Part: OPA177FP

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Offer Index 28

DALLAS,
MICROCHIP,
MIT,
PHI,
BB,
PANASONIC,
INTEL,
ALLEGRO,
IXYS,
WJ,
FUJI,
RENESAS,
INTERSIL,
AMD,
YAGEO,
MPS,
AVAGO,
SIEMENS,
SHARP,
MIC,
BOURNS,
VICOR,
HIT,
MOLEX,
NICHICON,
ISSI,
MICREL,
TDK,
AMP,
NIPPON CHEMI-CON,
PERICOM,
LAMBDA,
SANYO,
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COOPER,
EUPEC,
NUVOTON,
LITTELFUSE,
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Product Summary
07+ OPA177FP
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: OPA177FP.


Available from: Glory Venture Chips Company
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:AT43301/55634D, MT49H8M32HU-5IT, MT5362ANG, MX25L1606EM2I-12G, MX29LV640EBTI-70G, NAND02GW3B2DN6E, NC7SB3157P6X, NCP1200P60G, NIPA838-1, NJM2244M, NL2432HC22-37B, NMV0512SC, NSC831D-4M, NTD4302, NTJS3157NT1G, NUC100VE3AN

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: OPA177FP":

Post DatePart NumberBrandD/CDescQtyCompany
Mon Jan 16 05:41:00 UTC 2012OPA177FP (from hkin.com)07+DIP8TI1754Glory Venture Chips Company
Mon Jan 16 05:41:00 UTC 2012OPA177FP (from standard server 2)07+DIP8TI1754Glory Venture Chips Company
Mon Jan 16 05:41:00 UTC 2012OPA177FP (from parts server 2)07+DIP8TI1754Glory Venture Chips Company
Mon Jan 16 05:41:00 UTC 2012OPA177FP (from hkin.com 2)07+DIP8TI1754Glory Venture Chips Company
Mon Jan 16 05:41:00 UTC 2012OPA177FP (from hkin.com 2)07+DIP8TI1754Glory Venture Chips Company

Last record NUC100VE3AN:

Post DatePart NumberBrandD/CDescQtyCompany
Sun Jan 15 03:26:00 UTC 2012NUC100VE3AN (from hkin.com)NUVOTON2011LQFP13Hengsen Technology (HK) Company Limited

Last record NTJS3157NT1G:

Post DatePart NumberBrandD/CDescQtyCompany
Thu Jan 12 06:55:00 UTC 2012NTJS3157NT1G (from hkin.com)ONSEMI09+NEW12000Power Sources Electronics Co., Limited

Last record NTD4302:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Dec 26 05:14:00 UTC 2011NTD4302T4G (from hkin.com)02+2500Hong Kong XJ Electronics Co., Limited

If you want to find more about OPA177FP, please visit us on HKin


vid:offerengine20120117

OPA177FP,OPA177FP,Comments from user about OPA177FP: Semiconductor devices are manufactured both as single discrete devices and as integrated circuits (ICs), which consist of a numberfrom a few (as low as two) to billionsof devices manufactured and interconnected on a single semiconductor substrate. Some components, such as bus interface and second level cache, may be shared between cores. Analog circuits use a continuous range of voltage as opposed to discrete levels as in digital circuits. However, some systems use the reverse definition ("0" is "High") or are current based. Microprocessor control of a system can provide control strategies that would be impractical to implement using electromechanical controls or purpose-built electronic controls. These components overcame some limitations of the thyristors because they can be turned on or off with an applied signal.Most analog electronic appliances, such as radio receivers, are constructed from combinations of a few types of basic circuits. The large number of discrete logic gates used more electrical powerXand therefore, produced more heatXthan a more integrated design with fewer ICs. Anything related to :OPA177FP, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: OPA177FP, search hkinventory: OPA177FP, Analog circuits are sometimes called linear circuits although many non-linear effects are used in analog circuits such as mixers, modulators, etc. Instead of processing all of a long word on one integrated circuit, multiple circuits in parallel processed subsets of each data word. IEEE standard 1076. In principle, a single microarchitecture could execute several different ISAs with only minor changes to the microcode. Datasheet Dir, DataSheet Archive
Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. Consumer electronics are manufactured throughout the world, although there is a particularly high concentration of headquarters, factories, research and development activity in East Asia, especially in Japan. These include large and small household appliances, cars (and their accessory equipment units), car keys, tools and test instruments, toys, light switches/dimmers and electrical circuit breakers, smoke alarms, battery packs, and hi-fi audio/visual components (from DVD players to phonograph turntables.) Such products as cellular telephones, DVD video system and ATSC HDTV broadcast system fundamentally require consumer devices with powerful, low-cost, microprocessors. The first commercial RISC microprocessor design was released either by MIPS Computer Systems, the 32-bit R2000 (the R1000 was not released) or by Acorn computers, the 32-bit ARM2 in 1987. With AMD's introduction of a 64-bit architecture backwards-compatible with x86, x86-64 (also called AMD64), in September 2003, followed by Intel's near fully compatible 64-bit extensions (first called IA-32e or EM64T, later renamed Intel 64), the 64-bit desktop era began. Passivity, in most cases, can be used to demonstrate that passive circuits will be stable under specific criteria. As integrated circuit technology advanced, it was feasible to manufacture more and more complex processors on a single chip. Each logic gate is in turn represented by a circuit diagram describing the connections of the transistors used to implement it in some particular logic family.
any passive component and active component such as:Diode, A passive component, depending on field, may be either a component that consumes (but does not produce) energy (thermodynamic passivity), or a component that is incapable of power gain (incremental passivity). The logic section retrieves instruction operation codes from memory, and iniates whatever sequence of operations of the ALU required to carry out the instruction. When the reverse bias breakdown voltage is exceeded, a conventional diode is subject to high current due to avalanche breakdown. A digital signal processor (DSP) is specialized for signal processing. For example driver circuit
OPA177FP,OPA177FP,Comments from user about OPA177FP: IEEE standard 1076. This indicates the variety of filter (see above) and the center or corner frequencies. While 64-bit microprocessor designs have been in use in several markets since the early 1990s, the early 2000s saw the introduction of 64-bit microprocessors targeted at the PC market. Because the cores are physically very close to each other, they can communicate with each other much faster than separate processors in a multiprocessor system, which improves overall system performance. It is an example of sequential digital logic, as it has internal memory. This equation is linear with respect to temperature. The compact size, the possibility of narrow bandwidth, switching speed, and extreme reliability of LEDs has allowed new text and video displays and sensors to be developed, while their high switching rates are also useful in advanced communications technology., followed soon after. Anything related to :OPA177FP, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: OPA177FPSee also: