Part: S3C2510AC1

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Offer Index 21

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Product Summary
SAMSUNG S3C2510AC1
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: S3C2510AC1.


Available from: Shenzhen L&P Tech Co.,LTD
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:AD637JDZ, IRKD56/16, IRKE236-12, BAS70-06, M208B1, 3224W-1-503E, 3296W-1-204LF, IRU1117CYTRPBF, EPF6024AQC240-3, A3968ELBT, AT89C51-24AU, MC908QB8MCWER, TIM7785-6UL, MWIC930NR1, PEF82912 V1.4, S29GL01GP11TAI010

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: S3C2510AC1":

Post DatePart NumberBrandD/CDescQtyCompany
Mon Jan 9 04:56:00 UTC 2012S3C2510AC1 (from hkin.com)SAMSUNG0508+0504BGA138Shenzhen L&P Tech Co.,LTD
Mon Jan 9 04:56:00 UTC 2012S3C2510AC1 (from standard server 2)SAMSUNG0508+0504BGA138Shenzhen L&P Tech Co.,LTD
Mon Jan 9 04:56:00 UTC 2012S3C2510AC1 (from parts server 2)SAMSUNG0508+0504BGA138Shenzhen L&P Tech Co.,LTD
Mon Jan 9 04:56:00 UTC 2012S3C2510AC1 (from hkin.com 2)SAMSUNG0508+0504BGA138Shenzhen L&P Tech Co.,LTD
Mon Jan 9 04:56:00 UTC 2012S3C2510AC1 (from hkin.com 2)SAMSUNG0508+0504BGA138Shenzhen L&P Tech Co.,LTD

Last record S29GL01GP11TAI010:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 4 01:27:00 UTC 2012S29GL01GP11TAI010 (from hkin.com)TSOP-562009SPANSION2000Gloway International (HK) Co.Ltd

Last record PEF82912 V1.4:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 4 01:27:00 UTC 2012PEF82912 V1.4 (from hkin.com)TQFP-642004INFINEON36Gloway International (HK) Co.Ltd

Last record MWIC930NR1:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Jan 14 04:01:00 UTC 2012MWIC930NR1 (from hkin.com)Freescale2011+SMD2900Sunshun International Electronics Co.Limited

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S3C2510AC1,S3C2510AC1,Comments from user about S3C2510AC1: These limit the circuit topologies available; for example, most, but not all active filter topologies provide a buffered (low impedance) output. LEDs powerful enough for room lighting are relatively expensive and require more precise current and heat management than compact fluorescent lamp sources of comparable output. Semiconductor devices are manufactured both as single discrete devices and as integrated circuits (ICs), which consist of a numberfrom a few (as low as two) to billionsof devices manufactured and interconnected on a single semiconductor substrate. Cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time. When the reverse bias breakdown voltage is exceeded, a conventional diode is subject to high current due to avalanche breakdown. Although the MOSFET is named in part for its "metal" gate, in modern devices polysilicon is typically used instead. Being created once, a calculation block can be used in many other projects. With the ability to put large numbers of transistors on one chip, it becomes feaible to integrate memory on the same die as the processor. Anything related to :S3C2510AC1, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: S3C2510AC1, search hkinventory: S3C2510AC1, IEEE 1076. This technique is used in most modern microprocessors, microcontrollers, and DSPs.[3] Some of these stages include instruction fetch, instruction decode, execute, and write back. This CPU cache has the advantage of faster access than off-chip memory, and increses the processing speed of the system for many applications. Datasheet Dir, DataSheet Archive
VHDL project is multipurpose. LEDs are used as indicator lamps in many devices and are increasingly used for other lighting. This type of circuit is usually called "mixed signal" rather than analog or digital. The number of different analog circuits so far devised is huge, especially because a 'circuit' can be defined as anything from a single component, to systems containing thousands of components. The compact size, the possibility of narrow bandwidth, switching speed, and extreme reliability of LEDs has allowed new text and video displays and sensors to be developed, while their high switching rates are also useful in advanced communications technology. As microprocessor designs get faster, the cost of manufacturing a chip (with smaller components built on a semiconductor chip the same size) generally stays the same. Although the MOSFET is named in part for its "metal" gate, in modern devices polysilicon is typically used instead. Used without qualifier, the term passive is ambiguous.
any passive component and active component such as:Diode, There is an ever increasing need to keep product information updated and comparable, for the consumer to make an informed choice. Machines with different microarchitectures may have the same instruction set architecture, and thus be capable of executing the same programs. The distance that signals had to travel between ICs on the boards limited the speed at which a computer could operate. These days analog circuitry may use digital or even microprocessor techniques to improve performance. For example driver circuit
S3C2510AC1,S3C2510AC1,Comments from user about S3C2510AC1: These changes should improve quality of synthesizable VHDL code, make testbenches more flexible, and allow wider use of VHDL for system-level descriptions. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements. the bandwidth around the notch before attenuation becomes small. Although the MOSFET is named in part for its "metal" gate, in modern devices polysilicon is typically used instead. Such data storage can be used for storage of state, and such a circuit is described as sequential logic. Competing projects would result in the IBM POWER and Sun SPARC architectures. The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to precisely control the location and concentration of p- and n-type dopants. Anything related to :S3C2510AC1, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: S3C2510AC1See also: