Part: PIC18F6390

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Offer Index 25

MOLEX,
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ISSI,
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TDK,
AMP,
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PERICOM,
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MICRON,
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EPCOS,
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COILCRAFT,
HYNIX,
AVX,
ISD/NUVOTON,
MURATA PS,
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BROADCOM,
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Product Summary
MICROCHIP PIC18F6390
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: PIC18F6390.


Available from: JetLi Electronic (HK) Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:P89LPC935FDH, PA1A-12V, PC352, PC3Q67Q, PE014012, PEB2254H, PEB22822F10BASE-SV2.2, PH150F280-5, PIC16F84A-04, PIC16F873-04, PIC16F874A-I/PT, PIC16F876-20/SP, PIC16F917-I/PT, PIC18F24J50-I/SS, PIC18F4455, PIC18F452

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: PIC18F6390":

Post DatePart NumberBrandD/CDescQtyCompany
Wed Dec 21 03:45:00 UTC 2011PIC18F6390-I/PT (from hkin.com)MICROCHIP130JetLi Electronic (HK) Limited
Wed Dec 21 03:45:00 UTC 2011PIC18F6390-I/PT (from standard server 2)MICROCHIP130JetLi Electronic (HK) Limited
Wed Dec 21 03:45:00 UTC 2011PIC18F6390-I/PT (from parts server 2)MICROCHIP130JetLi Electronic (HK) Limited
Wed Dec 21 03:45:00 UTC 2011PIC18F6390-I/PT (from hkin.com 2)MICROCHIP130JetLi Electronic (HK) Limited
Wed Dec 21 03:45:00 UTC 2011PIC18F6390-I/PT (from hkin.com 2)MICROCHIP130JetLi Electronic (HK) Limited
Fri Jan 13 06:04:00 UTC 2012PIC18F6390-I/PT (from hkin.com)MICROCHI..TQFP641100E-Future International Trading Co., Limited
Fri Jan 13 06:04:00 UTC 2012PIC18F6390-I/PT (from standard server 2)MICROCHI..TQFP641100E-Future International Trading Co., Limited
Fri Jan 13 06:04:00 UTC 2012PIC18F6390-I/PT (from parts server 2)MICROCHI..TQFP641100E-Future International Trading Co., Limited
Fri Jan 13 06:04:00 UTC 2012PIC18F6390-I/PT (from hkin.com 2)MICROCHI..TQFP641100E-Future International Trading Co., Limited
Fri Jan 13 06:04:00 UTC 2012PIC18F6390-I/PT (from hkin.com 2)MICROCHI..TQFP641100E-Future International Trading Co., Limited
Sat Dec 31 02:13:00 UTC 2011PIC18F6390-I/PT (from hkin.com)MICROCHIP10+TQDP64745Taiwan Anprosperous Technology Co.,Limited
Sat Dec 31 02:13:00 UTC 2011PIC18F6390-I/PT (from standard server 2)MICROCHIP10+TQDP64745Taiwan Anprosperous Technology Co.,Limited
Sat Dec 31 02:13:00 UTC 2011PIC18F6390-I/PT (from parts server 2)MICROCHIP10+TQDP64745Taiwan Anprosperous Technology Co.,Limited
Sat Dec 31 02:13:00 UTC 2011PIC18F6390-I/PT (from hkin.com 2)MICROCHIP10+TQDP64745Taiwan Anprosperous Technology Co.,Limited
Sat Dec 31 02:13:00 UTC 2011PIC18F6390-I/PT (from hkin.com 2)MICROCHIP10+TQDP64745Taiwan Anprosperous Technology Co.,Limited

Last record PIC18F452:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 11 01:32:00 UTC 2012PIC18F452-I/PT (from hkin.com)MicrochipROHSnew & original6400Ontech Electronics International Limited
Wed Jan 11 01:32:00 UTC 2012PIC18F4520-I/PT (from hkin.com)MicrochipROHSnew & original1000Ontech Electronics International Limited
Fri Jan 13 08:54:00 UTC 2012PIC18F452-I/PT (from hkin.com)TQFP442000Kingrole Industry (Hongkong) Limited
Tue Jan 17 03:10:00 UTC 2012PIC18F4520-I/P (from hkin.com)MICROCHIP10+IN ORIGINAL PACKAGE10000Forbest Global Communication Co., Limited
Mon Jan 16 04:22:00 UTC 2012PIC18F4525T-I/PT (from hkin.com)MICROCHIP2010+QFP442500Benew Industry Limited
Thu Jan 12 05:14:00 UTC 2012PIC18F452-I/PT (from hkin.com)MCIROCHIPTQFP442000Netchip Limited
Wed Dec 28 03:18:00 UTC 2011PIC18F4520-I/PT (from hkin.com)TQFP442010+MICROCHIP2765Shenzhen Xinyuanjiang Trade Co.,Ltd
Wed Dec 28 03:18:00 UTC 2011PIC18F4520-I/P (from hkin.com)MICROCHIP2010+DIP-407200Shenzhen Xinyuanjiang Trade Co.,Ltd
Mon Jan 16 02:18:00 UTC 2012PIC18F452-I/PT (from hkin.com)QFP10000Rs (Int'l) Electronics Limited
Fri Jan 13 06:04:00 UTC 2012PIC18F452-I/PT (from hkin.com)MICROCHIP10+TQFP442897E-Future International Trading Co., Limited
Mon Jan 16 02:18:00 UTC 2012PIC18F452-I/PT (from hkin.com)10000QFP50000Rs (Int'l) Electronics Limited
Fri Jan 13 00:55:00 UTC 2012PIC18F4520-I/PT (from hkin.com)MIC10+5390HK Xlwy International Co., Limited
Fri Jan 13 00:55:00 UTC 2012PIC18F4520-I/P (from hkin.com)MIC10+1200HK Xlwy International Co., Limited
Fri Dec 23 02:34:00 UTC 2011PIC18F4520-I/P (from hkin.com)3576S&L Technology Development Co. ,Limited
Fri Dec 23 02:36:00 UTC 2011PIC18F4520-I/PT (from hkin.com)875S&L Technology Development Co. ,Limited
Fri Dec 23 02:36:00 UTC 2011PIC18F452-I/PT (from hkin.com)9S&L Technology Development Co. ,Limited
Wed Jan 11 01:32:00 UTC 2012PIC18F452-I/PT (from hkin.com)MicrochipROHSNew&Original20000Ontech Electronics International Limited
Wed Jan 11 01:32:00 UTC 2012PIC18F4520-I/PT (from hkin.com)MicrochipROHSNew&Original20000Ontech Electronics International Limited
Mon Jan 16 02:18:00 UTC 2012PIC18F452-I/P (from hkin.com)Microchip20098000Rs (Int'l) Electronics Limited
Mon Jan 16 02:18:00 UTC 2012PIC18F452-I/L (from hkin.com)Microchip20098000Rs (Int'l) Electronics Limited
Tue Jan 17 04:55:00 UTC 2012PIC18F452-I/PT (from hkin.com)MICROCHIP05+TQFP441000KingMay Electronic (HK) Co., Limited
Thu Dec 22 02:14:00 UTC 2011PIC18F4520-I/PT (from hkin.com)MICROCHIP11+7600Shinever Technology Limited
Mon Jan 9 05:35:00 UTC 2012PIC18F452-I/PT (from hkin.com)TQFP44MCIROCHIP2000HK Meihang Technology Co., Limited
Tue Jan 17 00:39:00 UTC 2012PIC18F4520-I/P (from hkin.com)MICROCHI10+15000Wide Key International Limited
Fri Jan 13 06:04:00 UTC 2012PIC18F452-I/L (from hkin.com)MICROCHI..10+PLCC444000E-Future International Trading Co., Limited
Fri Jan 13 06:04:00 UTC 2012PIC18F4525-I/PT (from hkin.com)MICROCHIP10+TQFP442000E-Future International Trading Co., Limited
Wed Jan 11 02:25:00 UTC 2012PIC18F4520-I/PT (from hkin.com)Microchip11+new and original10000Power Start Electronics Company
Sat Jan 14 02:37:00 UTC 2012PIC18F4520-I/PT (from hkin.com)MICROCHIP1121+TQFP444500Konde Technology (HK) Company Limited
Tue Jan 17 00:39:00 UTC 2012PIC18F4520-I/P (from hkin.com)MICROCHI10+DIP4015000Wide Key International Limited
Sat Dec 31 02:13:00 UTC 2011PIC18F4520-I/PT (from hkin.com)MICROCHIP10+TQFP44842Taiwan Anprosperous Technology Co.,Limited
Sat Dec 31 02:13:00 UTC 2011PIC18F452-I/P (from hkin.com)MICROCHIP10+DIP620Taiwan Anprosperous Technology Co.,Limited
Sat Dec 31 02:13:00 UTC 2011PIC18F452-I/PT (from hkin.com)MICROCHIP10+TQFP44560Taiwan Anprosperous Technology Co.,Limited

Last record PIC18F4455:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Dec 31 02:13:00 UTC 2011PIC18F4455-I/PT (from hkin.com)MICROCHIP10+TQFP44650Taiwan Anprosperous Technology Co.,Limited

Last record PIC18F24J50-I/SS:

Post DatePart NumberBrandD/CDescQtyCompany
Thu Jan 12 01:56:00 UTC 2012PIC18F24J50-I/SS (from hkin.com)7000Gold Shine International Electronics Limited

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vid:offerengine20120117

PIC18F6390,PIC18F6390,Comments from user about PIC18F6390: His chip solved many practical problems that Kilby's had not. Semiconductor components benefit from Moore's Law, an observed principle which states that, for a given price, semiconductor functionality doubles every two years. A simulation program is used to test the logic design using simulation models to represent the logic circuits that interface to the design. Capacitors are widely used in electronic circuits for blocking direct current while allowing alternating current to pass, in filter networks, for smoothing the output of power supplies, in the resonant circuits that tune radios to particular frequencies and for many other purposes. An electronic circuit consisting entirely of passive components is called a passive circuit (and has the same properties as a passive component). Increasingly these products have become based on digital technologies, and have largely merged with the computer industry in what is increasingly referred to as the consumerization of information technology. The pipelined datapath is the most commonly used datapath design in microarchitecture today. Competing projects would result in the IBM POWER and Sun SPARC architectures. Anything related to :PIC18F6390, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: PIC18F6390, search hkinventory: PIC18F6390, Non-programmable controls would require complex, bulky, or costly implementation to achieve the results possible with a microprocessor. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. LEDs powerful enough for room lighting are relatively expensive and require more precise current and heat management than compact fluorescent lamp sources of comparable output. On average, every fifth instruction executed is a branch, so without any intervention, that's a high amount of stalling. Datasheet Dir, DataSheet Archive
Actually, all power semiconductors rely on a PIN diode structure to sustain voltage. Synthesis is a process where a VHDL is compiled and mapped into an implementation technology such as an FPGA or an ASIC. Most digital circuits use a binary system with two voltage levels labeled "0" and "1". Key changes include incorporation of child standards (1164, 1076.2, 1076.3) into the main 1076 standard, an extended set of operators, more flexible syntax of case and generate statements, incorporation of VHPI (interface to C/C++ languages) and a subset of PSL (Property Specification Language). This technique is used in most modern microprocessors, microcontrollers, and DSPs. They are also called power devices or when used in integrated circuits, called power ICs. The pipelined datapath is the most commonly used datapath design in microarchitecture today. Advancing technology makes more complex and powerful chips feasible to manufacture.
any passive component and active component such as:Diode, Some architectures include other stages such as memory access. The analogous field-effect transistor circuit is the common-source amplifier.Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. There are some VHDL compilers which build executable binaries. For example driver circuit
PIC18F6390,PIC18F6390,Comments from user about PIC18F6390: Semiconductor conductivity can be controlled by introduction of an electric or magnetic field, by exposure to light or heat, or by mechanical deformation of a doped monocrystalline grid; thus, semiconductors can make excellent sensors. The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to precisely control the location and concentration of p- and n-type dopants. Its major limitation for low voltage applications is the high voltage drop it exhibits in on-state (2 to 4 V). The middle, or base, region between the junctions is typically very narrow. It was made of Germanium and had a voltage capability of 200 volts and a current rating of 35 amperes. MOSFET is an IC which is semiconductor device. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. They use electronic conduction in the solid state as opposed to the gaseous state or thermionic emission in a high vacuum. Anything related to :PIC18F6390, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: PIC18F6390See also: