Part: 74LVC1G125GF

Index Files

Offer Index 25

MURATA PS,
SEMIKRON,
BROADCOM,
WINBOND,
COSEL,
SST,
OSRAM,
LATTICE,
BSI,
LG,
KEC,
BCD,
LUCENT,
IDT,
JST,
SIPEX,
LGD,
TRACOPOWE,
KEMET,
FUJITSU,
NA,
AGILENT,
NUMONYX,
AUO,
FMD,
RAMTRON,
IMP,
NATIONAL,
SEMTECH,
BGA,
TI,
INFINEON,
ST,
MAX,
NS,
AD,
ON,
ATMEL,
IR,
XILINX

 
Google Search

Product Summary
NXP 74LVC1G125GF
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: 74LVC1G125GF.


Available from: Sunshun International Electronics Co.Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:GRM18BR61A226ME19L, TM104SDH01, TMS320C6412ZDK, AT89C51, UPD17217GT-537, XAP-12V-1, BIC1421, BR-2/3 AGCT4A 6V, XSC20XL-4PQG208C, ZUS251212, 0603LA, SIL141CT80, TPS74401KTWR, NCP1050ST136T3G, NIF9N05CLT1G, P3100ECL

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: 74LVC1G125GF":

Post DatePart NumberBrandD/CDescQtyCompany
Sat Jan 14 04:00:00 UTC 201274LVC1G125GF (from hkin.com)NXP2011+original package5600Sunshun International Electronics Co.Limited
Sat Jan 14 04:00:00 UTC 201274LVC1G125GF (from standard server 2)NXP2011+original package5600Sunshun International Electronics Co.Limited
Sat Jan 14 04:00:00 UTC 201274LVC1G125GF (from parts server 2)NXP2011+original package5600Sunshun International Electronics Co.Limited
Sat Jan 14 04:00:00 UTC 201274LVC1G125GF (from hkin.com 2)NXP2011+original package5600Sunshun International Electronics Co.Limited
Sat Jan 14 04:00:00 UTC 201274LVC1G125GF (from hkin.com 2)NXP2011+original package5600Sunshun International Electronics Co.Limited

Last record P3100ECL:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 11 07:28:00 UTC 2012P3100ECL (from hkin.com)LITTELF 2010+2000Kehai Weiye International Electronics Limited

Last record NIF9N05CLT1G:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 11 01:37:00 UTC 2012NIF9N05CLT1G (from hkin.com)ON2010+SOT-223250000Atom (Hong Kong) Electronics Co., Limited

Last record NCP1050ST136T3G:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 11 01:37:00 UTC 2012NCP1050ST136T3G (from hkin.com)ON2010+SOT-223250000Atom (Hong Kong) Electronics Co., Limited

If you want to find more about 74LVC1G125GF, please visit us on HKin


vid:offerengine20120117

74LVC1G125GF,74LVC1G125GF,Comments from user about 74LVC1G125GF: , the power must be disconnected from the device. The thyristor turn-off is passive, i.[3] Some of these stages include instruction fetch, instruction decode, execute, and write back. For example, GPUs through the 1990s were mostly non-programmable and have only recently gained limited facilities like programmable vertex shaders. Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage. In this circuit the base terminal of the transistor serves as the input, the collector is the output, and the emitter is common to both (for example, it may be tied to ground reference or a power supply rail), hence its name. This includes decisions on the performance-level and connectivity of these peripherals. Good examples of analog circuits include vacuum tube and transistor amplifiers, operational amplifiers and oscillators. Anything related to :74LVC1G125GF, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: 74LVC1G125GF, search hkinventory: 74LVC1G125GF, Advancing technology makes more complex and powerful chips feasible to manufacture. High-end Intel Xeon processors that are on the LGA771 socket are DP (dual processor) capable, as well as the Intel Core 2 Extreme QX9775 also used in the Mac Pro by Apple and the Intel Skulltrail motherboard. The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to precisely control the location and concentration of p- and n-type dopants. A microprocessor control program can be easily tailored to different needs of a product line, allowing upgrades in performance with minimal redesign of the product. Datasheet Dir, DataSheet Archive
This is driven by gains in manufacturing efficiency and automation, lower labor costs as manufacturing has moved to lower-wage countries, and improvements in semiconductor design. When used in a finite-state machine, the output and next state depend not only on its current input, but also on its current state (and hence, previous inputs.) It can also be used for counting of pulses, and for synchronizing variably-timed input signals to some reference timing signal. Style, price, specification and performance are all relevant. An electronic circuit consisting entirely of passive components is called a passive circuit (and has the same properties as a passive component). Generally, processor speed has increased more rapidly than external memory speed, so cache memory is necessary if the processor is not to be delayed by slower external memory. The MOSFET is the most used semiconductor device today. VHDL project is portable. In electronics, a common-emitter amplifier is one of three basic single-stage bipolar-junction-transistor (BJT) amplifier topologies, typically used as a voltage amplifier.
any passive component and active component such as:Diode, Capacitors used as parts of electrical systems, for example, consist of metal foils separated by a layer of insulating film. From the time that the processor's instruction decoder has figured out that it has encountered a conditional branch instruction to the time that the deciding register value can be read out, the pipeline needs to be stalled for several cycles, or if it's not and the branch is taken, the pipeline needs to be flushed. With the ability to put large numbers of transistors on one chip, it becomes feaible to integrate memory on the same die as the processor. When there is a potential difference (voltage) across the conductors, a static electric field develops across the dielectric, causing positive charge to collect on one plate and negative charge on the other plate. For example driver circuit
74LVC1G125GF,74LVC1G125GF,Comments from user about 74LVC1G125GF: Some common power devices are the power diode, thyristor, power MOSFET and IGBT. With this structure, one of the connections of the device is located on the bottom of the semiconductor die. This creates a much larger current between the collector and emitter, controlled by the base-emitter current. An integrated circuit or monolithic integrated circuit (also referred to as IC, chip, and microchip) is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material. Passivity is a property of engineering systems, used in a variety of engineering disciplines, but most commonly found in analog electronics and control systems. For quantities that vary polynomially or logarithmically with temperature, it may be possible to calculate a temperature coefficient that is a useful approximation for a certain range of temperatures. On average, every fifth instruction executed is a branch, so without any intervention, that's a high amount of stalling. The distance that signals had to travel between ICs on the boards limited the speed at which a computer could operate. Anything related to :74LVC1G125GF, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: 74LVC1G125GFSee also: