Part: LPC1343FHN

Index Files Offer Index 29 SEIKO, EUPEC, TE, ELPIDA, SONY, TRACO, MPS, POWER, EPCOS, SST, RECOM, ASTEC, CREE, SILICON, IC, EVERLIGHT, CIRRUS, ABB, QFN, BB, CJ(CHINA), EPSON, SIPEX, NXP/PHI, DIODES, ALLEGRO, AOS, IXYS, TI , FTDI, SPANSION, VICOR, JAE, JST, MXIC, CONEXANT, TI, AD, ST, ALTERA, XILINX, NS, MAX, ATMEL, NXP, SAMSUNG, MICROCHIP, INTEL, CY, MURATA, FSC, PANASONIC, TOS, ON, INFINEON, AVX, IR, FUJI, MICRON, LINEAR, LATTICE, SEMIKRON, VISHAY, BRIGHT, 模块, FREESCALE, MIT, NVIDIA, MOT, SANYO, NEC, AMD, BROADCOM, ROHM, STMICROELECTRONICS, PHI, DALLAS, RENESAS, YAGEO, SHARP, QUALCOMM, HIT, HARVATEK, KEMET, AVAGO, COOPER, INTERSIL, MOLEX, MICREL, ISD/NUVOTON, TDK, ISSI, AGILENT, ATI, HYNIX, COILCRAFT, BOURNS, LITTELFUSE, FUJITSU, IDT, SEIKO, EUPEC, TE, ELPIDA, TRACO, CIRRUS, SONY, MPS, EPCOS, RECOM, SST, ASTEC, CREE, AUO, IC, SILICON, ABB, QFN, EVERLIGHT, CJ(CHINA), SIPEX, EPSON, NXP/PHI, DIODES, BB, AOS, POWER, ALLEGRO, IXYS, TI , FTDI, VICOR, JAE, JRC, JST, MXIC, TI, AD, ST, ALTERA, NS, XILINX, MAX, ATMEL, SAMSUNG, NXP, INTEL, MICROCHIP, CY, FSC, MURATA, TOS, PANASONIC, ON, INFINEON, IR, AVX, LINEAR, MICRON, NVIDIA, FUJI, LATTICE, VISHAY, SEMIKRON, FREESCALE, MOT, BRIGHT, AMD, 模块, NEC, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, MIT, SHARP, YAGEO, QUALCOMM, HIT, HARVATEK, AVAGO, KEMET, INTERSIL, COOPER, MOLEX, MICREL, ATI, ISD/NUVOTON, TDK, FUJITSU, AGILENT, HYNIX, ISSI, IDT, COILCRAFT, EUPEC, BOURNS, LITTELFUSE, SEIKO, TE, ELPIDA, CIRRUS, TRACO, SONY, EPCOS, MPS, SST, RECOM, LAMBDA, BB, CREE, AUO, IC, SILICON, EVERLIGHT, QFN, CJ(CHINA), EPSON, SIPEX, DIODES, IXYS, NXP/PHI, BB/TI, ASTEC, ALLEGRO, SPANSION, AOS, POWER, CONEXANT, TI , FTDI, MXIC, VICOR, TI, AD, ST, ALTERA, XILINX, NS, ATMEL, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, MURATA, PANASONIC, TOS, ON, AVX, IR, INFINEON, VISHAY, LINEAR, NVIDIA, FUJI, LATTICE, MICRON, BRIGHT, AMD, FREESCALE, MOT, 模块, PHI, BROADCOM, NEC, SEMIKRON, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, QUALCOMM, HIT, MIT, HARVATEK, KEMET, AVAGO, COOPER, MOLEX, INTERSIL, MICREL, ATI, ISD/NUVOTON, TDK, AGILENT, ISSI, BOURNS, HYNIX, COILCRAFT, IDT, LITTELFUSE, FUJITSU, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, MPS, SONY, EPCOS, RECOM, SST, LAMBDA, EPSON, AUO, CREE, IC, BB, SILICON, EVERLIGHT, QFN, CJ(CHINA), NXP/PHI, DIODES, SIPEX, STACKPOLE TECHNOLOGY, INC., ASTEC, BB/TI, MXIC, POWER, AOS, SPANSION, TI , ALLEGRO, FTDI, IXYS, REALTEK, VICOR, TI, AD, ST, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, TOS, MURATA, ON, PANASONIC, IR, AVX, VISHAY, INFINEON, LINEAR, FREESCALE, NVIDIA, FUJI, MICRON, LATTICE, AMD, BRIGHT, MOT, PHI, NEC, BROADCOM, SANYO, ROHM, SEMIKRON, STMICROELECTRONICS, RENESAS, DALLAS, SHARP, YAGEO, INTERSIL, QUALCOMM, HIT, MIT, HARVATEK, KEMET, AVAGO, MOLEX, MICREL, COOPER, ATI, ISD/NUVOTON, TDK, ISSI, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, CIRRUS, TRACO, MPS, POWER, AOS, SST, EPCOS, SONY, DIP, EPSON, SIPEX, RECOM, 模块, LAMBDA, EUPEC, AUO, IC, BB, CREE, QFN, SILICON, EVERLIGHT, SPANSION, CJ(CHINA), DIODES, NXP/PHI, STACKPOLE TECHNOLOGY, INC., MXIC, ASTEC, BB/TI, WINBOND, ALLEGRO, TI , FTDI, TI, ST, AD, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, TOS, MURATA, ON, PANASONIC, VISHAY, INFINEON, AVX, FUJI, IR, MICRON, LINEAR, FREESCALE, NVIDIA, LATTICE, SEMIKRON, MOT, BRIGHT, AMD, NEC, PHI, SANYO, ROHM, BROADCOM, STMICROELECTRONICS, RENESAS, SHARP, DALLAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, AVAGO, HARVATEK, KEMET, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, ISSI, TDK, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, CIRRUS, TRACO, MPS, AOS, EPCOS, POWER, DIP, LAMBDA, SIPEX, RECOM, 模块, EUPEC, BB/TI, SST, AUO, CREE, IC, EVERLIGHT, QFN, SILICON, ABB, RECTRON, EPSON, CJ(CHINA), DIODES, SONY, NXP/PHI, STACKPOLE TECHNOLOGY, INC., SPANSION, ASTEC, WINBOND, ALLEGRO, TI , CONEXANT, TI, ST, AD, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, FSC, CY, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, IR, FUJI, MICRON, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MOT, NEC, AMD, BRIGHT, PHI, SANYO, ROHM, BROADCOM, RENESAS, STMICROELECTRONICS, DALLAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, AVAGO, KEMET, HARVATEK, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, TDK, FUJITSU, ISSI, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, SEIKO, KOA KAOHSIUNG CORPORATION, ELPIDA, EPCOS, TRACO, CIRRUS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, SST, AUO, BB/TI, CREE, IC, SILICON, EVERLIGHT, QFN, ABB, SONY, EPSON, RECTRON, SIPEX, DIODES, CJ(CHINA), SPANSION, AOS, ALLEGRO, NXP/PHI, STACKPOLE TECHNOLOGY, INC., WINBOND, CONEXANT, ASTEC, MXIC, TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, NEC, AMD, BRIGHT, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, AVAGO, MIT, KEMET, HARVATEK, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, TDK, ISSI, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, SST, AUO, BB/TI, CREE, IC, SILICON, EVERLIGHT, ABB, QFN, SONY, EPSON, RECTRON, SIPEX, CJ(CHINA), AOS, ALLEGRO, NXP/PHI, SPANSION, STACKPOLE TECHNOLOGY, INC., WINBOND, CONEXANT, ASTEC, REALTEK, TI , TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, NEC, AMD, BRIGHT, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, AVAGO, MIT, KEMET, HARVATEK, ISSI, MOLEX, COOPER, MICREL, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, SST, AUO, BB/TI, CREE, IC, SILICON, BCD, EVERLIGHT, ABB, QFN, SONY, EPSON, RECTRON, SIPEX, CJ(CHINA), AOS, ALLEGRO, NXP/PHI, SPANSION, STACKPOLE TECHNOLOGY, INC., CONEXANT, ASTEC, TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, MURATA, TOS, PANASONIC, ON, INFINEON, VISHAY, AVX, FUJI, IR, FREESCALE, LINEAR, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, AMD, BRIGHT, NEC, PHI, BROADCOM, ROHM, STMICROELECTRONICS, SANYO, DALLAS, SHARP, RENESAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, KEMET, AVAGO, HARVATEK, ISSI, MOLEX, COOPER, MICREL, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, IDT, HYNIX, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, SST, AUO, BB/TI, CREE, IC, SILICON, BCD, EVERLIGHT, ABB, QFN, EPSON, RECTRON, POWER, SONY, CJ(CHINA), AOS, NXP/PHI, SIPEX, SPANSION, STACKPOLE TECHNOLOGY, INC., ASTEC, ALLEGRO, TI , TI, AD, ST, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, MURATA, TOS, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, FREESCALE, LINEAR, NVIDIA, SEMIKRON, MICRON, LATTICE, AMD, MOT, BRIGHT, NEC, PHI, BROADCOM, ROHM, DALLAS, STMICROELECTRONICS, SANYO, ALLEGRO, SHARP, RENESAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, KEMET, AVAGO, ISSI, HARVATEK, MOLEX, MICREL, COOPER, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, INNOLUX, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, SST, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, AUO, BB/TI, SILICON, CREE, IC, BB, BCD, EVERLIGHT, ABB, POWER, QFN, EPSON, RECTRON, SPANSION, SONY, CJ(CHINA), AOS, NXP/PHI, SIPEX, STACKPOLE TECHNOLOGY, INC., TI, AD, ST, MAX, ALTERA, ATMEL, NXP, NS, XILINX, INTEL, MICROCHIP, SAMSUNG, CY, FSC, ON, MURATA, TOS, PANASONIC, INFINEON, VISHAY, IR, AVX, FREESCALE, LINEAR, NVIDIA, LATTICE, MICRON, MOT, SEMIKRON, AMD, NEC, PHI, BROADCOM, ALLEGRO, ROHM, SANYO, DALLAS, FUJI, SHARP, STMICROELECTRONICS, COILCRAFT, RENESAS, YAGEO, INTERSIL, AVAGO, QUALCOMM, HIT, MIT, KEMET, ISSI, HARVATEK, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, ATI, ISD/NUVOTON, FUJITSU, HYNIX, AGILENT, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, TRACO, SEIKO, INNOLUX, BB, ELPIDA, CIRRUS, EPCOS, MPS, SST, SILICON, DIP, EUPEC, RECOM, 模块, POWER, WINBOND, AUO, BB/TI, CREE, IC, EVERLIGHT, BCD, SPANSION, EPSON, SONY, RECTRON, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., COSEL, MXIC, TI, AD, ST, MAX, ALTERA, ATMEL, NXP, NS, XILINX, INTEL, MICROCHIP, CY, SAMSUNG, ON, FSC, MURATA, TOS, INFINEON, PANASONIC, VISHAY, IR, AVX, FREESCALE, LINEAR, NVIDIA, LATTICE, MICRON, MOT, AMD, SEMIKRON, NEC, PHI, BROADCOM, ALLEGRO, ROHM, SANYO, DALLAS, FUJI, SHARP, STMICROELECTRONICS, COILCRAFT, RENESAS, YAGEO, INTERSIL, AVAGO, HIT, QUALCOMM, MIT, ISSI, KEMET, HARVATEK, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, ATI, ISD/NUVOTON, FUJITSU, AGILENT, IDT, BOURNS, LITTELFUSE, HYNIX, KOA KAOHSIUNG CORPORATION, TRACO, BB, SEIKO, INNOLUX, CIRRUS, EPCOS, MPS, SST, SILICON, DIP, EUPEC, RECOM, 模块, POWER, WINBOND, TE CONNECTIVITY , AUO, BB/TI, CREE, IC, EVERLIGHT, BCD, SPANSION, SONY, EPSON, RECTRON, DIODES, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., COSEL, TI, AD, MAX, ALTERA, ST, ATMEL, NXP, NS, MICROCHIP, XILINX, TOS, CY, ON, INFINEON, FSC, INTEL, MURATA, PANASONIC, IR, VISHAY, MICRON, SAMSUNG, AVX, FREESCALE, LINEAR, LATTICE, MOT, SEMIKRON, MIT, NEC, PHI, BROADCOM, ALLEGRO, DALLAS, COILCRAFT, AMD, ROHM, RENESAS, SHARP, FUJI, NVIDIA, STMICROELECTRONICS, YAGEO, AVAGO, INTERSIL, HIT, QUALCOMM, KEMET, HARVATEK, ISSI, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, SANYO, ISD/NUVOTON, AGILENT, FUJITSU, VICOR, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, TRACO, BB, SEIKO, INNOLUX, SONY, CIRRUS, EPCOS, MPS, SILICON, DIP, SST, 模块, POWER, TE CONNECTIVITY , BB/TI, AUO, WINBOND, IC, CREE, EVERLIGHT, ATI, EUPEC, BCD, SPANSION, EPSON, DIODES, AOS, CJ(CHINA), QFN, NXP/PHI, SIPEX, STACKPOLE TECHNOLOGY, INC., MIC, JST, MXIC, TI, AD, MAX, ST, ALTERA, NS, ATMEL, NXP, MICROCHIP, XILINX, TOS, CY, ON, INFINEON, INTEL, FSC, MURATA, PANASONIC, IR, VISHAY, MICRON, SAMSUNG, FREESCALE, AVX, LINEAR, LATTICE, MOT, SEMIKRON, PHI, NEC, RENESAS, MIT, BROADCOM, ALLEGRO, DALLAS, NVIDIA, ROHM, COILCRAFT, AMD, SHARP, FUJI, STMICROELECTRONICS, YAGEO, HIT, INTERSIL, AVAGO, QUALCOMM, ISSI, KEMET, HARVATEK, SUMIDA, MOLEX, MICREL, COOPER, SANYO, TDK, NUVOTON, BB, ISD/NUVOTON, FUJITSU, AGILENT, VICOR, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SONY, TRACO, SEIKO, INNOLUX, CIRRUS, MPS, EPCOS, SST, SILICON, DIP, 模块, POWER, TE CONNECTIVITY , BB/TI, WINBOND, AUO, IC, CREE, EVERLIGHT, ATI, EUPEC, BCD, SPANSION, MIC, EPSON, DIODES, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., HYNIX, MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, TOS, ATMEL, ON, MICROCHIP, INTEL, XILINX, INFINEON, VISHAY, CY, FSC, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, LINEAR, FREESCALE, LATTICE, MOT, AMD, PHI, SEMIKRON, NEC, NVIDIA, RENESAS, BROADCOM, ALLEGRO, ROHM, COILCRAFT, DALLAS, SHARP, AVAGO, YAGEO, HIT, INTERSIL, KEMET, HARVATEK, ISSI, MIT, SANYO, SUMIDA, MOLEX, COOPER, MICREL, QUALCOMM, NUVOTON, BB, ATI, ISD/NUVOTON, TDK, FUJI, FUJITSU, AGILENT, VICOR, BOURNS, EUPEC, LITTELFUSE, KOA KAOHSIUNG CORPORATION, MCP, TRACO, IDT, SEIKO, SONY, INNOLUX, EPCOS, MPS, CIRRUS, SST, SILICON, DIP, RECOM, 模块, POWER, TE CONNECTIVITY , BB/TI, AUO, IC, EVERLIGHT, SPANSION, WINBOND, CREE, MIC, BCD, DIODES, AOS, CJ(CHINA), QFN, NXP/PHI, AT, EPSON, STACKPOLE TECHNOLOGY, INC., MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, TOS, ATMEL, FSC, ON, MICROCHIP, INTEL, XILINX, INFINEON, VISHAY, CY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, AMD, LATTICE, MOT, PHI, SEMIKRON, NEC, NVIDIA, RENESAS, BROADCOM, ALLEGRO, ROHM, COILCRAFT, DALLAS, SHARP, AVAGO, YAGEO, FUJI, HIT, HARVATEK, ISSI, KEMET, MIT, SANYO, INTERSIL, MOLEX, SUMIDA, COOPER, MICREL, QUALCOMM, NUVOTON, BB, ATI, ISD/NUVOTON, TDK, FUJITSU, AGILENT, VICOR, BOURNS, EUPEC, LITTELFUSE, KOA KAOHSIUNG CORPORATION, MCP, SONY, TRACO, IDT, SEIKO, INNOLUX, EPCOS, MPS, CIRRUS, SST, SPANSION, DIP, SILICON, RECOM, 模块, TE CONNECTIVITY , WINBOND, BB/TI, AUO, IC, EVERLIGHT, BCD, CREE, MIC, POWER, DIODES, AOS, HYNIX, CJ(CHINA), QFN, NXP/PHI, AT, EPSON, STACKPOLE TECHNOLOGY, INC., TI, AD, ST, MAX, NS, NXP, ALTERA, ATMEL, FSC, MICROCHIP, ON, TOS, INTEL, XILINX, INFINEON, CY, VISHAY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, MOT, LATTICE, AMD, SEMIKRON, PHI, NEC, IXYS, BROADCOM, ALLEGRO, ROHM, RENESAS, COILCRAFT, AVAGO, DALLAS, SHARP, NVIDIA, YAGEO, FUJI, HIT, 模块, SANYO, HARVATEK, ISSI, KEMET, MIT, INTERSIL, MOLEX, SUMIDA, ATI, COOPER, QUALCOMM, MICREL, NUVOTON, POWER, TDK, BB, ISD/NUVOTON, VICOR, EUPEC, IDT, BOURNS, LITTELFUSE, FUJITSU, SONY, TRACO, KOA KAOHSIUNG CORPORATION, MCP, SEIKO, EPCOS, MPS, SST, SPANSION, SILICON, RECOM, MURATA PS, WINBOND, TE CONNECTIVITY , INNOLUX, BB/TI, EVERLIGHT, IC, BCD, CREE, MIC, CIRRUS, DIODES, AT, QFN, AOS, NXP/PHI, EPSON, STACKPOLE TECHNOLOGY, INC., JST, REALTEK, MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, ATMEL, FSC, MICROCHIP, ON, TOS, INTEL, XILINX, INFINEON, CY, VISHAY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, MOT, SEMIKRON, LATTICE, AMD, PHI, NEC, IXYS, BROADCOM, ALLEGRO, ROHM, RENESAS, AVAGO, COILCRAFT, DALLAS, SHARP, NVIDIA, YAGEO, FUJI, HIT, 模块, MIT, SANYO, HARVATEK, ISSI, KEMET, INTERSIL, MOLEX, SUMIDA, ATI, COOPER, QUALCOMM, MICREL, NUVOTON, POWER, TDK, BB, ISD/NUVOTON, VICOR, EUPEC, IDT, BOURNS, FUJITSU, LITTELFUSE, SONY, TRACO, KOA KAOHSIUNG CORPORATION, MCP, SEIKO, EPCOS, MPS, SST, SPANSION, SILICON, RECOM, MURATA PS, WINBOND, TE CONNECTIVITY , INNOLUX, BB/TI, EVERLIGHT, IC, BCD, CREE, MIC, CIRRUS, DIODES, AT, QFN, AOS, NXP/PHI, EPSON, STACKPOLE TECHNOLOGY, INC., JST, REALTEK, MXIC, TI, AD, ST, MAX, NS, NXP, FSC, MICROCHIP, ATMEL, ALTERA, ON, XILINX, TOS, INFINEON, CY, INTEL, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, IR, FREESCALE, LINEAR, MOT, NEC, SEMIKRON, LATTICE, AMD, ALLEGRO, PHI, BROADCOM, HIT, ROHM, RENESAS, AVAGO, DALLAS, SHARP, YAGEO, FUJI, IXYS, SUMIDA, 模块, MIT, HARVATEK, SANYO, KEMET, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, VICOR, INTERSIL, EUPEC, COILCRAFT, BOURNS, FUJITSU, LITTELFUSE, SONY, TRACO, MCP, SEIKO, IDT, POWER, EPCOS, ATI, ISSI, MPS, SILICON, RECOM, SPANSION, TE CONNECTIVITY , VISHAY DALE, WINBOND, INNOLUX, BB/TI, EVERLIGHT, IC, SST, CREE, BCD, MIC, DIODES, CIRRUS, AT, QFN, AOS, EPSON, JST, AUO, HYNIX, TI , JAE, WCH, TI, AD, ST, MAX, NS, NXP, FSC, MICROCHIP, ATMEL, ALTERA, ON, XILINX, TOS, INFINEON, CY, INTEL, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, IR, FREESCALE, MOT, LINEAR, NEC, SEMIKRON, LATTICE, AMD, ALLEGRO, PHI, BROADCOM, HIT, ROHM, RENESAS, AVAGO, DALLAS, RECOM, SHARP, YAGEO, FUJI, IXYS, SUMIDA, 模块, MIT, HARVATEK, SANYO, KEMET, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, TRACO, VICOR, INTERSIL, EUPEC, COILCRAFT, BOURNS, FUJITSU, LITTELFUSE, SONY, MCP, SEIKO, IDT, POWER, EPCOS, ATI, ISSI, MPS, SILICON, SPANSION, TE CONNECTIVITY , VISHAY DALE, WINBOND, INNOLUX, BB/TI, EVERLIGHT, IC, SST, CREE, BCD, MIC, DIODES, CIRRUS, AT, QFN, AOS, EPSON, JST, AUO, HYNIX, TI , JAE, WCH, TI, AD, ST, MAX, NS, NXP, MICROCHIP, FSC, ATMEL, ALTERA, ON, XILINX, TOS, CY, INTEL, INFINEON, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, IR, LINEAR, MOT, LATTICE, NEC, AMD, ALLEGRO, PHI, SEMIKRON, HIT, BROADCOM, ROHM, RENESAS, DALLAS, RECOM, AVAGO, SHARP, YAGEO, IXYS, FUJI, SUMIDA, 模块, HARVATEK, KEMET, MIT, SANYO, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, TRACO, VICOR, COILCRAFT, INTERSIL, BOURNS, LITTELFUSE, SONY, MCP, EUPEC, SEIKO, POWER, FUJITSU, IDT, ATI, ISSI, MPS, EPCOS, SILICON, SPANSION, TE CONNECTIVITY , VISHAY DALE, INNOLUX, BB/TI, WINBOND, IC, CREE, SST, BCD, DIODES, EVERLIGHT, AT, QFN, MIC, AOS, CIRRUS, EPSON, JST, AUO, TI , JAE, WCH, HYNIX, TI, AD, ST, MAX, NS, NXP, MICROCHIP, FSC, ATMEL, ALTERA, ON, XILINX, TOS, CY, INTEL, INFINEON, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, IR, LINEAR, MOT, LATTICE, NEC, AMD, ALLEGRO, PHI, SEMIKRON, HIT, BROADCOM, ROHM, RENESAS, DALLAS, RECOM, AVAGO, SHARP, YAGEO, IXYS, FUJI, SUMIDA, 模块, HARVATEK, KEMET, MIT, SANYO, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, TRACO, VICOR, COILCRAFT, INTERSIL, BOURNS, LITTELFUSE, SONY, MCP, EUPEC, SEIKO, POWER, FUJITSU, IDT, ATI, ISSI, MPS, EPCOS, SILICON, SPANSION, TE CONNECTIVITY , VISHAY DALE, INNOLUX, BB/TI, WINBOND, IC, CREE, SST, BCD, DIODES, EVERLIGHT, AT, QFN, MIC, AOS, CIRRUS, EPSON, JST, AUO, TI , JAE, WCH, HYNIX, TI, AD, ST, MAX, NS, NXP, MICROCHIP, FSC, ATMEL, ALTERA, ON, XILINX, TOS, CY, INTEL, INFINEON, VISHAY, 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SHARP, DALLAS, YAGEO, FUJI, SUMIDA, MIT, 模块, HARVATEK, KEMET, MICREL, SANYO, NVIDIA, INTERSIL, COOPER, QUALCOMM, POWER, TDK, ISD/NUVOTON, VICOR, TRACO, ISSI, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, MIC, SONY, MCP, SEIKO, STMICROELECTRONICS, IDT, JRC, ATI, MPS, MOLEX, EPCOS, ALLEGRO, EVERLIGHT, BB, SILICON, SST, SPANSION, VISHAY DALE, INNOLUX, BB/TI, DIODES, IC, CREE, AT, CIRRUS, QFN, NXP/PHI, EPSON, AOS, HYNIX, TI , IXYS, REALTEK, WCH, ASTEC, EUPEC, AUO, BOSCH, TI, ST, AD, MAX, NS, NXP, XILINX, FSC, IR, ATMEL, ALTERA, TOS, MICROCHIP, ON, INTEL, MURATA, INFINEON, CY, VISHAY, MICRON, SAMSUNG, PANASONIC, AVX, MOT, LINEAR, FREESCALE, NEC, LATTICE, PHI, AMD, ROHM, SEMIKRON, BROADCOM, AVAGO, HIT, DALLAS, RECOM, SHARP, YAGEO, FUJI, RENESAS, SUMIDA, 模块, MIT, HARVATEK, KEMET, MICREL, NVIDIA, SANYO, COOPER, INTERSIL, QUALCOMM, ISD/NUVOTON, TDK, TRACO, ISSI, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, MCP, SEIKO, SONY, MIC, SILICON, IDT, JRC, ATI, MPS, MOLEX, ALLEGRO, EPCOS, VICOR, IXYS, EVERLIGHT, VISHAY DALE, INNOLUX, SST, BB/TI, DIODES, SPANSION, IC, CREE, REALTEK, STMICROELECTRONICS, AT, POWER, CIRRUS, QFN, NXP/PHI, BOSCH, EPSON, AOS, HYNIX, TI , WCH, ASTEC, BB, EUPEC, AUO, TI, ST, AD, NXP, MAX, FSC, NS, XILINX, ATMEL, ALTERA, IR, ON, MICROCHIP, TOS, INTEL, MURATA, CY, INFINEON, VISHAY, SAMSUNG, MICRON, PANASONIC, AVX, LINEAR, MOT, FREESCALE, NEC, SHARP, LATTICE, PHI, SEMIKRON, ROHM, AMD, BROADCOM, FUJI, AVAGO, HIT, DALLAS, RECOM, YAGEO, RENESAS, MIT, WURTH, SUMIDA, 模块, HARVATEK, KEMET, MICREL, IDT, NVIDIA, SANYO, TDK, COOPER, INTERSIL, QUALCOMM, ISD/NUVOTON, TRACO, ISSI, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, MCP, SEIKO, SILICON, MIC, JRC, ATI, MPS, EVERLIGHT, MOLEX, EPCOS, ALLEGRO, VICOR, IXYS, AUO, INNOLUX, VISHAY DALE, BB/TI, SPANSION, SST, AT, IC, CREE, REALTEK, STMICROELECTRONICS, EUPEC, POWER, SONY, CIRRUS, QFN, NXP/PHI, AOS, DIODES, BOSCH, HYNIX, EPSON, TI , WCH, ASTEC, TI, AD, ST, MAX, NXP, NS, XILINX, ALTERA, TOS, ATMEL, IR, ON, FSC, MICROCHIP, INFINEON, MURATA, 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Google Search Product Summary NXP LPC1343FHN This is an offer provided by HKin.com member. In stock! Order now! Category: Electronic Components. Product #: LPC1343FHN. Available from: Faishing Electronic Technology (HK) Limited Condition: in excellent condition In stock! Order now! Part Numbers Previous Parts:UMK107BJ105KA-T, UPA572-T1, XC56L307VF150, XCT38140FD04, Z0853006PSC, 1F60A-120F, EL7457C, MTFC8GLSEA, HCNW2211, B39202-B7825-C710, DO1608C-822MLB, TDA7418, TLC5620IDR, AT24C08AN, IRF7822TR, LPC1313FBD (+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: LPC1343FHN": Post Date Part Number Brand D/C Desc Qty Company Tue Apr 23 02:12:00 UTC 2013 LPC1343FHN (from standard server 2) NXP 11+ QFN 1000 Faishing Electronic Technology (HK) Limited Tue Apr 23 02:12:00 UTC 2013 LPC1343FHN (from parts server 2) NXP 11+ QFN 1000 Faishing Electronic Technology (HK) Limited Tue Apr 23 02:12:00 UTC 2013 LPC1343FHN (from hkin.com 2) NXP 11+ QFN 1000 Faishing Electronic Technology (HK) Limited Tue Apr 23 02:12:00 UTC 2013 LPC1343FHN (from hkin.com 2) NXP 11+ QFN 1000 Faishing Electronic Technology (HK) Limited Tue Apr 23 02:12:00 UTC 2013 LPC1343FHN33 (from standard server 2) NXP 11+ QFN 1000 Faishing Electronic Technology (HK) Limited Tue Apr 23 02:12:00 UTC 2013 LPC1343FHN33 (from parts server 2) NXP 11+ QFN 1000 Faishing Electronic Technology (HK) Limited Tue Apr 23 02:12:00 UTC 2013 LPC1343FHN33 (from hkin.com 2) NXP 11+ QFN 1000 Faishing Electronic Technology (HK) Limited Tue Apr 23 02:12:00 UTC 2013 LPC1343FHN33 (from hkin.com 2) NXP 11+ QFN 1000 Faishing Electronic Technology (HK) Limited Last record LPC1313FBD: Post Date Part Number Brand D/C Desc Qty Company Last record IRF7822TR: Post Date Part Number Brand D/C Desc Qty Company Last record AT24C08AN: Post Date Part Number Brand D/C Desc Qty Company If you want to find more about LPC1343FHN, please visit us on HKin vid:offerengine20130524 Part Number Prefix LPC1343FHN,LPC1343FHN,Comments from user about LPC1343FHN: An electric field can increase the number of free electrons and holes in a semiconductor, thereby changing its conductivity. Noyce also came up with his own idea of an integrated circuit half a year later than Kilby. The MOSFET is the most used semiconductor device today.hn, which are optimized for distribution of HD content between CE devices in a home. An ideal capacitor is characterized by a single constant value, capacitance, measured in farads. Semiconductor devices have replaced thermionic devices (vacuum tubes) in most applications.Most analog electronic appliances, such as radio receivers, are constructed from combinations of a few types of basic circuits. The range of desired frequencies (the passband) together with the shape of the frequency response. Anything related to :LPC1343FHN, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: LPC1343FHN, search hkinventory: LPC1343FHN, Soon every major vendor was releasing a RISC design, including the AT&T CRISP, AMD 29000, Intel i860 and Intel i960, Motorola 88000, DEC Alpha. Machines with different microarchitectures may have the same instruction set architecture, and thus be capable of executing the same programs. VHDL has file input and output capabilities, and can be used as a general-purpose language for text processing, but files are more commonly used by a simulation testbench for stimulus or verification data. For example, GPUs through the 1990s were mostly non-programmable and have only recently gained limited facilities like programmable vertex shaders. Datasheet Dir, DataSheet Archive Integration of the floating point unit first as a separate integrated circuit and then as part of the same microprocessor chip, speeded up floating point calculations. Like Ada, VHDL is strongly typed and is not case sensitive. These components overcame some limitations of the thyristors because they can be turned on or off with an applied signal. Similarly, an overdriven transistor amplifier can take on the characteristics of a controlled switch having essentially two levels of output. When a doped semiconductor contains excess holes it is called "p-type", and when it contains excess free electrons it is known as "n-type", where p (positive for holes) or n (negative for electrons) is the sign of the charge of the majority mobile charge carriers. For each computer built, all of these had to be placed and soldered onto printed circuit boards, and often multiple boards would have to be interconnected in a chassis. For high-pass and low-pass (as well as band-pass filters far from the center frequency), the required rejection may determine the slope of attenuation needed, and thus the "order" of the filter. However, remember that the internal output impedance of operational amplifiers, if used, may rise markedly at high frequencies and reduce the attenuation from that expected. any passive component and active component such as:1N4148, or 6502 While different synthesis tools have different capabilities, there exists a common synthesizable subset of VHDL that defines what language constructs and idioms map into common hardware for many synthesis tools. Low-pass filters ?attenuation of frequencies above their cut-off points. The transistor's low cost, flexibility, and reliability have made it a ubiquitous device. The pipelined datapath is the most commonly used datapath design in microarchitecture today. For example driver circuit LPC1343FHN,LPC1343FHN,Comments from user about LPC1343FHN: While consumer electronics continues in its trend of convergence, combining elements of many products, consumers face different decisions when purchasing. VHDL has file input and output capabilities, and can be used as a general-purpose language for text processing, but files are more commonly used by a simulation testbench for stimulus or verification data. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. The first microprocessors emerged in the early 1970s and were used for electronic calculators, using binary-coded decimal (BCD) arithmetic on 4-bit words. The main reason why semiconductor materials are so useful is that the behavior of a semiconductor can be easily manipulated by the addition of impurities, known as doping. These days analog circuitry may use digital or even microprocessor techniques to improve performance. For each computer built, all of these had to be placed and soldered onto printed circuit boards, and often multiple boards would have to be interconnected in a chassis. With the vertical structure, the current rating of the device is proportional to its area, and the voltage blocking capability is achieved in the height of the die. Anything related to :LPC1343FHN, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: LPC1343FHNSee also: Capacitor Transistor Diode