Part: OPA337NA/3K

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Previous Parts:OP16BIFJ,OP17CJ,OP200AZ883,OP200EZ,OP220FJ,OP227EY,OP297GS,OP42G,OP470GP,OP496G,OP497GPZ,OP77GP,OPA131U,OPA2347UA,OPA234UA,OPA237NA/3KG4

The followings are offers provided by our member in Electronic Components Offer site about the following parts: OPA337NA/3K":

Post DatePart NumberBrandD/CDescQtyCompany
Fri Sep 29 07:23:00 UTC 2006OPA337NA/3K (from hkin.com)BB02+new and original732Guang Dar Development Co.
Fri Sep 29 07:23:00 UTC 2006OPA337NA/3K (from standard server 2)BB02+new and original732Guang Dar Development Co.
Fri Sep 29 07:23:00 UTC 2006OPA337NA/3K (from parts server 2)BB02+new and original732Guang Dar Development Co.
Fri Sep 29 07:23:00 UTC 2006OPA337NA/3K (from hkin.com 2)BB02+new and original732Guang Dar Development Co.
Fri Sep 29 07:23:00 UTC 2006OPA337NA/3K (from hkin.com 2)BB02+new and original732Guang Dar Development Co.
Tue Sep 12 09:15:00 UTC 2006OPA337NA/3KG4 (from hkin.com)TI2006SOT23-56400NAM FUNG GROUPS(HK) ELECTRONICS LIMITED
Tue Sep 12 09:15:00 UTC 2006OPA337NA/3KG4 (from standard server 2)TI2006SOT23-56400NAM FUNG GROUPS(HK) ELECTRONICS LIMITED
Tue Sep 12 09:15:00 UTC 2006OPA337NA/3KG4 (from parts server 2)TI2006SOT23-56400NAM FUNG GROUPS(HK) ELECTRONICS LIMITED
Tue Sep 12 09:15:00 UTC 2006OPA337NA/3KG4 (from hkin.com 2)TI2006SOT23-56400NAM FUNG GROUPS(HK) ELECTRONICS LIMITED
Tue Sep 12 09:15:00 UTC 2006OPA337NA/3KG4 (from hkin.com 2)TI2006SOT23-56400NAM FUNG GROUPS(HK) ELECTRONICS LIMITED

Last record OPA237NA/3KG4:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 12 09:15:00 UTC 2006OPA237NA/3KG4 (from hkin.com)TI2006SOT23-54100NAM FUNG GROUPS(HK) ELECTRONICS LIMITED

Last record OPA234UA:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 19 02:18:00 UTC 2006OPA234UA (from hkin.com)BBSOP8312PROTECH (HONGKONG) ELECTRONICS LIMITED
Fri Sep 29 07:23:00 UTC 2006OPA234UA (from hkin.com)BB04+new and original1451Guang Dar Development Co.

Last record OPA2347UA:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 19 02:18:00 UTC 2006OPA2347UA (from hkin.com)BBSOP8342PROTECH (HONGKONG) ELECTRONICS LIMITED
Fri Sep 22 06:22:00 UTC 2006OPA2347UA (from hkin.com)100QINYUAN ELECTRONICS (HK) LIMITED

If you want to find more about OPA337NA/3K, please visit us on HKin


vid:offerengine20111021

OPA337NA/3K,OPA337NA/3K,Comments from user about OPA337NA/3K: However, many formational and functional block parameters can be tuned (capacity parameters, memory size, element base, block composition and interconnection structure). Often logic "0" will be a lower voltage and referred to as "Low" while logic "1" is referred to as "High". Different features can be implemented in different models of a product line at negligible production cost. MOSFET is an IC which is semiconductor device. Like Ada, VHDL is strongly typed and is not case sensitive. In electronics, a common-emitter amplifier is one of three basic single-stage bipolar-junction-transistor (BJT) amplifier topologies, typically used as a voltage amplifier. These include large and small household appliances, cars (and their accessory equipment units), car keys, tools and test instruments, toys, light switches/dimmers and electrical circuit breakers, smoke alarms, battery packs, and hi-fi audio/visual components (from DVD players to phonograph turntables.) Such products as cellular telephones, DVD video system and ATSC HDTV broadcast system fundamentally require consumer devices with powerful, low-cost, microprocessors. They are also called power devices or when used in integrated circuits, called power ICs. Anything related to :OPA337NA/3K, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: OPA337NA/3K, search hkinventory: OPA337NA/3K, MOSFET is an IC which is semiconductor device. Often logic "0" will be a lower voltage and referred to as "Low" while logic "1" is referred to as "High". Microcontrollers integrate a microprocessor with periphal devices for control of embedded system. These techniques use convection, conduction, & radiation of heat energy. Datasheet Dir, DataSheet Archive
A problem not solved by this edition, however, was "multi-valued logic", where a signal's drive strength (none, weak or strong) and unknown values are also considered. A microprocessor control program can be easily tailored to different needs of a product line, allowing upgrades in performance with minimal redesign of the product. A capacitor is a passive electronic component consisting of a pair of conductors separated by a dielectric (insulator). As of 2007, two 64-bit RISC architectures are still produced in volume for non-embedded applications: SPARC and Power ISA. Similarly, an overdriven transistor amplifier can take on the characteristics of a controlled switch having essentially two levels of output. For quantities that vary polynomially or logarithmically with temperature, it may be possible to calculate a temperature coefficient that is a useful approximation for a certain range of temperatures. In principle, a single microarchitecture could execute several different ISAs with only minor changes to the microcode. In 1986, HP released its first system with a PA-RISC CPU.
any passive component and active component such as:Diode, Digital Signal Processors are another example. Generally, in datasheets, turn-off energy is mentioned as a measured parameter and one has to multiply that number with the switching frequency of the intended application to estimate the turn-off loss., the power must be disconnected from the device. Alternatively, additional logic can be added to a simple transparent latch to make it non-transparent or opaque when another input (an "enable" input) is not asserted. For example driver circuit
OPA337NA/3K,OPA337NA/3K,Comments from user about OPA337NA/3K: When there is a potential difference (voltage) across the conductors, a static electric field develops across the dielectric, causing positive charge to collect on one plate and negative charge on the other plate. Depending on the type of carrier in the channel, the device may be an n-channel (for electrons) or a p-channel (for holes) MOSFET. Furthermore, much less material is used to construct a packaged IC die than to construct a discrete circuit. It has already completely replaced the bipolar transistor in power applications, and the availability of power modules (in which several IGBT dice are connected in parallel) makes it attractive for power levels up to several megawatts, pushing further the limit where thyristors and GTOs become the only option. Compared to the MOSFET, the operating frequency of the IGBT is relatively low (few devices are rated over 50 kHz), mainly because of a so-called 'current-tail' problem during turn-off. Additional features were added to the processor architecture; more on-chip registers speeded up programs, and complex instructions could be used to make more compact programs. These days analog circuitry may use digital or even microprocessor techniques to improve performance. These units perform the operations or calculations of the processor. Anything related to :OPA337NA/3K, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: OPA337NA/3KSee also: