Part: UCC384DP-12

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Offer Index 12

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Product Summary
BB/TI UCC384DP-12
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: UCC384DP-12.


Available from: Chang Yang Electronics International Co., Ltd.
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:ESME350ELL472MM40S, SN54ALS645AJ, TC74VHC574, TLC16C752B, TMS320DM640AGDK, V29C51000T-90J, VND3NV04TR-E, X28C64P-12, 06N03LZ, TA78L12F, 28025271, MUN5111T1G, NTF6P02T3, LT1120AI, EL7564CMZ, BCM5318KQM

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: UCC384DP-12":

Post DatePart NumberBrandD/CDescQtyCompany
Fri Jan 13 04:52:00 UTC 2012UCC384DP-12 (from hkin.com)BB/TISOP8174Chang Yang Electronics International Co., Ltd.
Fri Jan 13 04:52:00 UTC 2012UCC384DP-12 (from standard server 2)BB/TISOP8174Chang Yang Electronics International Co., Ltd.
Fri Jan 13 04:52:00 UTC 2012UCC384DP-12 (from parts server 2)BB/TISOP8174Chang Yang Electronics International Co., Ltd.
Fri Jan 13 04:52:00 UTC 2012UCC384DP-12 (from hkin.com 2)BB/TISOP8174Chang Yang Electronics International Co., Ltd.
Fri Jan 13 04:52:00 UTC 2012UCC384DP-12 (from hkin.com 2)BB/TISOP8174Chang Yang Electronics International Co., Ltd.

Last record BCM5318KQM:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Jan 13 02:51:00 UTC 2012BCM5318KQM (from hkin.com)BCMQFP4Starlight(HK) Electronics limited

Last record EL7564CMZ:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 11 07:28:00 UTC 2012EL7564CMZ (from hkin.com)INTERSI 10+1000Kehai Weiye International Electronics Limited

Last record LT1120AI:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Jan 17 01:30:00 UTC 2012LT1120AI (from hkin.com)LT09+/DCSOP-87300Shenzhen HuaJun Commmunication Tech Co., Ltd

If you want to find more about UCC384DP-12, please visit us on HKin


vid:offerengine20120117

UCC384DP-12,UCC384DP-12,Comments from user about UCC384DP-12: [citation needed] The R3000 made the design truly practical, and the R4000 introduced the world's first commercially available 64-bit RISC microprocessor. The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to precisely control the location and concentration of p- and n-type dopants. One disadvantage of the thyristor for switching circuits is that once it is 'latched-on' in the conducting state it cannot be turned off by external control. IEEE standard 1076. However, some systems use the reverse definition ("0" is "High") or are current based. Passive filters are uncommon in monolithic integrated circuit design, where active devices are inexpensive compared to resistors and capacitors, and inductors are prohibitively expensive. Sun Microsystems has released the Niagara and Niagara 2 chips, both of which feature an eight-core design. VHDL has file input and output capabilities, and can be used as a general-purpose language for text processing, but files are more commonly used by a simulation testbench for stimulus or verification data. Anything related to :UCC384DP-12, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: UCC384DP-12, search hkinventory: UCC384DP-12, As microprocessor designs get faster, the cost of manufacturing a chip (with smaller components built on a semiconductor chip the same size) generally stays the same. However, most designers leave this job to the simulator. The pipelined datapath is the most commonly used datapath design in microarchitecture today. As it is a physical limit, no improvement is expected from silicon MOSFETs concerning their maximum voltage ratings. Datasheet Dir, DataSheet Archive
The internal arrangement of a microprocessor varies depending on the age of the design and the intended purposes of the processor. This indicates the variety of filter (see above) and the center or corner frequencies. Synthesis is a process where a VHDL is compiled and mapped into an implementation technology such as an FPGA or an ASIC. Single-chip processors increase reliability as there were many fewer electrical connections to fail. This is driven by gains in manufacturing efficiency and automation, lower labor costs as manufacturing has moved to lower-wage countries, and improvements in semiconductor design. Current conduction in a semiconductor occurs via mobile or "free" electrons and holes, collectively known as charge carriers. voltage amplifiers or buffer amplifiers. Used without qualifier, the term passive is ambiguous.
any passive component and active component such as:Diode, Note that this only works if only one of the above definitions of passivity is used ?if components from the two are mixed, the systems may be unstable under any criteria. Doping a semiconductor such as silicon with a small amount of impurity atoms, such as phosphorus or boron, greatly increases the number of free electrons or holes within the semiconductor. Both versions can run 32-bit legacy applications without any performance penalty as well as new 64-bit software. The first bipolar transistors devices with substantial power handling capabilities were introduced in the 1960s. For example driver circuit
UCC384DP-12,UCC384DP-12,Comments from user about UCC384DP-12: The amount of the voltage drop depends on the semiconductor material and the doping concentrations. The integrated circuit's mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. In response, microprocessor manufacturers look for other ways to improve performance in order to hold on to the momentum of constant upgrades in the market. Semiconductor devices are manufactured both as single discrete devices and as integrated circuits (ICs), which consist of a numberfrom a few (as low as two) to billionsof devices manufactured and interconnected on a single semiconductor substrate. A light-emitting diode (LED) is a semiconductor light source. The amount of the voltage drop depends on the semiconductor material and the doping concentrations. The desire for High definition (HD) content has led the industry to develop a number of technologies, such as WirelessHD or ITU-T G. The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to precisely control the location and concentration of p- and n-type dopants. Anything related to :UCC384DP-12, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: UCC384DP-12See also: