Part: M25P16V6P

Index Files

Offer Index 28

BB,
AVAGO,
SHARP,
NICHICON,
ISSI,
MICREL,
EUPEC,
ERICSSON,
AMP,
AGILENT,
IXYS,
HIT,
INTERSIL,
EPSON,
MOLEX,
LAMBDA,
NUVOTON,
MICRON,
SANYO,
TDK

 
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Product Summary
ST M25P16V6P
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: M25P16V6P.


Available from: HK Kenenda Electronics Company Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:PIC16F872ISS, 2N5550, LM25755-5.0/NOPB, LM741CN/NOPB, LP2982IM5X-3.8, LT1376, 275L40B, LP38690DTX-3.3/NOPB, EP2C8F256I8N, PZT3904T1G, HMT125U6TFR8C-G7, DS2483Z, TLP621-1, UPB2157D-B, ST72F60E2M1, L5973D013TR

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: M25P16V6P":

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 18 02:48:00 UTC 2012M25P16V6P (from hkin.com)ST10+SOP161081HK Kenenda Electronics Company Limited
Wed Jan 18 02:48:00 UTC 2012M25P16V6P (from standard server 2)ST10+SOP161081HK Kenenda Electronics Company Limited
Wed Jan 18 02:48:00 UTC 2012M25P16V6P (from parts server 2)ST10+SOP161081HK Kenenda Electronics Company Limited
Wed Jan 18 02:48:00 UTC 2012M25P16V6P (from hkin.com 2)ST10+SOP161081HK Kenenda Electronics Company Limited
Wed Jan 18 02:48:00 UTC 2012M25P16V6P (from hkin.com 2)ST10+SOP161081HK Kenenda Electronics Company Limited

Last record L5973D013TR:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Jan 14 08:55:00 UTC 2012L5973D013TR (from hkin.com)25000Yingxinyuan INT'L (Group) Limited

Last record ST72F60E2M1:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 18 02:48:00 UTC 2012ST72F60E2M1 (from hkin.com)ST10+QFP2000HK Kenenda Electronics Company Limited

Last record UPB2157D-B:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Jan 3 03:39:00 UTC 2012UPB2157D-B (from hkin.com)NEC98+DIP24Faishing Electronic Technology (HK) Limited

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any passive component and active component such as:Diode, A simulation program is used to test the logic design using simulation models to represent the logic circuits that interface to the design. The size of data objects became larger; allowing more transistors on a chip allowed word sizes to increase from 4- and 8-bit words up to today's 64-bit words. The other regions, and their associated terminals, are known as the emitter and the collector. Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage. For example driver circuit
M25P16V6P,M25P16V6P,Comments from user about M25P16V6P: The pipelined architecture allows multiple instructions to overlap in execution, much like an assembly line. This problem is caused by the slow decay of the conduction current during turn-off resulting from slow recombination of large number of carriers, which flood the thick 'drift' region of the IGBT during conduction. The size, latency, throughput and connectivity of memories within the system are also microarchitectural decisions. Circuit designers will sometimes refer to this class of components as dissipative, or thermodynamically passive. Infrared LEDs are also used in the remote control units of many commercial products including televisions, DVD players, and other domestic appliances. Infrared LEDs are also used in the remote control units of many commercial products including televisions, DVD players, and other domestic appliances.The second region, at reverse biases more positive than the PIV, has only a very small reverse saturation current. The microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. Anything related to :M25P16V6P, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: M25P16V6PSee also: