Part: BF257

Index Files

Offer Index 15

MIT,
IR,
AVX,
INTEL,
MICREL,
LINEAR,
BROADCOM,
FREESCALE,
SEMIKRON,
SHARP,
ALLEGRO,
MOT,
ROHM,
THINKING,
NVIDIA,
EVERLIGHT,
TDK,
NEC,
PHI,
RENESAS,
MICRON,
AVAGO,
YAGEO,
QUALCOMM,
WURTH,
DALLAS,
SANYO,
NUVOTON,
AUO,
MPS,
INTERSIL,
HIT,
ISD/NUVOTON,
HARVATEK,
MIC,
KEMET,
SONY,
FUJITSU,
NIPPON CHEMI-CON,
TYCO,
SILICON,
POWER,
BB,
BOURNS,
COILCRAFT,
BB/TI,
LITTELFUSE,
AMD,
FUJI,
SEIKO,
IXYS,
IDT,
TRACO,
COOPER,
FTDI,
ERICSSOM,
QFP,
CREE,
MOLEX,
EPCOS,
BCD,
ISSI,
MICRON(ST),
CIRRUS,
HYNIX,
SST,
QFN,
WINBOND,
EPSON,
ATI,
PAM,
SIPEX,
SPANSION,
SAMXON,
RAMTRON,
TI ,
EUPEC,
SW,
TRIQUINT,
ZETEX,
BOSCH,
TI,
AD,
ATMEL,
ST,
NS,
MAX,
ALTERA,
XILINX,
NXP,
MURATA,
FSC,
MICROCHIP,
TOS,
INFINEON,
SAMSUNG,
CY,
PANASONIC,
ON,
VISHAY,
MIT,
BROADCOM,
AVX,
IR,
INTEL,
MICREL,
LINEAR,
FREESCALE,
SEMIKRON,
SHARP,
ALLEGRO,
ROHM,
MOT,
THINKING,
NVIDIA,
EVERLIGHT,
TDK,
NEC,
PHI,
RENESAS,
MICRON,
AVAGO,
YAGEO,
INTERSIL,
QUALCOMM,
WURTH,
SANYO,
DALLAS,
NUVOTON,
AUO,
FUJITSU,
MPS,
HIT,
ISD/NUVOTON,
MIC,
HARVATEK,
POWER,
KEMET,
SONY,
TYCO,
SILICON,
NIPPON CHEMI-CON,
BB,
COILCRAFT,
BB/TI,
BOURNS,
AMD,
LITTELFUSE,
FUJI,
SEIKO,
IXYS,
IDT,
TRACO,
COOPER,
FTDI,
ERICSSOM,
MOLEX,
QFP,
CREE,
EPCOS,
BCD,
CIRRUS,
ISSI,
MICRON(ST),
SAMXON,
HYNIX,
SST,
QFN,
EPSON,
WINBOND,
ATI,
PAM,
SPANSION,
SIPEX,
EUPEC,
RAMTRON,
TI ,
SW,
TRIQUINT,
BOSCH,
DIODES,
TI,
AD,
ATMEL,
ST,
NS,
MAX,
XILINX,
ALTERA,
NXP,
MURATA,
FSC,
MICROCHIP,
TOS,
SAMSUNG,
INFINEON,
CY,
ON,
PANASONIC,
VISHAY,
MIT,
BROADCOM,
AVX,
IR,
INTEL,
MICREL,
LINEAR,
SANYO,
FREESCALE,
SEMIKRON,
SHARP,
ALLEGRO,
MOT,
ROHM,
THINKING,
NVIDIA,
TDK,
EVERLIGHT,
NEC,
PHI,
RENESAS,
COILCRAFT,
MICRON,
YAGEO,
AVAGO,
INTERSIL,
DALLAS,
MIC,
QUALCOMM,
WURTH,
NUVOTON,
AUO,
FUJITSU,
MPS,
HIT,
ISD/NUVOTON,
HARVATEK,
POWER,
FTDI,
SUMIDA,
BB,
KEMET,
SONY,
TYCO,
SILICON,
AMD,
NIPPON CHEMI-CON,
BOURNS,
BB/TI,
LITTELFUSE,
FUJI,
IXYS,
SEIKO,
IDT,
TRACO,
COOPER,
ERICSSOM,
MOLEX,
SST,
QFP,
CREE,
EPCOS,
ISSI,
REALTEK,
BCD,
CIRRUS,
MICRON(ST),
HYNIX,
SAMXON,
QFN,
EPSON,
WINBOND,
SPANSION,
ATI,
PAM,
SIPEX,
RAMTRON,
EUPEC,
TI ,
DIODES,
SW,
TI,
AD,
ATMEL,
ST,
NS,
MAX,
MURATA,
XILINX,
ALTERA,
NXP,
FSC,
MICROCHIP,
TOS,
SAMSUNG,
INFINEON,
CY,
VISHAY,
ON,
PANASONIC,
MIT,
BROADCOM,
AVX,
IR,
INTEL,
MICREL,
LINEAR,
SANYO,
FREESCALE,
SEMIKRON,
SHARP,
ALLEGRO,
MOT,
ROHM,
THINKING,
TDK,
EVERLIGHT,
NVIDIA,
NEC,
PHI,
RENESAS,
COILCRAFT,
MICRON,
AVAGO,
YAGEO,
INTERSIL,
DALLAS,
MIC,
QUALCOMM,
WURTH,
NUVOTON,
AUO,
FUJITSU,
MPS,
HIT,
ISD/NUVOTON,
HARVATEK,
POWER,
FTDI,
SUMIDA,
BB,
KEMET,
SONY,
EPCOS,
TYCO,
SILICON,
AMD,
NIPPON CHEMI-CON,
BOURNS,
BB/TI,
LITTELFUSE,
FUJI,
IXYS,
SEIKO,
IDT,
TRACO,
COOPER,
ERICSSOM,
MOLEX,
SST,
CREE,
QFP,
ISSI,
REALTEK,
BCD,
CIRRUS,
MICRON(ST),
HYNIX,
SAMXON,
DARFON,
EPSON,
QFN,
WINBOND,
SPANSION,
ATI,
PAM,
SIPEX,
RAMTRON,
EUPEC,
TI 

 
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Product Summary
PHILIPS BF257
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: BF257.


Available from: BeiJing Jietuozijing Science and Technology Co., Ltd.
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:100439116, 74HCT595D, ERB81-004, ESVD1D476M, F13005, PDTA143ZE, EPM7128AEFC100-7, PEB43650TSV21, SP705CU, A42HE, 80-23UWC, MSS1038-105KTC, MSS1038-154KLB, MSS1048-154KTB, AS339MTR-E1, BF233

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: BF257":

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 23 02:00:00 UTC 2013BF257 (from standard server 2)PHILIPS05+CAN668BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257 (from parts server 2)PHILIPS05+CAN668BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257 (from hkin.com 2)PHILIPS05+CAN668BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257 (from hkin.com 2)PHILIPS05+CAN668BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257A (from standard server 2)PHILIPS05+CAN560BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257A (from parts server 2)PHILIPS05+CAN560BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257A (from hkin.com 2)PHILIPS05+CAN560BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257A (from hkin.com 2)PHILIPS05+CAN560BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257B (from standard server 2)PHILIPS05+CAN689BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257B (from parts server 2)PHILIPS05+CAN689BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257B (from hkin.com 2)PHILIPS05+CAN689BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257B (from hkin.com 2)PHILIPS05+CAN689BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257C (from standard server 2)PHILIPS05+CAN667BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257C (from parts server 2)PHILIPS05+CAN667BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257C (from hkin.com 2)PHILIPS05+CAN667BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257C (from hkin.com 2)PHILIPS05+CAN667BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257D (from standard server 2)PHILIPS05+CAN557BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257D (from parts server 2)PHILIPS05+CAN557BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257D (from hkin.com 2)PHILIPS05+CAN557BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257D (from hkin.com 2)PHILIPS05+CAN557BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257G (from standard server 2)PHILIPS05+CAN625BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257G (from parts server 2)PHILIPS05+CAN625BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257G (from hkin.com 2)PHILIPS05+CAN625BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257G (from hkin.com 2)PHILIPS05+CAN625BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257N (from standard server 2)PHILIPS05+CAN560BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257N (from parts server 2)PHILIPS05+CAN560BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257N (from hkin.com 2)PHILIPS05+CAN560BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257N (from hkin.com 2)PHILIPS05+CAN560BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257S (from standard server 2)PHILIPS05+CAN689BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257S (from parts server 2)PHILIPS05+CAN689BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257S (from hkin.com 2)PHILIPS05+CAN689BeiJing Jietuozijing Science and Technology Co., Ltd.
Wed Jan 23 02:00:00 UTC 2013BF257S (from hkin.com 2)PHILIPS05+CAN689BeiJing Jietuozijing Science and Technology Co., Ltd.

Last record BF233:

Post DatePart NumberBrandD/CDescQtyCompany

Last record AS339MTR-E1:

Post DatePart NumberBrandD/CDescQtyCompany

Last record MSS1048-154KTB:

Post DatePart NumberBrandD/CDescQtyCompany

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vid:offerengine20130124 Part Number Prefix

BF257,BF257,Comments from user about BF257: This problem is caused by the slow decay of the conduction current during turn-off resulting from slow recombination of large number of carriers, which flood the thick 'drift' region of the IGBT during conduction. Generally, in datasheets, turn-off energy is mentioned as a measured parameter and one has to multiply that number with the switching frequency of the intended application to estimate the turn-off loss. Sun Microsystems has released the Niagara and Niagara 2 chips, both of which feature an eight-core design. This includes decisions on the performance-level and connectivity of these peripherals. An LED is often small in area (less than 1 mm2), and integrated optical components may be used to shape its radiation pattern. By paralleling several devices, it is possible to increase the current rating of a switch. In the case of narrow-band bandpass filters, the Q determines the -3dB bandwidth but also the degree of rejection of frequencies far removed from the center frequency; if these two requirements are in conflict then a staggered-tuning bandpass filter may be needed. With the transition to the LGA1366 and LGA1156 socket and the Intel i7 and i5 chips, quad core is now considered mainstream, but with the release of the i7-980x, six core processors are now well within reach. Anything related to :BF257, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: BF257, search hkinventory: BF257, The logic section retrieves instruction operation codes from memory, and iniates whatever sequence of operations of the ALU required to carry out the instruction. Passivity, in most cases, can be used to demonstrate that passive circuits will be stable under specific criteria. Similarly, an overdriven transistor amplifier can take on the characteristics of a controlled switch having essentially two levels of output. A microprocessor control program can be easily tailored to different needs of a product line, allowing upgrades in performance with minimal redesign of the product. Datasheet Dir, DataSheet Archive
Competing projects would result in the IBM POWER and Sun SPARC architectures. The main reason why semiconductor materials are so useful is that the behavior of a semiconductor can be easily manipulated by the addition of impurities, known as doping. The MOSFET is particularly suited to this configuration because its positive thermal coefficient of resistance tends to balance current between individual devices. Compared to the MOSFET, the operating frequency of the IGBT is relatively low (few devices are rated over 50 kHz), mainly because of a so-called 'current-tail' problem during turn-off. Additional features were added to the processor architecture; more on-chip registers speeded up programs, and complex instructions could be used to make more compact programs. Introduced as a practical electronic component in 1962, early LEDs emitted low-intensity red light, but modern versions are available across the visible, ultraviolet and infrared wavelengths, with very high brightness. Modern designs have rather complex statistical prediction systems, which watch the results of past branches to predict the future with greater accuracy. Current conduction in a semiconductor occurs via mobile or "free" electrons and holes, collectively known as charge carriers.
any passive component and active component such as:1N4148, or 6502 This problem is caused by the slow decay of the conduction current during turn-off resulting from slow recombination of large number of carriers, which flood the thick 'drift' region of the IGBT during conduction. Generally, in datasheets, turn-off energy is mentioned as a measured parameter and one has to multiply that number with the switching frequency of the intended application to estimate the turn-off loss. General-purpose microprocessors in personal computers are used for computation, text editing, multimedia display, and communication over the Internet. These diagrams generally separate the datapath (where data is placed) and the control path (which can be said to steer the data). For example driver circuit
BF257,BF257,Comments from user about BF257: Single-chip processors increase reliability as there were many fewer electrical connections to fail. For example, most constructs that explicitly deal with timing such as wait for 10 ns; are not synthesizable despite being valid for simulation. This problem is caused by the slow decay of the conduction current during turn-off resulting from slow recombination of large number of carriers, which flood the thick 'drift' region of the IGBT during conduction. The move to 64 bits by PowerPC processors had been intended since the processors' design in the early 90s and was not a major cause of incompatibility. In electronics, a flip-flop or latch is a circuit that has two stable states and can be used to store state information. They use electronic conduction in the solid state as opposed to the gaseous state or thermionic emission in a high vacuum. With the transition to the LGA1366 and LGA1156 socket and the Intel i7 and i5 chips, quad core is now considered mainstream, but with the release of the i7-980x, six core processors are now well within reach. The IGBT is a recent component, so its performance improves regularly as technology evolves. Anything related to :BF257, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: BF257See also: