Part: MG200J2YS45

Index Files Offer Index 30 HIT, HARVATEK, AVAGO, KEMET, INTERSIL, COOPER, MOLEX, MICREL, ATI, ISD/NUVOTON, TDK, FUJITSU, AGILENT, HYNIX, ISSI, IDT, COILCRAFT, EUPEC, BOURNS, LITTELFUSE, SEIKO, TE, ELPIDA, CIRRUS, TRACO, SONY, EPCOS, MPS, SST, RECOM, LAMBDA, BB, CREE, AUO, IC, SILICON, EVERLIGHT, QFN, CJ(CHINA), EPSON, SIPEX, DIODES, IXYS, NXP/PHI, BB/TI, ASTEC, ALLEGRO, SPANSION, AOS, POWER, CONEXANT, TI , FTDI, MXIC, VICOR, TI, AD, ST, ALTERA, XILINX, NS, ATMEL, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, MURATA, PANASONIC, TOS, ON, AVX, IR, INFINEON, VISHAY, LINEAR, NVIDIA, FUJI, LATTICE, MICRON, BRIGHT, AMD, FREESCALE, MOT, 模块, PHI, BROADCOM, NEC, SEMIKRON, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, QUALCOMM, HIT, MIT, HARVATEK, KEMET, AVAGO, COOPER, MOLEX, INTERSIL, MICREL, ATI, ISD/NUVOTON, TDK, AGILENT, ISSI, BOURNS, HYNIX, COILCRAFT, IDT, LITTELFUSE, FUJITSU, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, MPS, SONY, EPCOS, RECOM, SST, LAMBDA, EPSON, AUO, CREE, IC, BB, SILICON, EVERLIGHT, QFN, CJ(CHINA), NXP/PHI, DIODES, SIPEX, STACKPOLE TECHNOLOGY, INC., ASTEC, BB/TI, MXIC, POWER, AOS, SPANSION, TI , ALLEGRO, FTDI, IXYS, REALTEK, VICOR, TI, AD, ST, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, TOS, MURATA, ON, PANASONIC, IR, AVX, VISHAY, INFINEON, LINEAR, FREESCALE, NVIDIA, FUJI, MICRON, LATTICE, AMD, BRIGHT, MOT, PHI, NEC, BROADCOM, SANYO, ROHM, SEMIKRON, STMICROELECTRONICS, RENESAS, DALLAS, SHARP, YAGEO, INTERSIL, QUALCOMM, HIT, MIT, HARVATEK, KEMET, AVAGO, MOLEX, MICREL, COOPER, ATI, ISD/NUVOTON, TDK, ISSI, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, CIRRUS, TRACO, MPS, POWER, AOS, SST, EPCOS, SONY, DIP, EPSON, SIPEX, RECOM, 模块, LAMBDA, EUPEC, AUO, IC, BB, CREE, QFN, SILICON, EVERLIGHT, SPANSION, CJ(CHINA), DIODES, NXP/PHI, STACKPOLE TECHNOLOGY, INC., MXIC, ASTEC, BB/TI, WINBOND, ALLEGRO, TI , FTDI, TI, ST, AD, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, TOS, MURATA, ON, PANASONIC, VISHAY, INFINEON, AVX, FUJI, IR, MICRON, LINEAR, FREESCALE, NVIDIA, LATTICE, SEMIKRON, MOT, BRIGHT, AMD, NEC, PHI, SANYO, ROHM, BROADCOM, STMICROELECTRONICS, RENESAS, SHARP, DALLAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, AVAGO, HARVATEK, KEMET, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, ISSI, TDK, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, CIRRUS, TRACO, MPS, AOS, EPCOS, POWER, DIP, LAMBDA, SIPEX, RECOM, 模块, EUPEC, BB/TI, SST, AUO, CREE, IC, EVERLIGHT, QFN, SILICON, ABB, RECTRON, EPSON, CJ(CHINA), DIODES, SONY, NXP/PHI, STACKPOLE TECHNOLOGY, INC., SPANSION, ASTEC, WINBOND, ALLEGRO, TI , CONEXANT, TI, ST, AD, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, FSC, CY, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, IR, FUJI, MICRON, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MOT, NEC, AMD, BRIGHT, PHI, SANYO, ROHM, BROADCOM, RENESAS, STMICROELECTRONICS, DALLAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, AVAGO, KEMET, HARVATEK, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, TDK, FUJITSU, ISSI, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, SEIKO, KOA KAOHSIUNG CORPORATION, ELPIDA, EPCOS, TRACO, CIRRUS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, SST, AUO, BB/TI, CREE, IC, SILICON, EVERLIGHT, QFN, ABB, SONY, EPSON, RECTRON, SIPEX, DIODES, CJ(CHINA), SPANSION, AOS, ALLEGRO, NXP/PHI, STACKPOLE TECHNOLOGY, INC., WINBOND, CONEXANT, ASTEC, MXIC, TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, NEC, AMD, BRIGHT, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, AVAGO, MIT, KEMET, HARVATEK, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, TDK, ISSI, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, SST, AUO, BB/TI, CREE, IC, SILICON, EVERLIGHT, ABB, QFN, SONY, EPSON, RECTRON, SIPEX, CJ(CHINA), AOS, ALLEGRO, NXP/PHI, SPANSION, STACKPOLE TECHNOLOGY, INC., WINBOND, CONEXANT, ASTEC, REALTEK, TI , TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, NEC, AMD, BRIGHT, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, AVAGO, MIT, KEMET, HARVATEK, ISSI, MOLEX, COOPER, MICREL, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, SST, AUO, BB/TI, CREE, IC, SILICON, BCD, EVERLIGHT, ABB, QFN, SONY, EPSON, RECTRON, SIPEX, CJ(CHINA), AOS, ALLEGRO, NXP/PHI, SPANSION, STACKPOLE TECHNOLOGY, INC., CONEXANT, ASTEC, TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, MURATA, TOS, PANASONIC, ON, INFINEON, VISHAY, AVX, FUJI, IR, FREESCALE, LINEAR, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, AMD, BRIGHT, NEC, PHI, BROADCOM, ROHM, STMICROELECTRONICS, SANYO, DALLAS, SHARP, RENESAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, KEMET, AVAGO, HARVATEK, ISSI, MOLEX, COOPER, MICREL, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, IDT, HYNIX, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, SST, AUO, BB/TI, CREE, IC, SILICON, BCD, EVERLIGHT, ABB, QFN, EPSON, RECTRON, POWER, SONY, CJ(CHINA), AOS, NXP/PHI, SIPEX, SPANSION, STACKPOLE TECHNOLOGY, INC., ASTEC, ALLEGRO, TI , TI, AD, ST, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, MURATA, TOS, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, FREESCALE, LINEAR, NVIDIA, SEMIKRON, MICRON, LATTICE, AMD, MOT, BRIGHT, NEC, PHI, BROADCOM, ROHM, DALLAS, STMICROELECTRONICS, SANYO, ALLEGRO, SHARP, RENESAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, KEMET, AVAGO, ISSI, HARVATEK, MOLEX, MICREL, COOPER, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, INNOLUX, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, SST, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, AUO, BB/TI, SILICON, CREE, IC, BB, BCD, EVERLIGHT, ABB, POWER, QFN, EPSON, RECTRON, SPANSION, SONY, CJ(CHINA), AOS, NXP/PHI, SIPEX, STACKPOLE TECHNOLOGY, INC., TI, AD, ST, MAX, ALTERA, ATMEL, NXP, NS, XILINX, INTEL, MICROCHIP, SAMSUNG, CY, FSC, ON, MURATA, TOS, PANASONIC, INFINEON, VISHAY, IR, AVX, FREESCALE, LINEAR, NVIDIA, LATTICE, MICRON, MOT, SEMIKRON, AMD, NEC, PHI, BROADCOM, ALLEGRO, ROHM, SANYO, DALLAS, FUJI, SHARP, STMICROELECTRONICS, COILCRAFT, RENESAS, YAGEO, INTERSIL, AVAGO, QUALCOMM, HIT, MIT, KEMET, ISSI, HARVATEK, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, ATI, ISD/NUVOTON, FUJITSU, HYNIX, AGILENT, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, TRACO, SEIKO, INNOLUX, BB, ELPIDA, CIRRUS, EPCOS, MPS, SST, SILICON, DIP, EUPEC, RECOM, 模块, POWER, WINBOND, AUO, BB/TI, CREE, IC, EVERLIGHT, BCD, SPANSION, EPSON, SONY, RECTRON, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., COSEL, MXIC, TI, AD, ST, MAX, ALTERA, ATMEL, NXP, NS, XILINX, INTEL, MICROCHIP, CY, SAMSUNG, ON, FSC, MURATA, TOS, INFINEON, PANASONIC, VISHAY, IR, AVX, FREESCALE, LINEAR, NVIDIA, LATTICE, MICRON, MOT, AMD, SEMIKRON, NEC, PHI, BROADCOM, ALLEGRO, ROHM, SANYO, DALLAS, FUJI, SHARP, STMICROELECTRONICS, COILCRAFT, RENESAS, YAGEO, INTERSIL, AVAGO, HIT, QUALCOMM, MIT, ISSI, KEMET, HARVATEK, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, ATI, ISD/NUVOTON, FUJITSU, AGILENT, IDT, BOURNS, LITTELFUSE, HYNIX, KOA KAOHSIUNG CORPORATION, TRACO, BB, SEIKO, INNOLUX, CIRRUS, EPCOS, MPS, SST, SILICON, DIP, EUPEC, RECOM, 模块, POWER, WINBOND, TE CONNECTIVITY , AUO, BB/TI, CREE, IC, EVERLIGHT, BCD, SPANSION, SONY, EPSON, RECTRON, DIODES, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., COSEL, TI, AD, MAX, ALTERA, ST, ATMEL, NXP, NS, MICROCHIP, XILINX, TOS, CY, ON, INFINEON, FSC, INTEL, MURATA, PANASONIC, IR, VISHAY, MICRON, SAMSUNG, AVX, FREESCALE, LINEAR, LATTICE, MOT, SEMIKRON, MIT, NEC, PHI, BROADCOM, ALLEGRO, DALLAS, COILCRAFT, AMD, ROHM, RENESAS, SHARP, FUJI, NVIDIA, STMICROELECTRONICS, YAGEO, AVAGO, INTERSIL, HIT, QUALCOMM, KEMET, HARVATEK, ISSI, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, SANYO, ISD/NUVOTON, AGILENT, FUJITSU, VICOR, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, TRACO, BB, SEIKO, INNOLUX, SONY, CIRRUS, EPCOS, MPS, SILICON, DIP, SST, 模块, POWER, TE CONNECTIVITY , BB/TI, AUO, WINBOND, IC, CREE, EVERLIGHT, ATI, EUPEC, BCD, SPANSION, EPSON, DIODES, AOS, CJ(CHINA), QFN, NXP/PHI, SIPEX, STACKPOLE TECHNOLOGY, INC., MIC, JST, MXIC, TI, AD, MAX, ST, ALTERA, NS, ATMEL, NXP, MICROCHIP, XILINX, TOS, CY, ON, INFINEON, INTEL, FSC, MURATA, PANASONIC, IR, VISHAY, MICRON, SAMSUNG, FREESCALE, AVX, LINEAR, LATTICE, MOT, SEMIKRON, PHI, NEC, RENESAS, MIT, BROADCOM, ALLEGRO, DALLAS, NVIDIA, ROHM, COILCRAFT, AMD, SHARP, FUJI, STMICROELECTRONICS, YAGEO, HIT, INTERSIL, AVAGO, QUALCOMM, ISSI, KEMET, HARVATEK, SUMIDA, MOLEX, MICREL, COOPER, SANYO, TDK, NUVOTON, BB, ISD/NUVOTON, FUJITSU, AGILENT, VICOR, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SONY, TRACO, SEIKO, INNOLUX, CIRRUS, MPS, EPCOS, SST, SILICON, DIP, 模块, POWER, TE CONNECTIVITY , BB/TI, WINBOND, AUO, IC, CREE, EVERLIGHT, ATI, EUPEC, BCD, SPANSION, MIC, EPSON, DIODES, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., HYNIX, MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, TOS, ATMEL, ON, MICROCHIP, INTEL, XILINX, INFINEON, VISHAY, CY, FSC, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, LINEAR, FREESCALE, LATTICE, MOT, AMD, PHI, SEMIKRON, NEC, NVIDIA, RENESAS, BROADCOM, ALLEGRO, ROHM, COILCRAFT, DALLAS, SHARP, AVAGO, YAGEO, HIT, INTERSIL, KEMET, HARVATEK, ISSI, MIT, SANYO, SUMIDA, MOLEX, COOPER, MICREL, QUALCOMM, NUVOTON, BB, ATI, ISD/NUVOTON, TDK, FUJI, FUJITSU, AGILENT, VICOR, BOURNS, EUPEC, LITTELFUSE, KOA KAOHSIUNG CORPORATION, MCP, TRACO, IDT, SEIKO, SONY, INNOLUX, EPCOS, MPS, CIRRUS, SST, SILICON, DIP, RECOM, 模块, POWER, TE CONNECTIVITY , BB/TI, AUO, IC, EVERLIGHT, SPANSION, WINBOND, CREE, MIC, BCD, DIODES, AOS, CJ(CHINA), QFN, NXP/PHI, AT, EPSON, STACKPOLE TECHNOLOGY, INC., MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, TOS, ATMEL, FSC, ON, MICROCHIP, INTEL, XILINX, INFINEON, VISHAY, CY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, AMD, LATTICE, MOT, PHI, SEMIKRON, NEC, NVIDIA, RENESAS, BROADCOM, ALLEGRO, ROHM, COILCRAFT, DALLAS, SHARP, AVAGO, YAGEO, FUJI, HIT, HARVATEK, ISSI, KEMET, MIT, SANYO, INTERSIL, MOLEX, SUMIDA, COOPER, MICREL, QUALCOMM, NUVOTON, BB, ATI, ISD/NUVOTON, TDK, FUJITSU, AGILENT, VICOR, BOURNS, EUPEC, LITTELFUSE, KOA KAOHSIUNG CORPORATION, MCP, SONY, TRACO, IDT, SEIKO, INNOLUX, EPCOS, MPS, CIRRUS, SST, SPANSION, DIP, SILICON, RECOM, 模块, TE CONNECTIVITY , WINBOND, BB/TI, AUO, IC, EVERLIGHT, BCD, CREE, MIC, POWER, DIODES, AOS, HYNIX, CJ(CHINA), QFN, NXP/PHI, AT, EPSON, STACKPOLE TECHNOLOGY, INC., TI, AD, ST, MAX, NS, NXP, ALTERA, ATMEL, FSC, MICROCHIP, ON, TOS, INTEL, XILINX, INFINEON, CY, VISHAY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, MOT, LATTICE, AMD, SEMIKRON, PHI, NEC, IXYS, BROADCOM, ALLEGRO, ROHM, RENESAS, COILCRAFT, AVAGO, DALLAS, SHARP, NVIDIA, YAGEO, FUJI, HIT, 模块, SANYO, HARVATEK, ISSI, KEMET, MIT, INTERSIL, MOLEX, SUMIDA, ATI, COOPER, QUALCOMM, MICREL, NUVOTON, POWER, TDK, BB, ISD/NUVOTON, VICOR, EUPEC, IDT, BOURNS, LITTELFUSE, FUJITSU, SONY, TRACO, KOA KAOHSIUNG CORPORATION, MCP, SEIKO, EPCOS, MPS, SST, SPANSION, SILICON, RECOM, MURATA PS, WINBOND, TE CONNECTIVITY , INNOLUX, BB/TI, EVERLIGHT, IC, BCD, CREE, MIC, CIRRUS, DIODES, AT, QFN, AOS, NXP/PHI, EPSON, STACKPOLE TECHNOLOGY, INC., JST, REALTEK, MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, ATMEL, FSC, MICROCHIP, ON, TOS, INTEL, XILINX, INFINEON, CY, VISHAY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, MOT, SEMIKRON, LATTICE, AMD, PHI, NEC, IXYS, BROADCOM, ALLEGRO, ROHM, RENESAS, AVAGO, COILCRAFT, DALLAS, SHARP, NVIDIA, YAGEO, FUJI, HIT, 模块, MIT, SANYO, HARVATEK, ISSI, KEMET, INTERSIL, MOLEX, SUMIDA, ATI, COOPER, QUALCOMM, MICREL, NUVOTON, POWER, TDK, BB, ISD/NUVOTON, VICOR, EUPEC, IDT, BOURNS, FUJITSU, LITTELFUSE, SONY, TRACO, KOA KAOHSIUNG CORPORATION, MCP, SEIKO, EPCOS, MPS, SST, SPANSION, SILICON, RECOM, MURATA PS, WINBOND, TE CONNECTIVITY , INNOLUX, BB/TI, EVERLIGHT, IC, BCD, CREE, MIC, CIRRUS, DIODES, AT, QFN, AOS, NXP/PHI, EPSON, STACKPOLE TECHNOLOGY, INC., JST, REALTEK, MXIC, TI, AD, ST, MAX, NS, NXP, FSC, MICROCHIP, ATMEL, ALTERA, ON, XILINX, TOS, INFINEON, CY, INTEL, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, IR, FREESCALE, LINEAR, MOT, NEC, SEMIKRON, LATTICE, AMD, ALLEGRO, PHI, BROADCOM, HIT, ROHM, RENESAS, AVAGO, DALLAS, SHARP, YAGEO, FUJI, IXYS, SUMIDA, 模块, MIT, HARVATEK, SANYO, KEMET, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, VICOR, INTERSIL, EUPEC, COILCRAFT, BOURNS, FUJITSU, LITTELFUSE, SONY, TRACO, MCP, SEIKO, IDT, POWER, EPCOS, ATI, ISSI, MPS, SILICON, RECOM, SPANSION, TE CONNECTIVITY , VISHAY DALE, WINBOND, INNOLUX, BB/TI, EVERLIGHT, IC, SST, CREE, BCD, MIC, DIODES, CIRRUS, AT, QFN, AOS, EPSON, JST, AUO, HYNIX, TI , JAE, WCH, TI, AD, ST, MAX, NS, NXP, FSC, MICROCHIP, ATMEL, ALTERA, ON, XILINX, TOS, INFINEON, CY, INTEL, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, IR, FREESCALE, MOT, LINEAR, NEC, SEMIKRON, LATTICE, AMD, ALLEGRO, PHI, BROADCOM, HIT, ROHM, RENESAS, AVAGO, DALLAS, RECOM, SHARP, YAGEO, FUJI, IXYS, SUMIDA, 模块, MIT, HARVATEK, SANYO, KEMET, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, TRACO, VICOR, INTERSIL, EUPEC, COILCRAFT, BOURNS, FUJITSU, LITTELFUSE, SONY, MCP, SEIKO, IDT, POWER, EPCOS, ATI, ISSI, MPS, SILICON, SPANSION, TE CONNECTIVITY , VISHAY DALE, WINBOND, INNOLUX, BB/TI, EVERLIGHT, IC, SST, CREE, BCD, MIC, DIODES, CIRRUS, AT, QFN, AOS, EPSON, JST, AUO, HYNIX, TI , JAE, WCH, TI, AD, ST, MAX, NS, NXP, MICROCHIP, FSC, ATMEL, ALTERA, ON, XILINX, TOS, CY, INTEL, INFINEON, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, IR, LINEAR, MOT, LATTICE, NEC, AMD, ALLEGRO, PHI, SEMIKRON, HIT, BROADCOM, ROHM, RENESAS, DALLAS, RECOM, AVAGO, SHARP, YAGEO, IXYS, FUJI, SUMIDA, 模块, HARVATEK, KEMET, MIT, SANYO, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, TRACO, VICOR, COILCRAFT, INTERSIL, BOURNS, LITTELFUSE, SONY, MCP, EUPEC, SEIKO, POWER, FUJITSU, IDT, ATI, ISSI, MPS, EPCOS, SILICON, SPANSION, TE CONNECTIVITY , VISHAY DALE, INNOLUX, BB/TI, WINBOND, IC, CREE, SST, BCD, DIODES, EVERLIGHT, AT, QFN, MIC, AOS, CIRRUS, EPSON, JST, AUO, TI , JAE, WCH, HYNIX, TI, AD, ST, MAX, NS, NXP, MICROCHIP, FSC, ATMEL, ALTERA, ON, XILINX, TOS, CY, INTEL, INFINEON, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, IR, LINEAR, MOT, LATTICE, NEC, AMD, ALLEGRO, PHI, SEMIKRON, HIT, BROADCOM, ROHM, RENESAS, DALLAS, RECOM, AVAGO, SHARP, YAGEO, IXYS, FUJI, SUMIDA, 模块, HARVATEK, KEMET, MIT, SANYO, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, TRACO, VICOR, COILCRAFT, INTERSIL, BOURNS, LITTELFUSE, SONY, MCP, EUPEC, SEIKO, POWER, FUJITSU, IDT, ATI, ISSI, MPS, EPCOS, SILICON, SPANSION, TE CONNECTIVITY , VISHAY DALE, INNOLUX, BB/TI, WINBOND, IC, CREE, SST, BCD, DIODES, EVERLIGHT, AT, QFN, MIC, AOS, CIRRUS, EPSON, JST, AUO, TI , JAE, WCH, HYNIX, TI, AD, ST, MAX, NS, NXP, MICROCHIP, FSC, ATMEL, ALTERA, ON, XILINX, TOS, CY, INTEL, INFINEON, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, IR, LINEAR, MOT, LATTICE, NEC, AMD, ALLEGRO, PHI, SEMIKRON, HIT, BROADCOM, ROHM, RENESAS, DALLAS, RECOM, AVAGO, SHARP, YAGEO, IXYS, FUJI, SUMIDA, 模块, HARVATEK, KEMET, MIT, SANYO, MOLEX, COOPER, QUALCOMM, MICREL, BB, ISD/NUVOTON, TDK, NVIDIA, 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Google Search Product Summary TOSHIBA MG200J2YS45 This is an offer provided by HKin.com member. In stock! Order now! Category: Electronic Components. Product #: MG200J2YS45. Available from: Kingrole Industry (Hongkong) Limited Condition: in excellent condition In stock! Order now! Part Numbers Previous Parts:IS61C256AL-12TLI, K4M283233H-HN60, L6204D, LM1117MPX-3.3, LM2506GR, LM2595SX-ADJ, LM-261-CY, LMC6042IMX, LTC1344CG, MAX202CSE, AD8571ARZ-REEL, MB90F543G, MC13783VK5, MC9S08QG4CPAE, 2DI50A-120, MCC72-16io1B (+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: MG200J2YS45": Post Date Part Number Brand D/C Desc Qty Company Tue Apr 23 03:35:00 UTC 2013 MG200J2YS45 (from standard server 2) TOSHIBA 9 Kingrole Industry (Hongkong) Limited Tue Apr 23 03:35:00 UTC 2013 MG200J2YS45 (from parts server 2) TOSHIBA 9 Kingrole Industry (Hongkong) Limited Tue Apr 23 03:35:00 UTC 2013 MG200J2YS45 (from hkin.com 2) TOSHIBA 9 Kingrole Industry (Hongkong) Limited Tue Apr 23 03:35:00 UTC 2013 MG200J2YS45 (from hkin.com 2) TOSHIBA 9 Kingrole Industry (Hongkong) Limited Last record MCC72-16io1B: Post Date Part Number Brand D/C Desc Qty Company Last record 2DI50A-120: Post Date Part Number Brand D/C Desc Qty Company Last record MC9S08QG4CPAE: Post Date Part Number Brand D/C Desc Qty Company If you want to find more about MG200J2YS45, please visit us on HKin vid:offerengine20130524 Part Number Prefix MG200J2YS45,MG200J2YS45,Comments from user about MG200J2YS45: Several specialized processing devices have followed from the technology.Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. This is the ratio of the electric charge on each conductor to the potential difference between them. RISC microprocessors were initially used in special-purpose machines and Unix workstations, but then gained wide acceptance in other roles. Semiconductor devices are manufactured both as single discrete devices and as integrated circuits (ICs), which consist of a numberfrom a few (as low as two) to billionsof devices manufactured and interconnected on a single semiconductor substrate. Sun Microsystems has released the Niagara and Niagara 2 chips, both of which feature an eight-core design. This includes decisions on the performance-level and connectivity of these peripherals. An example is the comparator which takes in a continuous range of voltage but only outputs one of two levels as in a digital circuit. Anything related to :MG200J2YS45, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: MG200J2YS45, search hkinventory: MG200J2YS45, For example, GPUs through the 1990s were mostly non-programmable and have only recently gained limited facilities like programmable vertex shaders. The amount of the voltage drop depends on the semiconductor material and the doping concentrations. New microarchitectures and/or circuitry solutions, along with advances in semiconductor manufacturing, are what allows newer generations of processors to achieve higher performance while using the same ISA. Passive filters are still found, however, in hybrid integrated circuits. Datasheet Dir, DataSheet Archive Being created for one element base, a computing device project can be ported on another element base, for example VLSI with various technologies. The Niagara 2 supports more threads and operates at 1. The microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. Flip-flops and latches are used as data storage elements. That is, input signal changes cause immediate changes in output; when several transparent latches follow each other, using the same clock signal, signals can propagate through all of them at once. Sun Microsystems has released the Niagara and Niagara 2 chips, both of which feature an eight-core design. VHDL project is multipurpose. The updated IEEE 1076, in 1993, made the syntax more consistent, allowed more flexibility in naming, extended the character type to allow ISO-8859-1 printable characters, added the xnor operator, etc. any passive component and active component such as:1N4148, or 6502 There are two main advantages of ICs over discrete circuits: cost and performance. Graphics processing units may have no, limited, or general programming facilities. voltage amplifiers or buffer amplifiers. One particular pitfall is the accidental production of transparent latches rather than D-type flip-flops as storage elements The initial version of VHDL, designed to IEEE standard 1076-1987, included a wide range of data types, including numerical (integer and real), logical (bit and boolean), character and time, plus arrays of bit called bit_vector and of character called string. For example driver circuit MG200J2YS45,MG200J2YS45,Comments from user about MG200J2YS45: In 2005, the first personal computer dual-core processors were announced. Advancing technology makes more complex and powerful chips feasible to manufacture. The integration of a whole CPU onto a single chip or on a few chips greatly reduced the cost of processing power. An integrated circuit or monolithic integrated circuit (also referred to as IC, chip, and microchip) is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material. These changes should improve quality of synthesizable VHDL code, make testbenches more flexible, and allow wider use of VHDL for system-level descriptions. Ternary (with three states) logic has been studied, and some prototype computers made. An electronic circuit consisting entirely of passive components is called a passive circuit (and has the same properties as a passive component). Passive filters are still found, however, in hybrid integrated circuits. Anything related to :MG200J2YS45, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: MG200J2YS45See also: Capacitor Transistor Diode