Part: P89LPC9361F

Index Files Offer Index 32 NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, FSC, CY, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, IR, FUJI, MICRON, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MOT, NEC, AMD, BRIGHT, PHI, SANYO, ROHM, BROADCOM, RENESAS, STMICROELECTRONICS, DALLAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, AVAGO, KEMET, HARVATEK, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, TDK, FUJITSU, ISSI, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, SEIKO, KOA KAOHSIUNG CORPORATION, ELPIDA, EPCOS, TRACO, CIRRUS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, SST, AUO, BB/TI, CREE, IC, SILICON, EVERLIGHT, QFN, ABB, SONY, EPSON, RECTRON, SIPEX, DIODES, CJ(CHINA), SPANSION, AOS, ALLEGRO, NXP/PHI, STACKPOLE TECHNOLOGY, INC., WINBOND, CONEXANT, ASTEC, MXIC, TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, NEC, AMD, BRIGHT, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, AVAGO, MIT, KEMET, HARVATEK, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, TDK, ISSI, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, SST, AUO, BB/TI, CREE, IC, SILICON, EVERLIGHT, ABB, QFN, SONY, EPSON, RECTRON, SIPEX, CJ(CHINA), AOS, ALLEGRO, NXP/PHI, SPANSION, STACKPOLE TECHNOLOGY, INC., WINBOND, CONEXANT, ASTEC, REALTEK, TI , TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, NEC, AMD, BRIGHT, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, AVAGO, MIT, KEMET, HARVATEK, ISSI, MOLEX, COOPER, MICREL, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, SST, AUO, BB/TI, CREE, IC, SILICON, BCD, EVERLIGHT, ABB, QFN, SONY, EPSON, RECTRON, SIPEX, CJ(CHINA), AOS, ALLEGRO, NXP/PHI, SPANSION, STACKPOLE TECHNOLOGY, INC., CONEXANT, ASTEC, TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, MURATA, TOS, PANASONIC, ON, INFINEON, VISHAY, AVX, FUJI, IR, FREESCALE, LINEAR, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, AMD, BRIGHT, NEC, PHI, BROADCOM, ROHM, STMICROELECTRONICS, SANYO, DALLAS, SHARP, RENESAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, KEMET, AVAGO, HARVATEK, ISSI, MOLEX, COOPER, MICREL, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, IDT, HYNIX, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, SST, AUO, BB/TI, CREE, IC, SILICON, BCD, EVERLIGHT, ABB, QFN, EPSON, RECTRON, POWER, SONY, CJ(CHINA), AOS, NXP/PHI, SIPEX, SPANSION, STACKPOLE TECHNOLOGY, INC., ASTEC, ALLEGRO, TI , TI, AD, ST, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, MURATA, TOS, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, FREESCALE, LINEAR, NVIDIA, SEMIKRON, MICRON, LATTICE, AMD, MOT, BRIGHT, NEC, PHI, BROADCOM, ROHM, DALLAS, STMICROELECTRONICS, SANYO, ALLEGRO, SHARP, RENESAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, KEMET, AVAGO, ISSI, HARVATEK, MOLEX, MICREL, COOPER, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, INNOLUX, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, SST, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, AUO, BB/TI, SILICON, CREE, IC, BB, BCD, EVERLIGHT, ABB, POWER, QFN, EPSON, RECTRON, SPANSION, SONY, CJ(CHINA), AOS, NXP/PHI, SIPEX, STACKPOLE TECHNOLOGY, INC., TI, AD, ST, MAX, ALTERA, ATMEL, NXP, NS, XILINX, INTEL, MICROCHIP, SAMSUNG, CY, FSC, ON, MURATA, TOS, PANASONIC, INFINEON, VISHAY, IR, AVX, FREESCALE, LINEAR, NVIDIA, LATTICE, MICRON, MOT, SEMIKRON, AMD, NEC, PHI, BROADCOM, ALLEGRO, ROHM, SANYO, DALLAS, FUJI, SHARP, STMICROELECTRONICS, COILCRAFT, RENESAS, YAGEO, INTERSIL, AVAGO, QUALCOMM, HIT, MIT, KEMET, ISSI, HARVATEK, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, ATI, ISD/NUVOTON, FUJITSU, HYNIX, AGILENT, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, TRACO, SEIKO, INNOLUX, BB, ELPIDA, CIRRUS, EPCOS, MPS, SST, SILICON, DIP, EUPEC, RECOM, 模块, POWER, WINBOND, AUO, BB/TI, CREE, IC, EVERLIGHT, BCD, SPANSION, EPSON, SONY, RECTRON, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., COSEL, MXIC, TI, AD, ST, MAX, ALTERA, ATMEL, NXP, NS, XILINX, INTEL, MICROCHIP, CY, SAMSUNG, ON, FSC, MURATA, TOS, INFINEON, PANASONIC, VISHAY, IR, AVX, FREESCALE, LINEAR, NVIDIA, LATTICE, MICRON, MOT, AMD, SEMIKRON, NEC, PHI, BROADCOM, ALLEGRO, ROHM, SANYO, DALLAS, FUJI, SHARP, STMICROELECTRONICS, COILCRAFT, RENESAS, YAGEO, INTERSIL, AVAGO, HIT, QUALCOMM, MIT, ISSI, KEMET, HARVATEK, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, ATI, ISD/NUVOTON, FUJITSU, AGILENT, IDT, BOURNS, LITTELFUSE, HYNIX, KOA KAOHSIUNG CORPORATION, TRACO, BB, SEIKO, INNOLUX, CIRRUS, EPCOS, MPS, SST, SILICON, DIP, EUPEC, RECOM, 模块, POWER, WINBOND, TE CONNECTIVITY , AUO, BB/TI, CREE, IC, EVERLIGHT, BCD, SPANSION, SONY, EPSON, RECTRON, DIODES, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., COSEL, TI, AD, MAX, ALTERA, ST, ATMEL, NXP, NS, MICROCHIP, XILINX, TOS, CY, ON, INFINEON, FSC, INTEL, MURATA, PANASONIC, IR, VISHAY, MICRON, SAMSUNG, AVX, FREESCALE, LINEAR, LATTICE, MOT, SEMIKRON, MIT, NEC, PHI, BROADCOM, ALLEGRO, DALLAS, COILCRAFT, AMD, ROHM, RENESAS, SHARP, FUJI, NVIDIA, STMICROELECTRONICS, YAGEO, AVAGO, INTERSIL, HIT, QUALCOMM, KEMET, HARVATEK, ISSI, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, SANYO, ISD/NUVOTON, AGILENT, FUJITSU, VICOR, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, TRACO, BB, SEIKO, INNOLUX, SONY, CIRRUS, EPCOS, MPS, SILICON, DIP, SST, 模块, POWER, TE CONNECTIVITY , BB/TI, AUO, WINBOND, IC, CREE, EVERLIGHT, ATI, EUPEC, BCD, SPANSION, EPSON, DIODES, AOS, CJ(CHINA), QFN, NXP/PHI, SIPEX, STACKPOLE TECHNOLOGY, INC., MIC, JST, MXIC, TI, AD, MAX, ST, ALTERA, NS, ATMEL, NXP, MICROCHIP, XILINX, TOS, CY, ON, INFINEON, INTEL, FSC, MURATA, PANASONIC, IR, VISHAY, MICRON, SAMSUNG, FREESCALE, AVX, LINEAR, LATTICE, MOT, SEMIKRON, PHI, NEC, RENESAS, MIT, BROADCOM, ALLEGRO, DALLAS, NVIDIA, ROHM, COILCRAFT, AMD, SHARP, FUJI, STMICROELECTRONICS, YAGEO, HIT, INTERSIL, AVAGO, QUALCOMM, ISSI, KEMET, HARVATEK, SUMIDA, MOLEX, MICREL, COOPER, SANYO, TDK, NUVOTON, BB, ISD/NUVOTON, FUJITSU, AGILENT, VICOR, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SONY, TRACO, SEIKO, INNOLUX, CIRRUS, MPS, EPCOS, SST, SILICON, DIP, 模块, POWER, TE CONNECTIVITY , BB/TI, WINBOND, AUO, IC, CREE, EVERLIGHT, ATI, EUPEC, BCD, SPANSION, MIC, EPSON, DIODES, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., HYNIX, MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, TOS, ATMEL, ON, MICROCHIP, INTEL, XILINX, INFINEON, VISHAY, CY, FSC, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, LINEAR, FREESCALE, LATTICE, MOT, AMD, PHI, SEMIKRON, NEC, NVIDIA, RENESAS, BROADCOM, ALLEGRO, ROHM, COILCRAFT, DALLAS, SHARP, AVAGO, YAGEO, HIT, INTERSIL, KEMET, HARVATEK, ISSI, MIT, SANYO, SUMIDA, MOLEX, COOPER, MICREL, QUALCOMM, NUVOTON, BB, ATI, ISD/NUVOTON, TDK, FUJI, FUJITSU, AGILENT, VICOR, BOURNS, EUPEC, LITTELFUSE, KOA KAOHSIUNG CORPORATION, MCP, TRACO, IDT, SEIKO, SONY, INNOLUX, EPCOS, MPS, CIRRUS, SST, SILICON, DIP, RECOM, 模块, POWER, TE CONNECTIVITY , BB/TI, AUO, IC, EVERLIGHT, SPANSION, WINBOND, CREE, MIC, BCD, DIODES, AOS, CJ(CHINA), QFN, NXP/PHI, AT, EPSON, STACKPOLE TECHNOLOGY, INC., MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, TOS, ATMEL, FSC, ON, MICROCHIP, INTEL, XILINX, INFINEON, VISHAY, CY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, AMD, LATTICE, MOT, PHI, SEMIKRON, NEC, NVIDIA, RENESAS, BROADCOM, ALLEGRO, ROHM, COILCRAFT, DALLAS, SHARP, AVAGO, YAGEO, FUJI, HIT, HARVATEK, ISSI, KEMET, MIT, SANYO, INTERSIL, MOLEX, SUMIDA, COOPER, MICREL, QUALCOMM, NUVOTON, BB, ATI, ISD/NUVOTON, TDK, FUJITSU, AGILENT, VICOR, BOURNS, EUPEC, LITTELFUSE, KOA KAOHSIUNG CORPORATION, MCP, SONY, TRACO, IDT, SEIKO, INNOLUX, EPCOS, MPS, CIRRUS, SST, SPANSION, DIP, SILICON, RECOM, 模块, TE CONNECTIVITY , WINBOND, BB/TI, AUO, IC, EVERLIGHT, BCD, CREE, MIC, POWER, DIODES, AOS, HYNIX, CJ(CHINA), QFN, NXP/PHI, AT, EPSON, STACKPOLE TECHNOLOGY, INC., TI, AD, ST, MAX, NS, NXP, ALTERA, ATMEL, FSC, MICROCHIP, ON, TOS, INTEL, XILINX, INFINEON, CY, VISHAY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, MOT, LATTICE, AMD, SEMIKRON, PHI, NEC, IXYS, BROADCOM, ALLEGRO, ROHM, RENESAS, COILCRAFT, AVAGO, DALLAS, SHARP, NVIDIA, YAGEO, FUJI, HIT, 模块, SANYO, HARVATEK, ISSI, KEMET, MIT, INTERSIL, MOLEX, SUMIDA, ATI, COOPER, QUALCOMM, MICREL, NUVOTON, POWER, TDK, BB, ISD/NUVOTON, VICOR, EUPEC, IDT, BOURNS, LITTELFUSE, FUJITSU, SONY, TRACO, KOA KAOHSIUNG CORPORATION, MCP, SEIKO, EPCOS, MPS, SST, SPANSION, SILICON, RECOM, MURATA PS, WINBOND, TE CONNECTIVITY , INNOLUX, BB/TI, EVERLIGHT, IC, BCD, CREE, MIC, CIRRUS, DIODES, AT, QFN, AOS, NXP/PHI, EPSON, STACKPOLE TECHNOLOGY, INC., JST, REALTEK, MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, ATMEL, FSC, MICROCHIP, ON, TOS, INTEL, XILINX, INFINEON, CY, VISHAY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, MOT, SEMIKRON, LATTICE, AMD, PHI, NEC, IXYS, BROADCOM, ALLEGRO, ROHM, RENESAS, AVAGO, COILCRAFT, DALLAS, SHARP, NVIDIA, YAGEO, FUJI, HIT, 模块, MIT, SANYO, HARVATEK, ISSI, KEMET, INTERSIL, MOLEX, SUMIDA, ATI, COOPER, QUALCOMM, MICREL, NUVOTON, POWER, TDK, BB, ISD/NUVOTON, VICOR, EUPEC, IDT, BOURNS, FUJITSU, LITTELFUSE, SONY, TRACO, KOA KAOHSIUNG CORPORATION, MCP, SEIKO, EPCOS, MPS, SST, SPANSION, SILICON, RECOM, MURATA PS, WINBOND, TE CONNECTIVITY , INNOLUX, BB/TI, EVERLIGHT, IC, BCD, CREE, MIC, CIRRUS, DIODES, AT, QFN, AOS, NXP/PHI, EPSON, STACKPOLE TECHNOLOGY, INC., JST, REALTEK, MXIC, TI, AD, ST, MAX, NS, NXP, FSC, MICROCHIP, ATMEL, ALTERA, ON, XILINX, TOS, INFINEON, CY, INTEL, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, IR, FREESCALE, LINEAR, MOT, NEC, SEMIKRON, LATTICE, AMD, ALLEGRO, PHI, BROADCOM, HIT, ROHM, RENESAS, AVAGO, DALLAS, SHARP, YAGEO, FUJI, IXYS, SUMIDA, 模块, MIT, HARVATEK, SANYO, KEMET, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, VICOR, INTERSIL, EUPEC, COILCRAFT, BOURNS, FUJITSU, LITTELFUSE, SONY, TRACO, MCP, SEIKO, IDT, POWER, EPCOS, ATI, ISSI, MPS, SILICON, RECOM, SPANSION, TE CONNECTIVITY , VISHAY DALE, WINBOND, INNOLUX, BB/TI, EVERLIGHT, IC, SST, CREE, BCD, MIC, DIODES, CIRRUS, AT, QFN, AOS, EPSON, JST, AUO, HYNIX, TI , JAE, WCH, TI, AD, ST, MAX, NS, NXP, FSC, MICROCHIP, ATMEL, ALTERA, ON, XILINX, TOS, INFINEON, CY, INTEL, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, IR, FREESCALE, MOT, LINEAR, NEC, SEMIKRON, LATTICE, AMD, ALLEGRO, PHI, BROADCOM, HIT, ROHM, RENESAS, AVAGO, DALLAS, RECOM, SHARP, YAGEO, FUJI, IXYS, SUMIDA, 模块, MIT, HARVATEK, SANYO, KEMET, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, TRACO, VICOR, INTERSIL, EUPEC, COILCRAFT, BOURNS, FUJITSU, LITTELFUSE, SONY, MCP, SEIKO, IDT, POWER, EPCOS, ATI, ISSI, MPS, SILICON, SPANSION, TE CONNECTIVITY , VISHAY DALE, WINBOND, INNOLUX, BB/TI, EVERLIGHT, IC, SST, CREE, BCD, MIC, DIODES, CIRRUS, AT, QFN, AOS, EPSON, JST, AUO, HYNIX, TI , JAE, WCH, TI, AD, ST, MAX, NS, NXP, MICROCHIP, FSC, ATMEL, ALTERA, ON, XILINX, TOS, CY, INTEL, INFINEON, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, IR, LINEAR, MOT, LATTICE, NEC, AMD, ALLEGRO, PHI, SEMIKRON, HIT, BROADCOM, ROHM, RENESAS, DALLAS, RECOM, AVAGO, SHARP, YAGEO, IXYS, FUJI, SUMIDA, 模块, HARVATEK, KEMET, MIT, SANYO, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, TRACO, VICOR, COILCRAFT, INTERSIL, BOURNS, LITTELFUSE, SONY, MCP, EUPEC, SEIKO, POWER, FUJITSU, IDT, ATI, ISSI, MPS, EPCOS, SILICON, SPANSION, TE CONNECTIVITY , VISHAY DALE, INNOLUX, BB/TI, WINBOND, IC, CREE, SST, BCD, DIODES, EVERLIGHT, AT, QFN, MIC, AOS, CIRRUS, EPSON, JST, AUO, TI , JAE, WCH, HYNIX, TI, AD, ST, MAX, NS, NXP, MICROCHIP, FSC, ATMEL, ALTERA, ON, XILINX, TOS, CY, INTEL, INFINEON, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, IR, LINEAR, MOT, LATTICE, NEC, AMD, ALLEGRO, PHI, SEMIKRON, HIT, BROADCOM, ROHM, RENESAS, DALLAS, RECOM, AVAGO, SHARP, YAGEO, IXYS, FUJI, SUMIDA, 模块, HARVATEK, KEMET, MIT, SANYO, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, TRACO, VICOR, COILCRAFT, INTERSIL, BOURNS, LITTELFUSE, SONY, MCP, EUPEC, SEIKO, POWER, FUJITSU, IDT, ATI, ISSI, MPS, EPCOS, SILICON, SPANSION, TE CONNECTIVITY , VISHAY DALE, INNOLUX, BB/TI, WINBOND, IC, CREE, SST, BCD, DIODES, EVERLIGHT, AT, QFN, MIC, AOS, CIRRUS, EPSON, JST, AUO, TI , JAE, WCH, HYNIX, TI, AD, ST, MAX, NS, NXP, MICROCHIP, FSC, ATMEL, ALTERA, ON, XILINX, TOS, CY, INTEL, INFINEON, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, IR, LINEAR, MOT, LATTICE, NEC, AMD, ALLEGRO, PHI, SEMIKRON, HIT, BROADCOM, ROHM, RENESAS, DALLAS, RECOM, AVAGO, SHARP, YAGEO, IXYS, FUJI, SUMIDA, 模块, HARVATEK, KEMET, MIT, SANYO, MOLEX, COOPER, QUALCOMM, MICREL, BB, ISD/NUVOTON, TDK, NVIDIA, TRACO, VICOR, COILCRAFT, INTERSIL, BOURNS, LITTELFUSE, SONY, MCP, EUPEC, SEIKO, POWER, FUJITSU, IDT, ATI, MPS, EPCOS, SILICON, SPANSION, TE CONNECTIVITY , VISHAY DALE, INNOLUX, BB/TI, IC, CREE, SST, DIODES, EVERLIGHT, AT, QFN, MIC, AOS, CIRRUS, EPSON, ISSI, WINBOND, JST, AUO, TI , JAE, WCH, HYNIX, BOSCH, EXAR(SIPEX), TI, AD, ST, MAX, NS, NXP, MICROCHIP, FSC, ATMEL, ALTERA, ON, XILINX, TOS, CY, INTEL, INFINEON, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, IR, LINEAR, MOT, LATTICE, NEC, AMD, PHI, SEMIKRON, HIT, BROADCOM, ROHM, RENESAS, RECOM, AVAGO, DALLAS, SHARP, YAGEO, IXYS, FUJI, SUMIDA, 模块, HARVATEK, KEMET, MIT, SANYO, MOLEX, COOPER, QUALCOMM, MICREL, ISD/NUVOTON, TDK, NVIDIA, TRACO, VICOR, COILCRAFT, INTERSIL, BOURNS, LITTELFUSE, BB, SONY, MCP, EUPEC, ALLEGRO, SEIKO, FUJITSU, POWER, IDT, ATI, MPS, EPCOS, SILICON, SPANSION, TE CONNECTIVITY , VISHAY DALE, INNOLUX, BB/TI, IC, CREE, EVERLIGHT, AT, QFN, MIC, AOS, DIODES, CIRRUS, SST, EPSON, WINBOND, JST, AUO, ISSI, TI , JAE, WCH, BOSCH, HYNIX, EXAR(SIPEX), TI, AD, ST, MAX, NS, NXP, ALTERA, FSC, MICROCHIP, ATMEL, XILINX, ON, TOS, INTEL, CY, INFINEON, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, IR, MOT, LINEAR, NEC, LATTICE, PHI, IXYS, AMD, SEMIKRON, ROHM, BROADCOM, RENESAS, AVAGO, RECOM, DALLAS, SHARP, YAGEO, FUJI, HIT, SUMIDA, 模块, MIT, HARVATEK, SANYO, KEMET, MOLEX, COOPER, QUALCOMM, MICREL, ISD/NUVOTON, TDK, NVIDIA, TRACO, ISSI, VICOR, INTERSIL, COILCRAFT, BOURNS, LITTELFUSE, FUJITSU, BB, SONY, MCP, EUPEC, JRC, SEIKO, ALLEGRO, POWER, MPS, ATI, EPCOS, IDT, SILICON, SST, SPANSION, TE CONNECTIVITY , VISHAY DALE, INNOLUX, BB/TI, IC, CREE, DIODES, EVERLIGHT, AT, QFN, AOS, CIRRUS, MIC, NXP/PHI, WINBOND, EPSON, JST, AUO, TI , ASTEC, HYNIX, JAE, TI, AD, ST, NS, MAX, NXP, FSC, MICROCHIP, ATMEL, ALTERA, XILINX, TOS, ON, INTEL, CY, IR, VISHAY, MURATA, MICRON, INFINEON, PANASONIC, SAMSUNG, FREESCALE, LINEAR, MOT, NEC, LATTICE, PHI, AMD, ROHM, SEMIKRON, BROADCOM, AVAGO, RENESAS, RECOM, DALLAS, HIT, SHARP, YAGEO, AVX, FUJI, SUMIDA, 模块, HARVATEK, MIT, SANYO, COOPER, QUALCOMM, MICREL, ISD/NUVOTON, TDK, NVIDIA, VICOR, TRACO, ISSI, INTERSIL, BOURNS, COILCRAFT, KEMET, FUJITSU, LITTELFUSE, MCP, SEIKO, SONY, JRC, ATI, POWER, MPS, IDT, MOLEX, EPCOS, ALLEGRO, BB, EVERLIGHT, SILICON, SST, SPANSION, VISHAY DALE, INNOLUX, BB/TI, DIODES, IC, CREE, AT, QFN, CIRRUS, NXP/PHI, MIC, AOS, AUO, TI , ASTEC, HYNIX, WCH, EUPEC, IXYS, EPSON, BOSCH, JAE, REALTEK, TI, AD, ST, NS, MAX, NXP, FSC, ATMEL, MICROCHIP, ALTERA, XILINX, TOS, ON, INTEL, INFINEON, IR, CY, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, MOT, LINEAR, NEC, LATTICE, PHI, ROHM, AMD, SEMIKRON, BROADCOM, RENESAS, AVAGO, HIT, RECOM, SHARP, DALLAS, YAGEO, FUJI, 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VISHAY, SEMIKRON, AVX, PANASONIC, MIT, LINEAR, MOT, SHARP, NEC, LATTICE, PHI, ROHM, FREESCALE, BROADCOM, AVAGO, FUJI, DALLAS, HIT, RECOM, YAGEO, RENESAS, WURTH, AMD, IXYS, SUMIDA, 模块, HARVATEK, KEMET, NVIDIA, MICREL, SANYO, IDT, COOPER, INTERSIL, QUALCOMM, TDK, ISD/NUVOTON, TRACO, ISSI, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, SEIKO, SILICON, JRC, MIC, ATI, MPS, EVERLIGHT, MOLEX, EPCOS, VICOR, ALLEGRO, AUO, VISHAY DALE, BB/TI, IC, SST, CREE, POWER, REALTEK, SPANSION, STMICROELECTRONICS, EUPEC, SONY, QFN, CIRRUS, NXP/PHI, AOS, DIODES, BOSCH, HYNIX, TI , EPSON, WCH, ASTEC, JAE, BB, EXAR(SIPEX), TI, AD, ST, XILINX, MAX, NXP, NS, ALTERA, ATMEL, TOS, ON, IR, FSC, MICROCHIP, INFINEON, MURATA, INTEL, CY, MICRON, SAMSUNG, VISHAY, SEMIKRON, AVX, PANASONIC, MIT, LINEAR, NEC, MOT, SHARP, LATTICE, PHI, ROHM, FREESCALE, ALLEGRO, BROADCOM, AVAGO, FUJI, HIT, DALLAS, RECOM, RENESAS, YAGEO, WURTH, AMD, IXYS, SUMIDA, 模块, HARVATEK, KEMET, NVIDIA, IDT, MICREL, SANYO, INTERSIL, COOPER, TDK, QUALCOMM, 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TI , WCH, ASTEC, JAE, BB/TI, JST, EXAR(SIPEX), MXIC, TI, AD, ST, XILINX, MAX, NS, ATMEL, ALTERA, NXP, FSC, TOS, MICROCHIP, IR, MURATA, ON, INFINEON, INTEL, CY, MICRON, SAMSUNG, VISHAY, AVX, SEMIKRON, MPS, MIT, LINEAR, NEC, SHARP, LATTICE, MOT, PHI, HIT, PANASONIC, FREESCALE, BROADCOM, ROHM, AVAGO, FUJI, ALLEGRO, DALLAS, RECOM, RENESAS, YAGEO, WURTH, AMD, SUMIDA, KEMET, HARVATEK, NVIDIA, IDT, MICREL, SANYO, COOPER, MOLEX, QUALCOMM, TDK, INTERSIL, ISD/NUVOTON, TRACO, ISSI, VICOR, IXYS, BOURNS, COILCRAFT, LITTELFUSE, EUPEC, SILICON, SEIKO, JRC, ATI, FUJITSU, EVERLIGHT, MIC, EPCOS, CREE, VISHAY DALE, SPANSION, SST, IC, REALTEK, AUO, HYNIX, STMICROELECTRONICS, POWER, SONY, CIRRUS, DIODES, QFN, NXP/PHI, BOSCH, AOS, EPSON, TI , WCH, ASTEC, JAE, BB/TI, JST, EXAR(SIPEX), MXIC, TI, ST, XILINX, AD, MAX, NS, ATMEL, ALTERA, MICROCHIP, FSC, NXP, TOS, MURATA, ON, INFINEON, IR, INTEL, MICRON, CY, SAMSUNG, VISHAY, AVX, SEMIKRON, MIT, LINEAR, NEC, SHARP, LATTICE, MOT, MPS, FUJI, PHI, HIT, PANASONIC, FREESCALE, ROHM, AVAGO, BROADCOM, ALLEGRO, DALLAS, RECOM, YAGEO, RENESAS, WURTH, SANYO, HARVATEK, KEMET, NVIDIA, IDT, MICREL, COOPER, EUPEC, QUALCOMM, MOLEX, TDK, AMD, INTERSIL, ISD/NUVOTON, TRACO, ISSI, IXYS, BOURNS, COILCRAFT, LITTELFUSE, SEIKO, JRC, ATI, EVERLIGHT, SOLE AGENCY, FUJITSU, MIC, VICOR, CREE, EPCOS, SST, SILICON, IC, REALTEK, STMICROELECTRONICS, AUO, POWER, DIODES, QFN, NXP/PHI, SONY, AOS, BOSCH, LAMBDA, HYNIX, TE CONNECTIVITY , EPSON, SPANSION, TI , ASTEC, JAE, BB/TI, JST, EXAR(SIPEX), MXIC, WINBOND, TI, ST, XILINX, AD, MAX, NS, ATMEL, ALTERA, MICROCHIP, FSC, NXP, TOS, MURATA, ON, INFINEON, IR, INTEL, MICRON, CY, SAMSUNG, VISHAY, AVX, SEMIKRON, MIT, LINEAR, NEC, SHARP, LATTICE, MOT, MPS, FUJI, PHI, HIT, PANASONIC, FREESCALE, ROHM, AVAGO, BROADCOM, ALLEGRO, DALLAS, RECOM, YAGEO, RENESAS, WURTH, SANYO, HARVATEK, KEMET, NVIDIA, IDT, MICREL, COOPER, EUPEC, QUALCOMM, MOLEX, TDK, AMD, INTERSIL, ISD/NUVOTON, TRACO, ISSI, IXYS, BOURNS, COILCRAFT, LITTELFUSE, SEIKO, JRC, ATI, EVERLIGHT, SOLE AGENCY, FUJITSU, MIC, VICOR, CREE, EPCOS, SST, SILICON, IC, REALTEK, STMICROELECTRONICS, AUO, POWER, DIODES, QFN, NXP/PHI, SONY, AOS, BOSCH, LAMBDA, HYNIX, TE CONNECTIVITY , EPSON, SPANSION, TI , ASTEC, JAE, BB/TI, JST, EXAR(SIPEX), MXIC, WINBOND, TI, ST, XILINX, AD, MAX, NS, ATMEL, ALTERA, MICROCHIP, NXP, FSC, TOS, MURATA, ON, INFINEON, INTEL, IR, MICRON, CY, SAMSUNG, VISHAY, AVX, SEMIKRON, MIT, LINEAR, NEC, SHARP, LATTICE, MOT, MPS, PHI, HIT, PANASONIC, AVAGO, ROHM, BROADCOM, ALLEGRO, FUJI, FREESCALE, RECOM, DALLAS, YAGEO, RENESAS, EUPEC, WURTH, SANYO, HARVATEK, KEMET, NVIDIA, IDT, MICREL, COOPER, QUALCOMM, MOLEX, TDK, AMD, INTERSIL, ISD/NUVOTON, TRACO, ISSI, IXYS, BOURNS, COILCRAFT, LITTELFUSE, SEIKO, JRC, ATI, EVERLIGHT, SOLE AGENCY, FUJITSU, MIC, VICOR, CREE, EPCOS, SST, SILICON, IC, REALTEK, STMICROELECTRONICS, AUO, DIODES, POWER, QFN, SONY, NXP/PHI, AOS, BOSCH, HYNIX, SPANSION, TE CONNECTIVITY , EPSON, TI , ASTEC, JAE, BB/TI, JST, EXAR(SIPEX), MXIC, SIEMENS, WINBOND, TI, ST, XILINX, AD, MAX, NS, ATMEL, ALTERA, MICROCHIP, NXP, FSC, TOS, MURATA, ON, INFINEON, INTEL, IR, MICRON, VISHAY, CY, SAMSUNG, AVX, SEMIKRON, LINEAR, MIT, LATTICE, MOT, NEC, MPS, FREESCALE, PHI, PANASONIC, HIT, AVAGO, ROHM, BROADCOM, SHARP, ALLEGRO, FUJI, RECOM, DALLAS, YAGEO, RENESAS, WURTH, EUPEC, SANYO, KEMET, HARVATEK, NVIDIA, IDT, MICREL, COOPER, QUALCOMM, MOLEX, TDK, AMD, INTERSIL, ISD/NUVOTON, TRACO, ISSI, IXYS, BOURNS, COILCRAFT, LITTELFUSE, MICROSEMI, SEIKO, JRC, ATI, EVERLIGHT, SOLE AGENCY, FUJITSU, MIC, VICOR, CREE, EPCOS, SST, SILICON, IC, REALTEK, DIODES, STMICROELECTRONICS, QFN, SONY, NXP/PHI, POWER, AOS, BOSCH, HYNIX, SPANSION, TE CONNECTIVITY , EPSON, TI , ASTEC, BB/TI, JAE, MCC, JST, EXAR(SIPEX), MXIC, SIEMENS, TI, ST, XILINX, AD, MAX, NS, ATMEL, ALTERA, MICROCHIP, TOS, NXP, FSC, MURATA, ON, INFINEON, IR, INTEL, MICRON, VISHAY, CY, SAMSUNG, PANASONIC, SEMIKRON, AVX, MIT, FUJI, LINEAR, LATTICE, NEC, MOT, MPS, FREESCALE, PHI, HIT, SHARP, AVAGO, ROHM, 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Google Search Product Summary NXP P89LPC9361F This is an offer provided by HKin.com member. In stock! Order now! Category: Electronic Components. Product #: P89LPC9361F. Available from: Faishing Electronic Technology (HK) Limited Condition: in excellent condition In stock! Order now! Part Numbers Previous Parts:STM8306, TLP627-4, TLS2300ZQMRG4, TMS320DM6437ZWT6, TNY264G, TPS64201DBVR, W78C032C40DL, XC4052XLA-08BG432C, EP3C25F324C8, AD7811YRU, RX3310A, 293D105X9020A2TE3, LM2832ZMY, PS2801-1, MC74VHC1GU04DTT1, N79E8132AS16 (+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: P89LPC9361F": Post Date Part Number Brand D/C Desc Qty Company Tue Apr 23 02:12:00 UTC 2013 P89LPC9361F (from standard server 2) NXP 11+ TSSOP-28 12000 Faishing Electronic Technology (HK) Limited Tue Apr 23 02:12:00 UTC 2013 P89LPC9361F (from parts server 2) NXP 11+ TSSOP-28 12000 Faishing Electronic Technology (HK) Limited Tue Apr 23 02:12:00 UTC 2013 P89LPC9361F (from hkin.com 2) NXP 11+ TSSOP-28 12000 Faishing Electronic Technology (HK) Limited Tue Apr 23 02:12:00 UTC 2013 P89LPC9361F (from hkin.com 2) NXP 11+ TSSOP-28 12000 Faishing Electronic Technology (HK) Limited Tue Apr 23 02:12:00 UTC 2013 P89LPC9361FDH (from standard server 2) NXP 11+ TSSOP 15000 Faishing Electronic Technology (HK) Limited Tue Apr 23 02:12:00 UTC 2013 P89LPC9361FDH (from parts server 2) NXP 11+ TSSOP 15000 Faishing Electronic Technology (HK) Limited Tue Apr 23 02:12:00 UTC 2013 P89LPC9361FDH (from hkin.com 2) NXP 11+ TSSOP 15000 Faishing Electronic Technology (HK) Limited Tue Apr 23 02:12:00 UTC 2013 P89LPC9361FDH (from hkin.com 2) NXP 11+ TSSOP 15000 Faishing Electronic Technology (HK) Limited Last record N79E8132AS16: Post Date Part Number Brand D/C Desc Qty Company Last record MC74VHC1GU04DTT1: Post Date Part Number Brand D/C Desc Qty Company Last record PS2801-1: Post Date Part Number Brand D/C Desc Qty Company If you want to find more about P89LPC9361F, please visit us on HKin vid:offerengine20130524 Part Number Prefix P89LPC9361F,P89LPC9361F,Comments from user about P89LPC9361F: In June 2006, the VHDL Technical Committee of Accellera (delegated by IEEE to work on the next update of the standard) approved so called Draft 3. While this required extra logic to handle, for example, carry and overflow within each slice, the result was a system that could handle, say, 32-bit words using integrated circuits with a capacity for only 4 bits each. A microprocessor control program can be easily tailored to different needs of a product line, allowing upgrades in performance with minimal redesign of the product. Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies, made possible by the low cost of production of integrated circuits. For example, GPUs through the 1990s were mostly non-programmable and have only recently gained limited facilities like programmable vertex shaders. This equation is linear with respect to temperature. However, most designers leave this job to the simulator. A power diode or MOSFET operates on similar principles to its low-power counterpart, but is able to carry a larger amount of current and typically is able to support a larger reverse-bias voltage in the off-state. Anything related to :P89LPC9361F, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: P89LPC9361F, search hkinventory: P89LPC9361F, Semiconductor devices are manufactured both as single discrete devices and as integrated circuits (ICs), which consist of a numberfrom a few (as low as two) to billionsof devices manufactured and interconnected on a single semiconductor substrate. Each logic gate is in turn represented by a circuit diagram describing the connections of the transistors used to implement it in some particular logic family. Some common power devices are the power diode, thyristor, power MOSFET and IGBT. Modern designs have rather complex statistical prediction systems, which watch the results of past branches to predict the future with greater accuracy. Datasheet Dir, DataSheet Archive They are commonly used in speaker crossover design (due to the moderately large voltages and currents, and the lack of easy access to power), filters in power distribution networks (due to the large voltages and currents), power supply bypassing (due to low cost, and in some cases, power requirements), as well as a variety of discrete and home brew circuits (for low-cost and simplicity). In reality one side or the other of the branch will be called much more often than the other. An electric field can increase the number of free electrons and holes in a semiconductor, thereby changing its conductivity. The circuit can be made to change state by signals applied to one or more control inputs and will have one or two outputs. Keeping up with Moore's Law is becoming increasingly challenging as chip-making technologies approach their physical limits. Many products include Internet connectivity using technologies such as Wi-Fi, Bluetooth or Ethernet. A multi-core processor is simply a single chip containing more than one microprocessor core. Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. any passive component and active component such as:1N4148, or 6502 Generally, processor speed has increased more rapidly than external memory speed, so cache memory is necessary if the processor is not to be delayed by slower external memory. When used in a finite-state machine, the output and next state depend not only on its current input, but also on its current state (and hence, previous inputs.) It can also be used for counting of pulses, and for synchronizing variably-timed input signals to some reference timing signal. Most of them should not be used in linear operation. The pipelined datapath is the most commonly used datapath design in microarchitecture today. For example driver circuit P89LPC9361F,P89LPC9361F,Comments from user about P89LPC9361F: 1 (known as VHDL-AMS) provided analog and mixed-signal circuit design extensions. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using electronic components.hn, which are optimized for distribution of HD content between CE devices in a home. These diagrams generally separate the datapath (where data is placed) and the control path (which can be said to steer the data). Semiconductor components benefit from Moore's Law, an observed principle which states that, for a given price, semiconductor functionality doubles every two years. In this circuit the base terminal of the transistor serves as the input, the collector is the output, and the emitter is common to both (for example, it may be tied to ground reference or a power supply rail), hence its name. While 64-bit microprocessor designs have been in use in several markets since the early 1990s, the early 2000s saw the introduction of 64-bit microprocessors targeted at the PC market. Alternatively, additional logic can be added to a simple transparent latch to make it non-transparent or opaque when another input (an "enable" input) is not asserted. Anything related to :P89LPC9361F, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: P89LPC9361FSee also: Capacitor Transistor Diode