Part: MIC5219-3.0BML

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Previous Parts:MF10CCJ,MG150J2YS21,MG150Q2YS9,MG200J2YS21,MG200Q1US1,MG360V1US42,MG400J1US45,MG50J6ES40,MHV2805S,MHW8185,MI-7611-5,MIC2025-2BM,MIC2287-24BML,MIC2506BM,MIC38C42BN,MIC5209-1.8BM

The followings are offers provided by our member in Electronic Components Offer site about the following parts: MIC5219-3.0BML":

Post DatePart NumberBrandD/CDescQtyCompany
Fri Sep 29 02:23:00 UTC 2006MIC5219-3.0BML (from hkin.com)Micrel05+QFN10000Kaixi International (H.K.) Co.,Limited
Fri Sep 29 02:23:00 UTC 2006MIC5219-3.0BML (from standard server 2)Micrel05+QFN10000Kaixi International (H.K.) Co.,Limited
Fri Sep 29 02:23:00 UTC 2006MIC5219-3.0BML (from parts server 2)Micrel05+QFN10000Kaixi International (H.K.) Co.,Limited
Fri Sep 29 02:23:00 UTC 2006MIC5219-3.0BML (from hkin.com 2)Micrel05+QFN10000Kaixi International (H.K.) Co.,Limited
Fri Sep 29 02:23:00 UTC 2006MIC5219-3.0BML (from hkin.com 2)Micrel05+QFN10000Kaixi International (H.K.) Co.,Limited
Tue Sep 12 08:05:00 UTC 2006MIC5219-3.0BML(G30) (from hkin.com)Micrel2005QFN24133Wel Teck (HongKong) Electronics Co.
Tue Sep 12 08:05:00 UTC 2006MIC5219-3.0BML(G30) (from standard server 2)Micrel2005QFN24133Wel Teck (HongKong) Electronics Co.
Tue Sep 12 08:05:00 UTC 2006MIC5219-3.0BML(G30) (from parts server 2)Micrel2005QFN24133Wel Teck (HongKong) Electronics Co.
Tue Sep 12 08:05:00 UTC 2006MIC5219-3.0BML(G30) (from hkin.com 2)Micrel2005QFN24133Wel Teck (HongKong) Electronics Co.
Tue Sep 12 08:05:00 UTC 2006MIC5219-3.0BML(G30) (from hkin.com 2)Micrel2005QFN24133Wel Teck (HongKong) Electronics Co.

Last record MIC5209-1.8BM:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Sep 30 09:36:00 UTC 2006MIC5209-1.8BM (from hkin.com)0445+SOIC-08LMIC25ARIC ELECTRONICS TECHNOLOGY (HK) CO., LIMITED

Last record MIC38C42BN:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Sep 26 03:28:00 UTC 2006MIC38C42BN (from hkin.com)MICRON96DIP30Hong Kong KeJie Electronic industry Co.,Ltd

Last record MIC2506BM:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Sep 29 02:22:00 UTC 2006MIC2506BM (from hkin.com)Micrel03+SOP-84000Kaixi International (H.K.) Co.,Limited
Fri Sep 29 06:22:00 UTC 2006MIC2506BM (from hkin.com)MIC99SOP1770REIZ TECHNOLOGY (HK) LIMITED
Thu Sep 14 05:37:00 UTC 2006MIC2506BM (from hkin.com)MICTEL994680CHIU YANG ELECTRONICS TRADING LIMITED

If you want to find more about MIC5219-3.0BML, please visit us on HKin


vid:offerengine20111021

MIC5219-3.0BML,MIC5219-3.0BML,Comments from user about MIC5219-3.0BML: A power diode or MOSFET operates on similar principles to its low-power counterpart, but is able to carry a larger amount of current and typically is able to support a larger reverse-bias voltage in the off-state.Different temperature coefficients are specified for various applications, including nuclear, electrical and magnetic. The integrated circuit's mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. Many FPGA vendors have free (or inexpensive) tools to synthesize VHDL for use with their chips, where ASIC tools are often very expensive. Light-emitting diodes are used in applications as diverse as replacements for aviation lighting, automotive lighting (particularly brake lamps, turn signals and indicators) as well as in traffic signals. A digital signal processor (DSP) is specialized for signal processing. Common-emitter amplifiers are also used in radio frequency circuits, for example to amplify faint signals received by an antenna. The range of desired frequencies (the passband) together with the shape of the frequency response. Anything related to :MIC5219-3.0BML, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: MIC5219-3.0BML, search hkinventory: MIC5219-3.0BML, The MOSFET is the most used semiconductor device today. While consumer electronics continues in its trend of convergence, combining elements of many products, consumers face different decisions when purchasing. It is relatively easy for an inexperienced developer to produce code that simulates successfully but that cannot be synthesized into a real device, or is too large to be practical. Produced at Fairchild Semiconductor, it was made of silicon, whereas Kilby's chip was made of germanium. Datasheet Dir, DataSheet Archive
A microprocessor is a general purpose system. Passivity is a property of engineering systems, used in a variety of engineering disciplines, but most commonly found in analog electronics and control systems. The circuit can be made to change state by signals applied to one or more control inputs and will have one or two outputs. Techniques such as branch prediction and speculative execution are used to lessen these branch penalties. Most digital circuits use a binary system with two voltage levels labeled "0" and "1". In 2005, the first personal computer dual-core processors were announced. In principle, a single microarchitecture could execute several different ISAs with only minor changes to the microcode. An integrated circuit or monolithic integrated circuit (also referred to as IC, chip, and microchip) is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material.
any passive component and active component such as:Diode, Compared to the MOSFET, the operating frequency of the IGBT is relatively low (few devices are rated over 50 kHz), mainly because of a so-called 'current-tail' problem during turn-off. MOSFET is an IC which is semiconductor device. In the reverse bias region for a normal P-N rectifier diode, the current through the device is very low (in the gA range). Be aware that some high-pass filter topologies present the input with almost a short circuit to high frequencies. For example driver circuit
MIC5219-3.0BML,MIC5219-3.0BML,Comments from user about MIC5219-3.0BML: As microprocessor designs get faster, the cost of manufacturing a chip (with smaller components built on a semiconductor chip the same size) generally stays the same.Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. Power semiconductor devices are semiconductor devices used as switches or rectifiers in power electronic circuits (switch mode power supplies for example). Power semiconductor devices first appeared in 1952 with the introduction of the power diode by R. The size, latency, throughput and connectivity of memories within the system are also microarchitectural decisions. System-level design decisions such as whether or not to include peripherals, such as memory controllers, can be considered part of the microarchitectural design process. Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies, made possible by the low cost of production of integrated circuits.hn, which are optimized for distribution of HD content between CE devices in a home. Anything related to :MIC5219-3.0BML, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: MIC5219-3.0BMLSee also: