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-70XF1 (from hkin.com)	ST	07+/08+	DIP	2400	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-80XF1 (from hkin.com)	ST	07+/08+	DIP	2400	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-35F6 (from hkin.com)	ST	07+/08+	DIP	2880	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-45F6 (from hkin.com)	ST	07+/08+	DIP	2880	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-60F6 (from hkin.com)	ST	07+/08+	DIP	2880	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-70F6 (from hkin.com)	ST	07+/08+	DIP	2880	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-80F6 (from hkin.com)	ST	07+/08+	DIP	2880	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-90F6 (from hkin.com)	ST	07+/08+	DIP	2880	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-10F6 (from hkin.com)	ST	07+/08+	DIP	2880	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-12F6 (from hkin.com)	ST	07+/08+	DIP	2880	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-15F6 (from hkin.com)	ST	07+/08+	DIP	2880	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-20F6 (from hkin.com)	ST	07+/08+	DIP	2880	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-25F6 (from hkin.com)	ST	07+/08+	DIP	2880	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-45XF6 (from hkin.com)	ST	07+/08+	DIP	2400	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-70XF6 (from hkin.com)	ST	07+/08+	DIP	2400	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-80XF6 (from hkin.com)	ST	07+/08+	DIP	2400	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-35F3 (from hkin.com)	ST	07+/08+	DIP	1920	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-45F3 (from hkin.com)	ST	07+/08+	DIP	1920	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-60F3 (from hkin.com)	ST	07+/08+	DIP	1920	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-70F3 (from hkin.com)	ST	07+/08+	DIP	1920	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-80F3 (from hkin.com)	ST	07+/08+	DIP	1920	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-90F3 (from hkin.com)	ST	07+/08+	DIP	1920	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-10F3 (from hkin.com)	ST	07+/08+	DIP	1920	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-12F3 (from hkin.com)	ST	07+/08+	DIP	1920	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-15F3 (from hkin.com)	ST	07+/08+	DIP	1920	Hongkong Booyi Technology Limited
Fri Jan 13 03:02:00 UTC 2012	M27C1001-10F1 (from hkin.com)	ST		CDIP	5200	Yat Nang Technology
Mon Jan 16 05:50:00 UTC 2012	M27C1001-25F3 (from hkin.com)	ST	07+/08+	DIP	1920	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-45XF3 (from hkin.com)	ST	07+/08+	DIP	1920	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-70XF3 (from hkin.com)	ST	07+/08+	DIP	1920	Hongkong Booyi Technology Limited
Mon Jan 16 05:50:00 UTC 2012	M27C1001-80XF3 (from hkin.com)	ST	07+/08+	DIP	1920	Hongkong Booyi Technology Limited
Mon Jan 16 05:14:00 UTC 2012	M27C1001-12F (from hkin.com)	ST	2000+	DIP	864	Homsun Technology (H.K.) Limited
Mon Jan 16 05:14:00 UTC 2012	M27C1001-12F1 (from hkin.com)	ST	2000+	DIP	2000	Homsun Technology (H.K.) Limited
Mon Jan 16 08:37:00 UTC 2012	M27C1001-20F1 (from hkin.com)	ST	2009+	DIP	2000	Hengguang (HK) Electronics Trading Limited
Mon Jan 16 08:37:00 UTC 2012	M27C1001-70XF1 (from hkin.com)	ST	2009+	DIP	1500	Hengguang (HK) Electronics Trading Limited
Mon Jan 16 08:37:00 UTC 2012	M27C1001-45F1 (from hkin.com)	ST	2009+	DIP	1800	Hengguang (HK) Electronics Trading Limited
Mon Jan 16 08:37:00 UTC 2012	M27C1001-12F1 (from hkin.com)	ST	2008+	DIP	2000	Hengguang (HK) Electronics Trading Limited
Sat Dec 31 08:46:00 UTC 2011	M27C1001 (from hkin.com)	ST	09+	DIP	2000	Lexian Electronic Technology International Co., Limited
Sun Dec 25 05:22:00 UTC 2011	M27C1001-12F1 (from hkin.com)	ST	O836	DIP	640	Wintac Global Limited
Sun Dec 25 05:22:00 UTC 2011	M27C1001-15F1 (from hkin.com)	ST	9418	DIP	616	Wintac Global Limited

Last record M25PE20-VMN6TP:

Post Date	Part Number	Brand	D/C	Desc	Qty	Company
Mon Jan 16 05:40:00 UTC 2012	M25PE20-VMN6TP (from hkin.com)	NUMONYX	2010+	ORIGINAL	15000	Glory Venture Chips Company
Fri Jan 13 08:14:00 UTC 2012	M25PE20-VMN6TP (from hkin.com)	Numonyx	2010	2.5K/REEL	15000	Wintrus Tech (HK) Co.,Limited

Last record M220Z1-L10:

Post Date	Part Number	Brand	D/C	Desc	Qty	Company
Mon Jan 9 08:37:00 UTC 2012	M220Z1-L10 (from hkin.com)	CHIMEI	10+	22" LCD	1000	Zhengda Tech (HK) Limited
Tue Jan 10 10:09:00 UTC 2012	M220Z1-L10 (from hkin.com)	CMO		in stock	1200	Shen Zhen OML Technology Co.,Ltd

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M27C256B-80XF6,M27C256B-80XF6,Comments from user about M27C256B-80XF6: Heat generated by electronic circuitry must be dissipated to prevent immediate failure and improve long term reliability. Other embedded uses of 4-bit and 8-bit microprocessors, such as terminals, printers, various kinds of automation etc. An electronic circuit consisting entirely of passive components is called a passive circuit (and has the same properties as a passive component). The MOSFET is particularly suited to this configuration because its positive thermal coefficient of resistance tends to balance current between individual devices. An electric field can increase the number of free electrons and holes in a semiconductor, thereby changing its conductivity. As of 2009, dual-core and quad-core processors are widely used in servers, workstations and PCs while six and eight-core processors will be available for high-end applications in both the home and professional environments. This effect is called electroluminescence and the color of the light (corresponding to the energy of the photon) is determined by the energy gap of the semiconductor. Unlike what happened when IA-32 was extended to x86-64, no new general purpose registers were added in 64-bit PowerPC, so any performance gained when using the 64-bit mode for applications making no use of the larger address space is minimal. Anything related to :M27C256B-80XF6, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: M27C256B-80XF6, search hkinventory: M27C256B-80XF6, It is an example of sequential digital logic, as it has internal memory. Produced at Fairchild Semiconductor, it was made of silicon, whereas Kilby's chip was made of germanium. In 1986, HP released its first system with a PA-RISC CPU. IEEE standard 1076. Datasheet Dir, DataSheet Archive
A digital signal processor (DSP) is specialized for signal processing. Bipolar junction transistors are formed from two p-n junctions, in either n-p-n or p-n-p configuration. As clock speeds increase the depth of the pipeline increases with it, and some modern processors may have 20 stages or more. This indicates the variety of filter (see above) and the center or corner frequencies. Transistorized mechatronic circuits have replaced electromechanical devices in controlling appliances and machinery. The integrated circuit's mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. Digital circuits are the most common physical representation of Boolean algebra and are the basis of all digital computers.2 added better handling of real and complex data types.
any passive component and active component such as:Diode, The move to 64 bits by PowerPC processors had been intended since the processors' design in the early 90s and was not a major cause of incompatibility. Microcontrollers integrate a microprocessor with periphal devices for control of embedded system. Notch filters ?attenuation of certain frequencies while allowing all others to pass. One rarely finds modern circuits that are entirely analog. For example driver circuit
M27C256B-80XF6,M27C256B-80XF6,Comments from user about M27C256B-80XF6: Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. This includes decisions on the performance-level and connectivity of these peripherals. Cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time. VHDL is commonly used to write text models that describe a logic circuit. A light-emitting diode (LED) is a semiconductor light source. The junctions which form where n-type and p-type semiconductors join together are called p-n junctions. With this structure, one of the connections of the device is located on the bottom of the semiconductor die. For notch filters, the degree to which unwanted signals at the notch frequency must be rejected determines the accuracy of the components, but not the Q, which is governed by desired steepness of the notch, i. Anything related to :M27C256B-80XF6, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: M27C256B-80XF6See also: