Part: GWDD105-0202A001D5BD-03

Index Files

Offer Index 34

MURATA,
ROHM,
IR,
NXP,
CY,
SAMSUNG,
NIPPON CHEMI-CON,
VISHAY,
NEC,
FSC,
INTEL,
MICROCHIP,
POWER,
MICRON,
PHI,
MOT,
FUJI,
FREESCALE,
DALLAS,
LINEAR,
MIT,
ALLEGRO,
AVX,
SANYO,
RENESAS,
BB,
AMD,
BROADCOM,
PANASONIC,
VICOR,
SIEMENS,
BOURNS,
YAGEO,
MPS,
SHARP,
MIC,
AVAGO,
IXYS,
ISSI,
ERICSSON,
LAMBDA,
HYNIX,
INTERSIL,
MICREL,
TDK,
HIT,
EUPEC,
NVIDIA,
REALTEK,
PERICOM,
SILICON,
SEMIKRON,
NUVOTON,
NICHICON,
ABB,
COOPER,
LITTELFUSE,
LG,
MURATAPS,
COILCRAFT,
LATTICE,
MOLEX,
FUJITSU,
ATI,
ISD/NUVOTON,
MURATA PS,
SANKEN,
BSI,
EPSON,
SST,
EPCOS,
KEC,
LUCENT,
AGILENT,
ORSAM,
AUO,
BCD,
OSRAM,
WINBOND,
SIPEX,
ST/NXP,
BGA,
IDT,
SPANSION,
KEMET,
LGD,
TRACOPOWE,
NUMONYX,
NATIONAL,
TI,
INFINEON,
ST,
AD,
XILINX,
ON,
MAX,
NS,
ATMEL,
TOS,
ALTERA,
MURATA,
ROHM,
IR,
NXP,
CY,
SAMSUNG,
NIPPON CHEMI-CON,
VISHAY,
NEC,
FSC,
INTEL,
MICROCHIP,
POWER,
MICRON,
PHI,
MOT,
FUJI,
FREESCALE,
DALLAS,
LINEAR,
MIT,
ALLEGRO,
AVX,
SANYO,
RENESAS,
BB,
AMD,
BROADCOM,
PANASONIC,
VICOR,
SIEMENS,
BOURNS,
YAGEO,
MPS,
SHARP,
MIC,
AVAGO,
IXYS,
ISSI,
ERICSSON,
LAMBDA,
HYNIX,
INTERSIL,
MICREL,
TDK,
HIT,
EUPEC,
NVIDIA,
REALTEK,
PERICOM,
SILICON,
SEMIKRON,
NUVOTON,
NICHICON,
ABB,
COOPER,
LITTELFUSE,
LG,
MURATAPS,
COILCRAFT,
LATTICE,
MOLEX,
FUJITSU,
ATI,
ISD/NUVOTON,
MURATA PS,
SANKEN,
BSI,
EPSON,
SST,
EPCOS,
KEC,
LUCENT,
AGILENT,
ORSAM,
AUO,
BCD,
OSRAM,
WINBOND,
SIPEX,
ST/NXP,
BGA,
IDT,
SPANSION,
KEMET,
LGD,
TRACOPOWE,
NUMONYX,
NATIONAL,
TI

 
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Product Summary
格稜股份有限公司 GWDD105-0202A001D5BD-03
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: GWDD105-0202A001D5BD-03.


Available from: United Sources Industrial Enterprises
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:TDA4663T, TNY263GN, W24L257AK-15, XC9572, RG82845, MJ11015, 6DI30A-050, CM8888SI, LM170E03-TLH1, LMS800KF04, CY7C68001-56PVXC, NL128102BM29-05A, P420HVN01 V0, MN101D02DEB, 1SS353T, ADJ3A

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: GWDD105-0202A001D5BD-03":

Post DatePart NumberBrandD/CDescQtyCompany
Fri Feb 3 01:42:00 UTC 2012GWDD105-0202A001D5BD-03 (from hkin.com)格稜股份有限公司WAFER CON. (R) SMD/90 1.25mm 1*2P PHY=0.4mm W/ GOLD FLASH GWDD105-0202A001D5BD-03 GREENCONN965United Sources Industrial Enterprises
Fri Feb 3 01:42:00 UTC 2012GWDD105-0202A001D5BD-03 (from standard server 2)格稜股份有限公司WAFER CON. (R) SMD/90 1.25mm 1*2P PHY=0.4mm W/ GOLD FLASH GWDD105-0202A001D5BD-03 GREENCONN965United Sources Industrial Enterprises
Fri Feb 3 01:42:00 UTC 2012GWDD105-0202A001D5BD-03 (from parts server 2)格稜股份有限公司WAFER CON. (R) SMD/90 1.25mm 1*2P PHY=0.4mm W/ GOLD FLASH GWDD105-0202A001D5BD-03 GREENCONN965United Sources Industrial Enterprises
Fri Feb 3 01:42:00 UTC 2012GWDD105-0202A001D5BD-03 (from hkin.com 2)格稜股份有限公司WAFER CON. (R) SMD/90 1.25mm 1*2P PHY=0.4mm W/ GOLD FLASH GWDD105-0202A001D5BD-03 GREENCONN965United Sources Industrial Enterprises
Fri Feb 3 01:42:00 UTC 2012GWDD105-0202A001D5BD-03 (from hkin.com 2)格稜股份有限公司WAFER CON. (R) SMD/90 1.25mm 1*2P PHY=0.4mm W/ GOLD FLASH GWDD105-0202A001D5BD-03 GREENCONN965United Sources Industrial Enterprises

Last record ADJ3A:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Feb 4 01:02:00 UTC 2012ADJ3A (from hkin.com)AD09+MSSOP4500Zhengxinyuan Electronics (HK) Co., Limited

Last record 1SS353T:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Jan 31 06:37:00 UTC 20121SS353T (from hkin.com)ROHM52000Luasin Technology (HK) Company

Last record MN101D02DEB:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Feb 1 03:26:00 UTC 2012MN101D02DEB (from hkin.com)松下02+LQFP4440Faishing Electronic Technology (HK) Limited

If you want to find more about GWDD105-0202A001D5BD-03, please visit us on HKin


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The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to precisely control the location and concentration of p- and n-type dopants. MOSFET is an IC which is semiconductor device. In addition to IEEE standard 1164, several child standards were introduced to extend functionality of the language. They are also called power devices or when used in integrated circuits, called power ICs. In this case, it might be possible to use VHDL to write a testbench to verify the functionality of the design using files on the host computer to define stimuli, to interact with the user, and to compare results with those expected. With the vertical structure, the current rating of the device is proportional to its area, and the voltage blocking capability is achieved in the height of the die. Alternatively, additional logic can be added to a simple transparent latch to make it non-transparent or opaque when another input (an "enable" input) is not asserted. Style, price, specification and performance are all relevant.
any passive component and active component such as:Diode, Products not traditionally associated with computer use (such as TVs or Hi-Fi equipment) now provide options to connect to the Internet or to a computer using a home network to provide access to digital content. Although the MOSFET is named in part for its "metal" gate, in modern devices polysilicon is typically used instead. That is, input signal changes cause immediate changes in output; when several transparent latches follow each other, using the same clock signal, signals can propagate through all of them at once. The circuit can be made to change state by signals applied to one or more control inputs and will have one or two outputs. For example driver circuit
GWDD105-0202A001D5BD-03,GWDD105-0202A001D5BD-03,Comments from user about GWDD105-0202A001D5BD-03: The integration of a whole CPU onto a single chip or on a few chips greatly reduced the cost of processing power. In addition, passive circuits will not necessarily be stable under all stability criteria. The move to 64 bits by PowerPC processors had been intended since the processors' design in the early 90s and was not a major cause of incompatibility. Integrated circuits are used in virtually all electronic equipment today and have revolutionized the world of electronics. Cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time. Key changes include incorporation of child standards (1164, 1076.2, 1076.3) into the main 1076 standard, an extended set of operators, more flexible syntax of case and generate statements, incorporation of VHPI (interface to C/C++ languages) and a subset of PSL (Property Specification Language). General-purpose microprocessors in personal computers are used for computation, text editing, multimedia display, and communication over the Internet. The middle, or base, region between the junctions is typically very narrow. Anything related to :GWDD105-0202A001D5BD-03, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: GWDD105-0202A001D5BD-03See also: