Part: EGD477M0JE11TC

Index Files

Offer Index 18

EPSON,
ATI,
PAM,
SIPEX,
SPANSION,
SAMXON,
RAMTRON,
TI ,
EUPEC,
SW,
TRIQUINT,
ZETEX,
BOSCH,
TI,
AD,
ST,
ATMEL,
NS,
MAX,
ALTERA,
XILINX,
MURATA,
FSC,
MICROCHIP,
NXP,
TOS,
INFINEON,
CY,
SAMSUNG,
PANASONIC,
ON,
MIT,
VISHAY,
IR,
AVX,
INTEL,
MICREL,
LINEAR,
BROADCOM,
FREESCALE,
SEMIKRON,
SHARP,
ALLEGRO,
MOT,
ROHM,
THINKING,
NVIDIA,
EVERLIGHT,
TDK,
NEC,
PHI,
RENESAS,
MICRON,
AVAGO,
YAGEO,
QUALCOMM,
WURTH,
DALLAS,
SANYO,
NUVOTON,
AUO,
MPS,
INTERSIL,
HIT,
ISD/NUVOTON,
HARVATEK,
MIC,
KEMET,
SONY,
FUJITSU,
NIPPON CHEMI-CON,
TYCO,
SILICON,
POWER,
BB,
COILCRAFT,
BB/TI,
BOURNS,
LITTELFUSE,
AMD,
FUJI,
SEIKO,
IXYS,
IDT,
TRACO,
COOPER,
FTDI,
ERICSSOM,
QFP,
CREE,
MOLEX,
EPCOS,
BCD,
ISSI,
MICRON(ST),
CIRRUS,
HYNIX,
SST,
QFN,
WINBOND,
EPSON,
ATI,
PAM,
SIPEX,
SPANSION,
SAMXON,
RAMTRON,
TI ,
EUPEC,
SW,
TRIQUINT,
ZETEX,
BOSCH,
TI,
AD,
ST,
ATMEL,
NS,
MAX,
ALTERA,
XILINX,
MURATA,
FSC,
MICROCHIP,
NXP,
TOS,
INFINEON,
CY,
SAMSUNG,
PANASONIC,
ON,
MIT,
VISHAY,
IR,
AVX,
INTEL,
MICREL,
LINEAR,
BROADCOM,
FREESCALE,
SEMIKRON,
SHARP,
ALLEGRO,
MOT,
ROHM,
THINKING,
NVIDIA,
EVERLIGHT,
TDK,
NEC,
PHI,
RENESAS,
MICRON,
AVAGO,
YAGEO,
QUALCOMM,
WURTH,
DALLAS,
SANYO,
NUVOTON,
AUO,
MPS,
INTERSIL,
HIT,
ISD/NUVOTON,
HARVATEK,
MIC,
KEMET,
SONY,
FUJITSU,
NIPPON CHEMI-CON,
TYCO,
SILICON,
POWER,
BB,
COILCRAFT,
BB/TI,
BOURNS,
LITTELFUSE,
AMD,
FUJI,
SEIKO,
IXYS,
IDT,
TRACO,
COOPER,
FTDI,
ERICSSOM,
QFP,
CREE,
MOLEX,
EPCOS,
BCD,
ISSI,
MICRON(ST),
CIRRUS,
HYNIX,
SST,
QFN,
WINBOND,
EPSON,
ATI,
PAM,
SIPEX,
SPANSION,
SAMXON,
RAMTRON,
TI ,
EUPEC,
SW,
TRIQUINT,
ZETEX,
BOSCH,
TI,
AD,
ST,
ATMEL,
NS,
MAX,
ALTERA,
XILINX,
MURATA,
FSC,
MICROCHIP,
NXP,
TOS,
INFINEON,
CY,
SAMSUNG,
PANASONIC,
ON,
VISHAY,
MIT,
IR,
AVX,
INTEL,
MICREL,
LINEAR,
BROADCOM,
FREESCALE,
SEMIKRON,
SHARP,
ALLEGRO,
MOT,
ROHM,
THINKING,
NVIDIA,
EVERLIGHT,
TDK,
NEC,
PHI,
RENESAS,
MICRON,
AVAGO,
YAGEO,
QUALCOMM,
WURTH,
DALLAS,
SANYO,
NUVOTON,
AUO,
MPS,
INTERSIL,
HIT,
ISD/NUVOTON,
HARVATEK,
MIC,
KEMET,
SONY,
FUJITSU,
NIPPON CHEMI-CON,
TYCO,
SILICON,
POWER,
BB,
BOURNS,
COILCRAFT,
BB/TI,
LITTELFUSE,
AMD,
FUJI,
SEIKO,
IXYS,
IDT,
TRACO,
COOPER,
FTDI,
ERICSSOM,
QFP,
CREE,
MOLEX,
EPCOS,
BCD,
ISSI,
MICRON(ST),
CIRRUS,
HYNIX,
SST,
QFN,
WINBOND

 
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Product Summary
SAMXON EGD477M0JE11TC
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: EGD477M0JE11TC.


Available from: United Sources Industrial Enterprises
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:HRBC, ADL5602ARKZ, SCK102R55, SCK150R78A, SCK304R0, SCK305R0, TVR10112, TVR20181, TPS61058DRCR, 2SK193, TA31136, GRM188R71C104KA01J, 450V680UF, CAT93C46S, TAJV476K035RNJ, FSBB20CH60C

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: EGD477M0JE11TC":

Post DatePart NumberBrandD/CDescQtyCompany
Tue Jan 22 01:29:00 UTC 2013EGD477M0JE11TC (from standard server 2)SAMXONECAP 470U 105C M 6.3V (6.3*11)P:5MM (ROHS)56074United Sources Industrial Enterprises
Tue Jan 22 01:29:00 UTC 2013EGD477M0JE11TC (from parts server 2)SAMXONECAP 470U 105C M 6.3V (6.3*11)P:5MM (ROHS)56074United Sources Industrial Enterprises
Tue Jan 22 01:29:00 UTC 2013EGD477M0JE11TC (from hkin.com 2)SAMXONECAP 470U 105C M 6.3V (6.3*11)P:5MM (ROHS)56074United Sources Industrial Enterprises
Tue Jan 22 01:29:00 UTC 2013EGD477M0JE11TC (from hkin.com 2)SAMXONECAP 470U 105C M 6.3V (6.3*11)P:5MM (ROHS)56074United Sources Industrial Enterprises

Last record FSBB20CH60C:

Post DatePart NumberBrandD/CDescQtyCompany

Last record TAJV476K035RNJ:

Post DatePart NumberBrandD/CDescQtyCompany

Last record CAT93C46S:

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vid:offerengine20130123 Part Number Prefix

EGD477M0JE11TC,EGD477M0JE11TC,Comments from user about EGD477M0JE11TC: In practice the dielectric between the plates passes a small amount of leakage current and also has an electric field strength limit, resulting in a breakdown voltage, while the conductors and leads introduce an undesired inductance and resistance. Semiconductor devices have replaced thermionic devices (vacuum tubes) in most applications. These include large and small household appliances, cars (and their accessory equipment units), car keys, tools and test instruments, toys, light switches/dimmers and electrical circuit breakers, smoke alarms, battery packs, and hi-fi audio/visual components (from DVD players to phonograph turntables.) Such products as cellular telephones, DVD video system and ATSC HDTV broadcast system fundamentally require consumer devices with powerful, low-cost, microprocessors. In case of large forward bias (current in the direction of the arrow), the diode exhibits a voltage drop due to its junction built-in voltage and internal resistance. High-pass filters ?attenuation of frequencies below their cut-off points. Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies, made possible by the low cost of production of integrated circuits. This may be done to limit the bandwidth to a narrow band centered around the intended operating frequency. The move to 64 bits by PowerPC processors had been intended since the processors' design in the early 90s and was not a major cause of incompatibility. Anything related to :EGD477M0JE11TC, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: EGD477M0JE11TC, search hkinventory: EGD477M0JE11TC, That is, input signal changes cause immediate changes in output; when several transparent latches follow each other, using the same clock signal, signals can propagate through all of them at once.[3] Each microarchitectural element is in turn represented by a schematic describing the interconnections of logic gates used to implement it. The size, latency, throughput and connectivity of memories within the system are also microarchitectural decisions. The size of data objects became larger; allowing more transistors on a chip allowed word sizes to increase from 4- and 8-bit words up to today's 64-bit words. Datasheet Dir, DataSheet Archive
Semiconductor devices are manufactured both as single discrete devices and as integrated circuits (ICs), which consist of a numberfrom a few (as low as two) to billionsof devices manufactured and interconnected on a single semiconductor substrate. The choice of the number of execution units, their latency and throughput is a central microarchitectural design task. During the 1960s, computer processors were constructed out of small and medium-scale ICs each containing from tens to a few hundred transistors. Normally, whether a conditional branch will be taken isn't known until late in the pipeline as conditional branches depend on results coming from a register. Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. Furthermore, much less material is used to construct a packaged IC die than to construct a discrete circuit. Compared to the MOSFET, the operating frequency of the IGBT is relatively low (few devices are rated over 50 kHz), mainly because of a so-called 'current-tail' problem during turn-off. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using electronic components.
any passive component and active component such as:1N4148, or 6502 Machines with different microarchitectures may have the same instruction set architecture, and thus be capable of executing the same programs. Indeed, it may be the desire to incorporate a passive filter that leads the designer to use the hybrid format. It is generally considered a "best practice" to write very idiomatic code for synthesis as results can be incorrect or suboptimal for non-standard constructs. This required IEEE standard 1164, which defined the 9-value logic types: scalar std_ulogic and its vector version std_ulogic_vector. For example driver circuit
EGD477M0JE11TC,EGD477M0JE11TC,Comments from user about EGD477M0JE11TC: Passivity, in most cases, can be used to demonstrate that passive circuits will be stable under specific criteria. Transistorized mechatronic circuits have replaced electromechanical devices in controlling appliances and machinery. However, its excellent performance in low voltage make it the device of choice (actually the only choice) for applications below 200 V. In reality one side or the other of the branch will be called much more often than the other. While different synthesis tools have different capabilities, there exists a common synthesizable subset of VHDL that defines what language constructs and idioms map into common hardware for many synthesis tools. Techniques such as branch prediction and speculative execution are used to lessen these branch penalties. A component that is not passive is called an active component. The main reason why semiconductor materials are so useful is that the behavior of a semiconductor can be easily manipulated by the addition of impurities, known as doping. Anything related to :EGD477M0JE11TC, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: EGD477M0JE11TCSee also: