Part: DAC7634EB

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Offer Index 15

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MICROCHIP,
MIT,
BB,
PHI,
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IXYS,
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AMD,
YAGEO,
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AMP,
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Product Summary
BB DAC7634EB
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: DAC7634EB.


Available from: Mingar Electronic (HK) Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:XC9572XLTQ100-10C, XCS40XL-4PQG208I, YBG1105W, YS1005U, Z0103NA 1AA2, ZUS32412, SIS671, LMC6482IMM, MG75Q2YS1, IR21771STRPBF, 74HCT221DB, AT49LH002-33JC, AT90S4414-4PC, B30643-D1040-Q520, IRLZ24N, K4D551638F-TC40

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: DAC7634EB":

Post DatePart NumberBrandD/CDescQtyCompany
Sun Jan 15 04:15:00 UTC 2012DAC7634EB (from hkin.com)BB07+SSOP481242Mingar Electronic (HK) Limited
Sun Jan 15 04:15:00 UTC 2012DAC7634EB (from standard server 2)BB07+SSOP481242Mingar Electronic (HK) Limited
Sun Jan 15 04:15:00 UTC 2012DAC7634EB (from parts server 2)BB07+SSOP481242Mingar Electronic (HK) Limited
Sun Jan 15 04:15:00 UTC 2012DAC7634EB (from hkin.com 2)BB07+SSOP481242Mingar Electronic (HK) Limited
Sun Jan 15 04:15:00 UTC 2012DAC7634EB (from hkin.com 2)BB07+SSOP481242Mingar Electronic (HK) Limited

Last record K4D551638F-TC40:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Jan 13 02:00:00 UTC 2012K4D551638F-TC40 (from hkin.com)TSOP2010+SAMSUNG8943Huaerda Technology Co.,Limited

Last record IRLZ24N:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Dec 28 01:40:00 UTC 2011IRLZ24N (from hkin.com)IR09+SOT-2635000Hongkong Hungyick Electronics Co., Limited

Last record B30643-D1040-Q520:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Jan 3 07:40:00 UTC 2012B30643-D1040-Q520 (from hkin.com)EPCOS06+12000Sanhui (HK) Electronics Co., Limited

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vid:offerengine20120117

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any passive component and active component such as:Diode, Current conduction in a semiconductor occurs via mobile or "free" electrons and holes, collectively known as charge carriers. This problem is caused by the slow decay of the conduction current during turn-off resulting from slow recombination of large number of carriers, which flood the thick 'drift' region of the IGBT during conduction. The integrated circuit's mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. The choice of the number of execution units, their latency and throughput is a central microarchitectural design task. For example driver circuit
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